Latest news with #CircuitBoard
Malaysian Reserve
a day ago
- Business
- Malaysian Reserve
Polymatech Electronics Limited Announces Completion of PCB Manufacturing Facility in Europe
CHENNAI, India, Aug. 14, 2025 /PRNewswire/ — Polymatech Electronics Limited is thrilled to announce the successful commissioning of its state-of-the-art Printed Circuit Board (PCB) manufacturing facility in Estonia, Europe. This milestone represents a significant advancement in the company's strategic expansion across the European market. The new facility features around 10,000-square-foot cleanroom equipped with cutting-edge machinery, capable of producing up to 50,000 square meters of multi-layer High-Density Interconnect (HDI) PCBs annually. Leveraging advanced European technology, the facility meets the stringent industry standards demanded by premium mobile phone manufacturers and critical sectors, including defense, aerospace, automotive electronics, semiconductor manufacturing, telecommunications infrastructure, industrial electronics, and security. 'Our European-made PCBs, crafted with European expertise and adhering to the highest quality standards, are in high demand across various high-end applications,' said Mr. Eswara Rao Nandam, CEO Polymatech Electronics Limited. 'This facility underscores our commitment to innovation, quality, and precision, positioning us to deliver tailored, engineered solutions to some of the most demanding industries.' This development marks a pivotal step in transforming Polymatech into a comprehensive solutions provider, evolving from a component supplier into a product-centric organization. The Estonia facility underscores Polymatech's evolution from a component supplier to a product-centric solutions provider. 'Since incorporating the Company on November 18, 2024, and commencing operations on August 8, 2025, this facility exemplifies our dedication to quality, reliability, and customer-centric innovation,' said Tarja Rapala, Director of Polymatech Electronics and Head of PCB Business. 'With meticulously maintained equipment and a highly skilled team, we are poised to deliver rapid, sustainable PCB solutions and foster strategic partnerships across Europe.' Dr. Allen Nejah, Chief Innovation Officer of Polymatech Electronics Limited, added, 'This facility is a remarkable achievement that enhances our ability to deliver sophisticated PCB solutions for Europe's technological and defense sectors. PCB is the mother for electronic equipment and this facility enables Polymatech transformation from component manufacturer to product manufacturer, this will be a paradigm shift in the Polymatech's business profile and help us to release products faster in the market. This facility portfolio includes high-speed PCBs, advanced HDI PCBs, high-frequency PCBs, and multi-layer configurations—up to 48 layers—designed for high-end electronics. Mr. Urmas Aruoja, CEO, stated, 'We deliver PCBs in as little as 24 hours. Our flexible PCBs are integral to smartphones, notebooks, smart wearable devices, and many other products. Our Substrate-Like PCBs (SLPs), HDI PCBs, Rigid-Flex PCBs (RPCBs), Integrated Circuit Substrates (ICS), RF PCBs, and high-density modules are designed for advanced applications. Our HDI PCBs feature high-density attributes, including laser microvias, sequential lamination structures, fine lines, and high-performance thin materials, enabling greater functionality per unit area. Advanced HDI PCBs incorporate multiple layers of copper-filled stacked microvias, providing complex interconnections for large pin-count, fine-pitch, and high-speed chips in cutting-edge technology products.' About Polymatech Electronics Limited Polymatech Electronics Limited is a global leader in advanced electronics manufacturing, specializing in semiconductor solutions—from ingots to end products. Committed to innovation, the company delivers transformative technologies every six months, enhancing everyday life by integrating cutting-edge solutions across consumer and industrial applications. Polymatech is a key player in the global technology market, holding significant market share in semiconductors, modules, and electronic components for industries including retail, finance, agriculture, and healthcare. With a vision to become a comprehensive end-to-end solutions provider, Polymatech continues to drive excellence and innovation worldwide. Photo – – View original content:
Time Business News
23-07-2025
- Time Business News
Key Challenges and Solutions in Smart Home PCBA Design
Smart home technology has changed the way people live for many years by offering security and energy efficiency to homeowners. It enhances convenience and comfort levels by allowing them to control their smart home devices remotely. Behind the efficient handling and working of these smart home devices, the main character is the efficiently working Printed Circuit Board Assembly (PCBA). PCB is a foundational component that allows automation, functionality, and connectivity of various IoT devices in a smart home system. Smart home PCBA refers to Printed Circuit Board Assembly. It is a special type of PCB designed to support and control various smart home devices and systems. However, designing high-reliability PCBAs for smart home electronics comes with a unique set of challenges. We will explore these challenges here and help you with practical solutions to address these issues efficiently. We are going to discuss the 6 key challenges that come in the process of designing smart home PCB. When it comes to smart home solutions, consumers demand smart and compact IoT devices and appliances, which presents the biggest challenge for designers: integrating complex functionalities into increasingly smaller PCBAs. To reduce physical structure, manufacturers need to make PCB circuits with small components, placing them carefully by using advanced design techniques to maintain performance without compromising space. HDI is a High-Density Interconnect technology that is necessary for achieving miniaturization. In the smart home PCB, smaller vias and finer lines are used to place all needed components irrespective of the circuit board's small size. This is also possible with the help of SoC technology, which allows more functionalities integration on a single chip and eliminates the need for more discrete components. Modern IoT devices need compact and powerful circuit designs, which is possible with the help of a multilayer PCB. In a multilayer PCB, the multiple circuit layers are stacked vertically, increasing complexity management and allowing more features in a small space. These multilayer PCBs fulfill all the functional needs of modern devices without compromising on reliability. Energy efficiency is one of the goals behind developing smart home devices. So, the next challenge for PCBA designers is the careful distribution of power and ensuing reduced energy consumption for IoT devices. In the case of poor PCBA design, the results are unreliable operation, higher power consumption with excessive heat generation, and noise problems. Power management challenges can be addressed through the components that are specifically designed to operate on low power so that they extend the runtime of the device. Sleep modes and duty cycling enable the device to use minimum energy when not in use without compromising essential functionalities. Kinetic-to-electrical energy conversion and solar power are particularly used as an alternative power source when devices are operating in remote or off-grid locations. This specific approach of increasing the power of the device in accordance with sustainability objectives minimizes the use of conventional power sources. Signal integrity and EMI are the next challenges for PCBA designers and manufacturers. The designer has to make sure that signals travel through the PCB without distortion or degradation to achieve signal integrity. If EMI is not properly managed, it can cause unwanted noise and interference between signals, which leads to data corruption, data loss, misinterpretation of commands, connectivity issues, and device malfunction. To maintain signal integrity, Impedance matching techniques are used by PCBA designers to check and control trace routing, which minimizes signal reflections for high-integrity data. They also add ground planes and dedicated power to enhance circuit stability, as both isolate signals and reduce electromagnetic interference risks. Moreover, filtering components like inductors and capacitors also play an important role in keeping voltage levels stable and minimizing transient disturbances. Overall, these strategies are successful methods for optimizing performance and making smart home devices resilient enough to operate in different environments. Compact designs are achieved to fulfill the demand for miniaturization, which causes the problem of excessive heat generation and concentration. If PCBA manufacturers and designers fail in thermal management, excessive heat generation can degrade the performance and reliability of devices and eventually shorten their lifespan. The PCBA designers use simulation tools in the early design process to help make realistic predictions. These tools help them optimize layouts and actively control all thermal problems for better heat distribution. Next are the device enclosures, which are engineered to work as passive heat sinks. These enclosures further help in thermal management while keeping the size the same. The smart home ecosystem needs to be cohesive so there is a need for smooth communication between various devices. This easy communication with efficient operation of devices is possible by using various protocols like Wi-Fi, Bluetooth, and Zigbee. For designers, the next challenge is to achieve compatibility and interoperability so users enjoy a seamless experience. To improve connectivity and interoperability in smart home PCB design, using flexible PCBs allows devices to support multiple communication protocols while saving space. The designer needs to properly place the antenna, which reduces interference and allows strong and stable signals. IoT devices process and store a large amount of sensitive data over various networks, this sensitive data needs complete privacy and security. High-security measures are deeply embedded in these printed circuit designs that protect against unauthorized access and breaches. Hardware-based encryption method, along with secure boot processes, guarantees the privacy of both data storage and transmission. Tamper detection capabilities provide physical securities that send notifications to users' mobile devices when some unauthorized access attempts to use the system. In this way, the manufacturers make sure that users' information is protected by all means. The PCBA designers face many challenges regarding size, power, and operation management while designing the smart home PCBA. However, each issue comes with an advanced solution that not only solves the problem for the PCB industry but also overall enhances the efficiency of the circuit board and smart devices. TIME BUSINESS NEWS
Mint
10-07-2025
- Business
- Mint
Syrma SGS hits 52-week high on plans to build India's largest multi-layer PCB facility; stock up 11% in 2 days
Shares of Syrma SGS Technology surged over 5 percent on Thursday, July 10, hitting its 52-week high of ₹ 682.70 amid investor optimism following the company's confirmation of its ambitious plans to set up India's largest multi-layer Printed Circuit Board (PCB) and Copper Clad Laminate (CCL) manufacturing facility. This marks the second straight day of gains for the stock, which has rallied over 11 percent in just two sessions. The development reinforces Syrma SGS's position in India's electronic manufacturing ecosystem as it aligns with the government's 'Make in India' push and self-reliance in critical technology components. The Chennai-based electronics manufacturing firm is set to invest approximately ₹ 1,800 crore in developing the proposed facility at Naidupeta in Andhra Pradesh. The project is being planned in partnership with South Korea's Shinhyup Electronics, which will provide technological and marketing support. Once operational, the facility is expected to significantly boost India's capability in manufacturing high-end electronic components domestically. In a regulatory filing, Syrma SGS shared a detailed sequence of negotiations and milestones leading up to the project's announcement. The process began on December 24, 2024, with the signing of a Non-Disclosure Agreement (NDA) with Shinhyup Electronics. This was followed by a series of structured communications in January 2025, including a planned visit of Shinhyup's team to Chennai and the signing of a Non-Binding Memorandum of Understanding (MoU) on January 16. The following months witnessed deeper collaboration. From January through February, both parties engaged in business plan preparation. On March 17, Syrma SGS officials traveled to Korea to visit Shinhyup's plant, assessing the technology and operations. In March and April, the teams continued working on financial models and costing, culminating in the signing of a Non-Binding Term Sheet in Chennai on April 29. In parallel, Syrma SGS undertook regulatory steps to align the project with the Government of India's Electronic Component Manufacturing Scheme (ECMS). An NDA was signed with Ernst & Young on April 9 to facilitate filings and strategy. By May 5, the company had registered with the ECMS portal, and on May 22, it officially submitted its application under the Multi-Layer PCB category to the Ministry of Electronics and Information Technology (MEITY). Syrma SGS also held discussions with the Government of Andhra Pradesh and the state's Economic Development Board (EDB) for land acquisition and incentives. In June, the company engaged in talks with the IT Secretary of Andhra Pradesh, submitting a detailed project report on June 26, seeking support for land allocation and policy incentives. Adding to the bullish sentiment, global brokerage JPMorgan initiated coverage on Syrma SGS with an 'Overweight' rating. The firm expects robust revenue growth and margin expansion, projecting a 31 percent compound annual growth rate (CAGR) in revenues from FY25 to FY28. JPMorgan also forecasted a 70 basis points improvement in EBITDA margin, taking it to 9 percent by FY28. The optimism is driven by expected demand from the industrial and automotive sectors and easing margin pressures in the consumer electronics segment. Moreover, the brokerage anticipates a recovery in exports beginning FY27, a factor it believes is underpriced by the market and could trigger further earnings upgrades. On Thursday, the stock touched a new 52-week high of ₹ 682.70, marking a 5.2 percent intraday rise. It now trades nearly 93 percent above its 52-week low of ₹ 355.05 hit in April 2025. So far in 2025, Syrma SGS has delivered a return of nearly 16 percent, with gains in five out of the first seven months. On a one-year basis, the stock has appreciated over 32 percent, reflecting strong investor confidence in the company's growth trajectory and strategic vision. Disclaimer: The views and recommendations made above are those of individual analysts or broking companies, and not of Mint. We advise investors to check with certified experts before making any investment decisions.
Business Standard
29-04-2025
- Business
- Business Standard
Optiemus Infracom spurts after subsidiary ties up with Taiwan's ASRock
Optiemus Infracom rose 4.97% to Rs 522.55 after the company's subsidiary announced a strategic manufacturing partnership with Taiwan-based ASRock Inc., one of the world's top four motherboard manufacturers. Under the agreement, Optiemus Electronics, a wholly owned subsidiary of Optiemus Infracom, has already commenced production of ASRocks enterprise and gaming desktop motherboards in India as of April 2025. These Made-in-India products are expected to be available in the domestic market starting May 2025. The two companies also plan to expand their product portfolio in India, marking a notable shift as the Indian electronics manufacturing sector branches into new categories. This partnership positions Optiemus Electronics to strengthen its presence in the IT hardware segment. ASRocks motherboards are currently popular in both domestic and international markets but have so far been imported into India. On the partnership, Ashok Gupta, executive chairman, Optiemus Group said, "We are elated to partner with ASRock, which aligns perfectly with our vision of enabling cutting-edge manufacturing capabilities in India. This announcement brings forward our enhanced capabilities of handling highly complex large Printed Circuit Board assembly, including BGA, fine pitch assembly and the ability to deliver precision placement for very small capacitors and resistors, an important consideration for manufacturing complex AI motherboards for telecom industry, high-end desktops and AI powered laptops. Today, OEL has fully automated manufacturing processes with minimal human intervention including advanced nitrogen reflow systems that are of paramount importance for optimising soldering processes to ensure long term reliability." He further added, "We are on the path to meet the growing domestic demand, catering to exports market, creating new employment opportunities and fostering skill development in high-tech manufacturing." Optiemus Electronics, engaged into the business of electronics manufacturing in India, provides end-to-end solutions to global and Indian brands encompassing world class manufacturing, supply chain management and repair/refurbishment. The company has two manufacturing units in Noida, Uttar Pradesh. Optiemus Infracom is a telecommunications company with an experience in managing, distributing, and marketing mobile and telecom products in the Indian subcontinent. On a consolidated basis, net profit of Optiemus Infracom declined 16.34% to Rs 15 crore while net sales declined 2.12% to Rs 471.50 crore in Q3 December 2024 over Q3 December 2023.
