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STV News
01-05-2025
- Business
- STV News
Plans for £2.5m water feature in George Square abandoned due to budget gap
A £20 million deal to transform George Square and turn surrounding streets into avenues has been signed off as a £2.5 million water feature is dumped due to budget constraints. New designs show West George Street and Cochrane Street adjoining the square re-invented as avenues with far more pavement space and new trees and plants. A meeting heard there was no spare cash to pay for a planned water feature in George Square and that it would pose a risk to the contract but one councillor said it would not ease people's 'disappointment.' Asking how much a water feature would cost, Scottish Greens councillor Dan Hutcheson said: 'There has been press attention about the exclusion of the water feature in recent days. I understand there is a tight budget for this. I can see there is a £1.5 million gap in the budget.' An official said: 'We estimated a water feature would cost around £2.5 million in capital expenditure notwithstanding the ongoing recurring revenue costs. 'Because we knew it was a significant cost we excluded it.' He pointed out 'clearly there isn't a spare £2.5 million.' Speaking at the contracts and property committee, he added: 'The introduction of a water feature presented a significant level of risk to the contract because of the underground nature and all the stuff you need to do.' He said the main reason for abandoning the plan was due to the 'financial deficit in the budget' but there was also a significant risk. Scottish Greens councillor Dan Hutchison said: 'I understand there is sound logic but I don't think it will help the disappointment that people will feel but yeah there is only so much you can do. Thankfully in Glasgow it rains half the time so you get a water feature from the sky anyway.' Councillors awarded the £20.499 million contract to Rainton Construction with work to begin in June. The square is expected to be finished by August 2026. Hoardings are currently up as preparations are underway and the 11 statues are to be removed for restoration later this month. As well as covering the George Square works, the contract will also see the creation of avenues at North Hanover Street, George Street, West George Street, Cochrane Street and St Vincent Place. Plans for the square include informal 'play' areas for children in sensory gardens in the eastern areas, a raised lawn platform, new feature lighting and seating to add to the remembrance benches and high-quality stone throughout according to the council. New trees will also be planted. The western part of the square will have a more informal design for people to use with space for cafés to spill out on to, and a paved area for events. The Avenues programme is funded through the Glasgow City Region City Deal, with funding provided by the Scottish and UK Governments, and Glasgow City Council. Councillor Angus Millar, Convener for City Centre Recovery at Glasgow City Council, said: 'This is a huge milestone in the transformation of George Square. The appointment of Rainton means the main construction works are now just weeks away, adding real momentum and a sense of excitement to this historic project. 'Glaswegians will already have seen the construction site starting to take shape but the appointment of this contractor is the last major piece of the jigsaw. 'Over the 16 or so months from June, we will see a new and significantly improved public space take shape – a new square on a par with many of our international peers, one Glaswegians can be proud of, and which is fitting of a city of our standing.' Get all the latest news from around the country Follow STV News Scan the QR code on your mobile device for all the latest news from around the country
Time of India
24-04-2025
- Business
- Time of India
TSMC shows off new tech for stitching together bigger, faster chips
Taiwan Semiconductor Manufacturing Co on Wednesday unveiled technology for making faster chips and putting them together in dinner-plate sized packages that will boost performance needed for artificial intelligence applications. It said its A14 manufacturing technology will arrive in 2028 and will be able to produce processors that are 15% faster at the same power consumption as its N2 chips due to enter production this year or will use 30% less power at the same speed as the N2 chips. The world's biggest contract manufacturer, which counts Nvidia and Advanced Micro Devices as clients, added that its forthcoming "System on Wafer-X" will be able to weave together at least 16 large computing chips, as well as memory chips and fast optical interconnections and new technology to deliver thousands of watts of power to the chips. By comparison, Nvidia's current flagship graphics processing units consist of two large chips stitched together and its "Rubin Ultra" GPUs due out in 2027 will stitch four together. TSMC plans to build two factories to carry out the work near its chip plants in Arizona. Intel, which is working to build out a contract manufacturing business to compete with TSMC, is due to announce new manufacturing technologies next week. Last year, it claimed it would overtake TSMC in making the world's fastest chips. Demand for massive AI chips that are packaged together has shifted the battleground between the two firms from simply making fast chips to integrating them - a complex task that requires working closely with customers. "They're both neck and neck. You're not going to pick one over the other because they have the technological lead," said Dan Hutcheson, vice chair at analyst firm TechInsights. "You're going to pick one over the other for different reasons." Customer service, pricing and how much wafer allocation can be obtained are likely to influence a company's decision about which chip manufacturer would be best for them.
Time of India
24-04-2025
- Business
- Time of India
TSMC shows off new tech for stitching together bigger, faster chips
Taiwan Semiconductor Manufacturing Co on Wednesday unveiled technology for making faster chips and putting them together in dinner-plate sized packages that will boost performance needed for artificial intelligence applications. It said its A14 manufacturing technology will arrive in 2028 and will be able to produce processors that are 15% faster at the same power consumption as its N2 chips due to enter production this year or will use 30% less power at the same speed as the N2 chips. The world's biggest contract manufacturer, which counts Nvidia and Advanced Micro Devices as clients, added that its forthcoming "System on Wafer-X" will be able to weave together at least 16 large computing chips, as well as memory chips and fast optical interconnections and new technology to deliver thousands of watts of power to the chips. By comparison, Nvidia's current flagship graphics processing units consist of two large chips stitched together and its "Rubin Ultra" GPUs due out in 2027 will stitch four together. TSMC plans to build two factories to carry out the work near its chip plants in Arizona. Intel , which is working to build out a contract manufacturing business to compete with TSMC, is due to announce new manufacturing technologies next week. Last year, it claimed it would overtake TSMC in making the world's fastest chips. Demand for massive AI chips that are packaged together has shifted the battleground between the two firms from simply making fast chips to integrating them - a complex task that requires working closely with customers. "They're both neck and neck. You're not going to pick one over the other because they have the technological lead," said Dan Hutcheson, vice chair at analyst firm TechInsights. "You're going to pick one over the other for different reasons." Customer service, pricing and how much wafer allocation can be obtained are likely to influence a company's decision about which chip manufacturer would be best for them.
Economic Times
24-04-2025
- Business
- Economic Times
TSMC shows off new tech for stitching together bigger, faster chips
Taiwan Semiconductor Manufacturing Co on Wednesday unveiled technology for making faster chips and putting them together in dinner-plate sized packages that will boost performance needed for artificial intelligence applications. ADVERTISEMENT It said its A14 manufacturing technology will arrive in 2028 and will be able to produce processors that are 15% faster at the same power consumption as its N2 chips due to enter production this year or will use 30% less power at the same speed as the N2 chips. The world's biggest contract manufacturer, which counts Nvidia and Advanced Micro Devices as clients, added that its forthcoming "System on Wafer-X" will be able to weave together at least 16 large computing chips, as well as memory chips and fast optical interconnections and new technology to deliver thousands of watts of power to the chips. By comparison, Nvidia's current flagship graphics processing units consist of two large chips stitched together and its "Rubin Ultra" GPUs due out in 2027 will stitch four together. TSMC plans to build two factories to carry out the work near its chip plants in Arizona. Intel, which is working to build out a contract manufacturing business to compete with TSMC, is due to announce new manufacturing technologies next week. Last year, it claimed it would overtake TSMC in making the world's fastest chips. ADVERTISEMENT Demand for massive AI chips that are packaged together has shifted the battleground between the two firms from simply making fast chips to integrating them - a complex task that requires working closely with customers. "They're both neck and neck. You're not going to pick one over the other because they have the technological lead," said Dan Hutcheson, vice chair at analyst firm TechInsights. ADVERTISEMENT "You're going to pick one over the other for different reasons." Customer service, pricing and how much wafer allocation can be obtained are likely to influence a company's decision about which chip manufacturer would be best for them. ADVERTISEMENT
The Hindu
24-04-2025
- Business
- The Hindu
TSMC shows off new tech for stitching together bigger, faster chips
Taiwan Semiconductor Manufacturing Co on Wednesday unveiled technology for making faster chips and putting them together in dinner-plate-sized packages that will boost performance needed for artificial intelligence applications. It said its A14 manufacturing technology will arrive in 2028 and will be able to produce processors that are 15% faster at the same power consumption as its N2 chips due to enter production this year, or will use 30% less power at the same speed as the N2 chips. The world's biggest contract manufacturer, which counts Nvidia and Advanced Micro Devices as clients, said its forthcoming "System on Wafer-X" will be able to weave together at least 16 large computing chips, as well as memory chips and fast optical interconnections and new technology, to deliver thousands of watts of power to the chips. By comparison, Nvidia's current flagship graphics processing units consist of two large chips stitched together, and its "Rubin Ultra" GPUs due out in 2027 will stitch four together. TSMC said plans to build two factories to carry out the work near its chip plants in Arizona, with plans for a total of six chip factories, two packaging factories, and a research and development center at the site. "As we continue to bring more advanced silicon to Arizona, you need a continuous effort to enhance that silicon," Kevin Zhang, deputy co-chief operations officer and senior vice president, said on Wednesday. Intel, which is working to build out a contract manufacturing business to compete with TSMC, is due to announce new manufacturing technologies next week. Last year, it claimed it would overtake TSMC in making the world's fastest chips. Demand for massive AI chips that are packaged together has shifted the battleground between the two firms from simply making fast chips to integrating them - a complex task that requires working closely with customers. "They're both neck-and-neck. You're not going to pick one over the other because they have the technological lead," said Dan Hutcheson, vice chair at analyst firm TechInsights. "You're going to pick one over the other for different reasons." Customer service, pricing and how much wafer allocation can be obtained are likely to influence a company's decision about which chip manufacturer would be best.
