Latest news with #DesignCon
Globe and Mail
18-02-2025
- Business
- Globe and Mail
DesignCon Wraps 30th Anniversary with Record Number of Attendees, Hosting Powerhouse Speakers from Nvidia, Amazon and Lawrence Berkeley National Laboratory
Key topics covered included AI computing, high-speed applications and more. SANTA CLARA, CA / ACCESS Newswire / February 18, 2025 / DesignCon, the premiere event for chip, board, and systems design engineers, concludes the 30th edition by bringing together 5,400 engineers, for a total of 13% growth to connect and learn about critical technological advancements in the industry. DesignCon presented more than 200 educational and networking sessions across the three-day event, featuring topics on AI computing, optimization of interconnects, electromagnetic compatibility and interference, power integrity and other high-speed applications. Keynote speakers from Nvidia, Amazon and Lawrence Berkeley National Laboratory presented chief insights into the future of engineering excellence and discussed an array of topics from electronics for future high energy particle colliders to the transformative power of accelerated computing and enabling global connectivity with low Earth orbit satellite technology. Over 170 industry suppliers of electronic and design manufacturing services showcased the latest innovations in semiconductor and high-speed communication systems design. Leading exhibitors including Amphenol, Keysight Technologies, Marvell Technology, Molex, Samtec and TE Connectivity were among those that highlighted solutions for thermal management, component manufacturing, electronics assembly, signal integrity, AI and machine learning and connectivity. Celebrating 30 years, DesignCon 2025 hosted multiple experiences commemorating the milestone, such as an anniversary lounge on the expo floor including a timeline honoring important events and technologies since the event's founding in 1995, as well as a special Welcome Reception on opening day. A Lunar New Year celebration could also be seen on the DesignCon show floor, in honor of Lunar New Year 2025 - Year of the Snake. " DesignCon's milestone event hosted impressive growth in both the number of attendees, as well as exhibiting companies," says Suzanne Deffree, Group Event Director, Informa Markets Engineering. "The breadth of expertise showcased provides first-hand insights and education aimed at expanding and innovating critical solutions in the design engineering community. DesignCon brought together professionals across the business to celebrate the industry's progress over the past three decades and inspire future success across the globe." Looking to the next 30 years, DesignCon hosted several initiatives to ensure continuous growth of engineering. These included the sophomore-year edition of the event's 40 Under 40 program, for which DesignCon hosted 40 rising engineers, providing these individuals with complimentary access to DesignCon's education, expo floor and networking, as well as an exclusive breakfast with leading industry mentors, engineers and entrepreneurs. Efforts also included a Women in Engineering career-development panel led by the official event publication, Design News, on, as well as additional career-development sessions and a networking reception, presented in partnership with IEEE EMC Society and IEEE Women. DesignCon will return to Santa Clara Convention Center, Feb. 24-26, 2026. For more information on DesignCon, please visit About DesignCon DesignCon is the world's premier conference for chip, board, and systems design engineers in the high-speed communications and semiconductor communities. DesignCon, created by engineers for engineers, takes place annually in Silicon Valley and remains the largest annual gathering of chip, board, and systems designers in the country. DesignCon is organized by Informa, a leading B2B information services group and the largest B2B events and exhibitions organizer in the world. To learn more and for the latest news and information, visit Design News and Battery Technology Online are the official publications of DesignCon. Connect with DesignCon and join the conversation on Facebook and LinkedIn. About Informa Markets Engineering Informa Markets' Engineering portfolio, a subsidiary of Informa plc (LON:INF), is the leading B2B event producer, publisher, and digital media business for the world's $3-trillion advanced, technology-based manufacturing industry. Our print and electronic products deliver trusted information to the engineering market and leverage our proprietary 1.3-million-name database to connect suppliers with buyers and purchase influencers. We produce more than 50 events and conferences in a dozen countries, connecting manufacturing professionals from around the globe. The Engineering portfolio is organized by Informa, the world's leading exhibitions organizer that brings a diverse range of specialist markets to life, unlocking opportunities and helping them to thrive 365 days of the year. For more information, please visit View the original press release on ACCESS Newswire
Yahoo
18-02-2025
- Business
- Yahoo
DesignCon Wraps 30th Anniversary with Record Number of Attendees, Hosting Powerhouse Speakers from Nvidia, Amazon and Lawrence Berkeley National Laboratory
Key topics covered included AI computing, high-speed applications and more. SANTA CLARA, CA / ACCESS Newswire / February 18, 2025 / DesignCon, the premiere event for chip, board, and systems design engineers, concludes the 30th edition by bringing together 5,400 engineers, for a total of 13% growth to connect and learn about critical technological advancements in the industry. DesignCon presented more than 200 educational and networking sessions across the three-day event, featuring topics on AI computing, optimization of interconnects, electromagnetic compatibility and interference, power integrity and other high-speed applications. Keynote speakers from Nvidia, Amazon and Lawrence Berkeley National Laboratory presented chief insights into the future of engineering excellence and discussed an array of topics from electronics for future high energy particle colliders to the transformative power of accelerated computing and enabling global connectivity with low Earth orbit satellite technology. Over 170 industry suppliers of electronic and design manufacturing services showcased the latest innovations in semiconductor and high-speed communication systems design. Leading exhibitors including Amphenol, Keysight Technologies, Marvell Technology, Molex, Samtec and TE Connectivity were among those that highlighted solutions for thermal management, component manufacturing, electronics assembly, signal integrity, AI and machine learning and connectivity. Celebrating 30 years, DesignCon 2025 hosted multiple experiences commemorating the milestone, such as an anniversary lounge on the expo floor including a timeline honoring important events and technologies since the event's founding in 1995, as well as a special Welcome Reception on opening day. A Lunar New Year celebration could also be seen on the DesignCon show floor, in honor of Lunar New Year 2025 - Year of the Snake. "DesignCon's milestone event hosted impressive growth in both the number of attendees, as well as exhibiting companies," says Suzanne Deffree, Group Event Director, Informa Markets Engineering. "The breadth of expertise showcased provides first-hand insights and education aimed at expanding and innovating critical solutions in the design engineering community. DesignCon brought together professionals across the business to celebrate the industry's progress over the past three decades and inspire future success across the globe." Looking to the next 30 years, DesignCon hosted several initiatives to ensure continuous growth of engineering. These included the sophomore-year edition of the event's 40 Under 40 program, for which DesignCon hosted 40 rising engineers, providing these individuals with complimentary access to DesignCon's education, expo floor and networking, as well as an exclusive breakfast with leading industry mentors, engineers and entrepreneurs. Efforts also included a Women in Engineering career-development panel led by the official event publication, Design News, on, as well as additional career-development sessions and a networking reception, presented in partnership with IEEE EMC Society and IEEE Women. DesignCon will return to Santa Clara Convention Center, Feb. 24-26, 2026. For more information on DesignCon, please visit About DesignConDesignCon is the world's premier conference for chip, board, and systems design engineers in the high-speed communications and semiconductor communities. DesignCon, created by engineers for engineers, takes place annually in Silicon Valley and remains the largest annual gathering of chip, board, and systems designers in the country. DesignCon is organized by Informa, a leading B2B information services group and the largest B2B events and exhibitions organizer in the world. To learn more and for the latest news and information, visit Design News and Battery Technology Online are the official publications of DesignCon. Connect with DesignCon and join the conversation on Facebook and LinkedIn. About Informa Markets EngineeringInforma Markets' Engineering portfolio, a subsidiary of Informa plc (LON:INF), is the leading B2B event producer, publisher, and digital media business for the world's $3-trillion advanced, technology-based manufacturing industry. Our print and electronic products deliver trusted information to the engineering market and leverage our proprietary 1.3-million-name database to connect suppliers with buyers and purchase influencers. We produce more than 50 events and conferences in a dozen countries, connecting manufacturing professionals from around the globe. The Engineering portfolio is organized by Informa, the world's leading exhibitions organizer that brings a diverse range of specialist markets to life, unlocking opportunities and helping them to thrive 365 days of the year. For more information, please visit Media ContactInforma Markets SOURCE: INFORMA MARKETS - ENGINEERING View the original press release on ACCESS Newswire
Associated Press
28-01-2025
- Business
- Associated Press
MultiLane Leads 224Gbps/Lane Instrument Innovation at DesignCon 2025
/ -- The insatiable need for higher bandwidth and greater networking speeds, driven as ever by AI and Machine Learning, has greatly accelerated the pace of development and deployment of next-gen networks. 224Gbps/lane is now an essential technology to ensure the HSIO industry can keep pace with demand that shows no sign of slowing down. These condensed development cycles require a robust test and measurement foundation for innovations in 224G/1.6T networking to meet the needed time-to-market. MultiLane is leading the charge in providing 224Gbps/lane instrumentation to enable rapid, high-value host and module testing with scalable precision. The company's showing at DesignCon 2025 booth #727 features industry-leading innovations in 224G test and measurement. The company's latest Bit Error Rate Tester, ML7004F-L, will be featured in a live demonstration recording the bit error rate of a 1.6Tbps (8x224Gbps) Active Electrical Cable, provided by 3M, also shown at booth #326. The first commercially available instrument of its kind, ML7004F-L is a 4-channel 120 Gbaud/lane PAM4 BERT designed for maximum versatility, with up to 35 dB of Rx equalization for long reach passive applications as well as retimed 1.6T optical modules and cables. '3M is well-positioned to serve the dynamic needs of Cloud Service Providers as they pursue versatile interconnect solutions for next-generation Artificial Intelligence,' said Steve Vander Louw, president of display and electronics at 3M. 'MultiLane's cutting edge suite of instruments has enabled a live demonstration of our 1.6Tbps Active Electrical Cable, one of the first known cables publicly demonstrated in this industry.' The MultiLane Signal Integrity Analyzer, the ML8008FX-SIA, is another key instrument in at the MultiLane booth. A MultiLane specialty instrument, the ML8008FX-SIA is designed to provide high-value testing for 224Gbps/lane passive and linear active cables, with ultra-fast testing for S-parameters and crosstalk and low Total Cost of Ownership when validating any kind of custom passive or linear active interconnects such as Flyover Cables, DACs, ACCs, Backplane Cartridges, and Cable Trays. The ML8008FX-SIA's ultra-high throughput capabilities are on full display in a multi-Terabit capable setup. Both sets of instruments can be configured as individual units or densely consolidated for validating extremely high channel count devices. 'We are very pleased with our presence at DesignCon this year,' said Pavel Zivny, Director of Product Development at MultiLane. 'The arrival of AI has only put more pressure on the industry to transition to 224Gbps/lane and we are ideally placed with a comprehensive solution suite that accelerates 1.6T validation cycles from development to deployment.' The ML7004F-L and ML8008FX-SIA join a number of other MultiLane innovations including the company's latest 1.0 mm RF Connectors – board mount connectors, cable assemblies, adapters, and terminators –which lay the foundations for 448Gbps/lane testing. About MultiLane MultiLane is a leading provider of High-Speed IO and Data Center Interconnect test solutions. Products include BERTs, TDR, optical and electrical oscilloscopes, optical switch boxes, and a host of MSA-compliant development tools for a variety of form factors, including QSFP-DD, OSFP, and OSFP-XD. MultiLane's products are used to test semiconductors, ACCs, DACs, AOCs, AECs, backplane cables, optical transceivers, and system switch cards. MultiLane also develops high speed ATE modules that fit in wafer-scale automated test systems. For more information, please visit and follow us on LinkedIn, X and Facebook. MultiLane X YouTube
Yahoo
27-01-2025
- Business
- Yahoo
Amazon, Nvidia and University of California to Keynote 30th Edition of DesignCon
The event will also feature speakers from Munro & Associates, Hewlett Packard Enterprise and more. SANTA CLARA, CA / / January 27, 2025 / DesignCon (Jan. 28-30), the premiere event for chip, board and systems design engineers, today announces keynote speakers for the event. Carl Haber, Senior Scientist, Lawrence Berkeley National Laboratory, University of California, John Linford Principal Technical Product Manager, Nvidia and Nima Mahanfar, Director of Engineering, Amazon's Project Kuiper Systems, will present at the 2025 event. Haber will present "Electronics for Future High Energy Particle Colliders," a look at particle physics starting at the turn of the 20th Century with the discovery of radiation and atomic structure. Discoveries over the last 125 years were enabled by increasingly powerful and sophisticated instruments to measure the tracks and energy of particles created at accelerators, colliders and in astrophysical sources and an international effort is now underway to both upgrade existing facilities at the European Center for Particle Physics (CERN), for higher data rates, and plan for a next generation of colliders. In the keynote titled, "The Transformative Power of Accelerated Computing & AI," Linford will explore how accelerated computing, physics-informed AI and generative AI are revolutionizing the modern manufacturing landscape. These technologies empower engineers and designers to overcome constraints, enabling faster innovation, sustainable practices and unprecedented levels of precision and creativity. From simulating complex physical processes to generating optimized designs, the tools go beyond enhancing workflows, unlocking new manufacturing capabilities and fundamentally reshaping industries. Mahanfar, is presenting "Enabling Global Connectivity with Low Earth Orbit Satellite Technology." Amazon's Project Kuiper is deploying a constellation of more than 3,200 low Earth orbit satellites to provide access to fast, reliable internet connectivity to customers all over the world. Designing the communications payload for these satellites requires the typical balancing act of size, weight and power, but that is just one piece of a bigger puzzle to make best use of available bandwidth and spectrum across Project Kuiper's network, while providing a service that is affordable for customers. Learn how Project Kuiper's engineers approach the challenges of relaying customer data through space and continuously innovating to reduce costs and increase performance across the network. "DesignCon celebrates a milestone of 30 years with the most impressive slate of keynotes to date, all dedicated to the critical technological advancements taking place in the heart of Silicon Valley," says Suzanne Deffree, Group Event Director, Informa Markets Engineering. "Due to the rapid pace of changes in the sector, DesignCon continues to provide a community-like environment to discuss ways to best support the rapid growth." Home to over 6,600 tech companies and generating $275 billion in annual tech GDP, Silicon Valley stands as a global epicenter of advancement and economic growth. By bringing together industry experts sharing insights in AI, global satellite connectivity and particle physics, the 30th edition of DesignCon celebrates the region's legacy of pioneering technologies and cross-disciplinary collaboration, empowering the next generation to push the boundaries of engineering and design. Along with the keynotes highlighting technological advancements, the event will also present its prestigious awards for Engineer of the Year, Best Paper Awards and 40 Under 40 honorees. To register to attend DesignCon, visit About DesignConDesignCon is the world's premier conference for chip, board, and systems design engineers in the high-speed communications and semiconductor communities. DesignCon, created by engineers for engineers, takes place annually in Silicon Valley and remains the largest gathering of chip, board, and systems designers in the country. This three-day technical conference and two-day expo combines technical paper sessions, tutorials, industry panels, product demos, and exhibits from the industry's leading experts and solutions providers. More information is available at: DesignCon is organized by Informa, a leading B2B information services group and the largest B2B events and exhibitions organizer in the world. To learn more and for the latest news and information, visit Connect with DesignCon and join the conversation on Facebook and Twitter. About Informa Markets EngineeringInforma Markets Engineering is the leading B2B event producer, publisher, and digital media business for the world's $3-trillion advanced, technology-based manufacturing industry. Our print and electronic products deliver trusted information to the engineering market and leverage our proprietary 1.3-million-name database to connect suppliers with buyers and purchase influencers. We produce more than 50 events and conferences in a dozen countries, connecting manufacturing professionals from around the globe. The Engineering portfolio is organized by Informa Markets, a subsidiary of Informa plc (LON:INF), the world's leading exhibitions organizer that brings a diverse range of specialist markets to life, unlocking opportunities and helping them to thrive 365 days of the year. For more information, please visit Media ContactInforma Markets Engineering PR EngineeringPR@ SOURCE: INFORMA MARKETS - ENGINEERING View the original press release on ACCESS Newswire Sign in to access your portfolio
