Latest news with #ESMC
News18
2 days ago
- Automotive
- News18
TSMC secures USD 2.23 billion in global subsidies in first half of 2025
Taipei [Taiwan], August 20 (ANI): Taiwan Semiconductor Manufacturing Co. (TSMC) has received USD 2.23 billion (NTD 67.13 billion) in subsidies from the governments of the United States, Germany, Japan and China during the first half of 2025, according to a Focus Taiwan report. As per the report, financial data compiled by the world's largest contract chipmaker showed that USD 1.17 billion (NTD 35.15 billion) in aid was granted in the first quarter of this year, followed by USD 1.06 billion (NTD 31.98 billion) in the second. These subsidies, combined with USD 2.49 billion (NTD 75.16 billion) received in 2024, pushed the total aid from the four governments to USD 4.7 billion (NTD 142.29 billion) over the past 18 months. TSMC stated that the funds were allocated for property purchases, equipment, factory construction, and operational expenses to support its global expansion strategy. The subsidies were tied to agreements signed by TSMC's subsidiaries with local governments where the company has invested. In the United States, TSMC Arizona Corp. is building three advanced semiconductor plants worth USD 65 billion. The first fab began mass production in late 2024 using 4-nanometer technology. Construction of the second fab has been completed, with commercial production using the 3-nanometer process expected soon. Work has also started on a third facility, which will adopt 2-nanometer and A16 process technologies. TSMC has pledged to invest an additional USD 100 billion in the coming years to build further fabs, assembly plants, and a research and development center in Arizona. In Japan, TSMC's joint venture, Japan Advanced Semiconductor Manufacturing, Inc. (JASM), launched mass production at its first fab in Kumamoto at the end of 2024. Plans for a second fab are underway, though local infrastructure development has slowed progress amid resident concerns over traffic congestion. In Germany, European Semiconductor Manufacturing Co. (ESMC) began construction of a new facility in Dresden in August 2024. The site, which is scheduled for completion in 2027, will focus on supplying Europe's auto industry and industrial sector. 'The current work in Dresden is centered on infrastructure such as constructing a water recycling system and building gas and chemical supply systems for future production," the report quoted Christian Koitzsch, president of ESMC. Meanwhile, in China, TSMC continues operations at its 12-inch wafer fab in Nanjing under agreements signed with local authorities. The company noted that it must adhere to construction timelines and other conditions outlined in its agreements to qualify for the subsidies. (ANI)
Straits Times
18-06-2025
- Climate
- Straits Times
Magnitude 5.8 earthquake strikes off coast of Mexico's Chiapas, EMSC says
Magnitude 5.8 earthquake strikes off coast of Mexico's Chiapas, EMSC says MEXICO CITY - A magnitude 5.8 earthquake struck off the coast of the southern state of Chiapas in Mexico, the European Mediterranean Seismological Centre (ESMC) said on Wednesday. The quake was at a depth of 10 km (6.2 miles) and located 189 km from the southern city of Tapachula, EMSC said. Mexico's national civil protection agency said on X that it will conduct a preliminary examination of the area together with local authorities. "At the moment, there are no reports of damages. We continue to monitor the situation," the agency added. REUTERS Join ST's Telegram channel and get the latest breaking news delivered to you.
Reuters
18-06-2025
- Climate
- Reuters
Magnitude 5.8 earthquake strikes off coast of Mexico's Chiapas, EMSC says
MEXICO CITY, June 18 (Reuters) - A magnitude 5.8 earthquake struck off the coast of the southern state of Chiapas in Mexico, the European Mediterranean Seismological Centre (ESMC) said on Wednesday. The quake was at a depth of 10 km (6.2 miles), EMSC said.
Yahoo
29-05-2025
- Business
- Yahoo
TSMC to build chip design centre in Germany
Taiwan Semiconductor Manufacturing Co (TSMC) is planning to open a chip design centre in Munich, Germany, reports Reuters. The facility is expected to contribute to the development of advanced chips for applications such as AI. TSMC Europe president Paul de Bot was cited by the news agency as saying at the company's 2025 Technology Symposium that the facility is expected to become operational in the third quarter of 2025. Bot said: "It's intended to support European customers in designing high-density, high-performance, and energy-efficient chips with a focus on applications again in automotive, industrial, AI, and IoT.' TSMC is also involved in a major semiconductor manufacturing project in Dresden, Germany, through a joint venture known as European Semiconductor Manufacturing Co (ESMC). The venture, which includes partners Infineon, NXP, and Robert Bosch, is building a €10bn ($11.3bn) microchip fabrication plant aimed at boosting Europe's production capabilities. TSMC executive Kevin Zhang noted that the Munich centre will work on all ESMC nodes. Zhang said that TSMC is in discussions with its partners about supporting Europe's ambitions in AI chip development through both the ESMC plant and the new design centre. "I'm all for building up the most semiconductor capability in Europe for AI applications... This design centre obviously potentially can be leveraged to bring the leading node support," he added. The ESMC facility in Dresden will manufacture chips using smaller-scale technologies that have not been previously available to European companies such as Infineon, STMicroelectronics, and NXP. In April 2025, TSMC started construction on its third semiconductor fabrication facility in Phoenix, Arizona in the US. TSMC's first fab in Arizona is scheduled to begin production using 4nm technology in the first half of 2025. A second fab will focus on advanced 2nm technology and next-generation nanosheet transistors, with production targeted for 2028. "TSMC to build chip design centre in Germany" was originally created and published by Verdict, a GlobalData owned brand. The information on this site has been included in good faith for general informational purposes only. It is not intended to amount to advice on which you should rely, and we give no representation, warranty or guarantee, whether express or implied as to its accuracy or completeness. You must obtain professional or specialist advice before taking, or refraining from, any action on the basis of the content on our site. Sign in to access your portfolio
Time of India
28-05-2025
- Automotive
- Time of India
TSMC to open chip design centre in Munich, could later support AI development
Taiwan Semiconductor Manufacturing Co, the world's largest contract chipmaker, said on Tuesday it will open a design centre in Munich , Germany, which could at a later date help develop chips via leading manufacturing processes for applications such as artificial intelligence . President of TSMC Europe, Paul de Bot, said at the company's 2025 Technology Symposium event that the Munich Design Centre would open during the third quarter of 2025. "It's intended to support European customers in designing high-density, high-performance, and energy-efficient chips with a focus on applications again in automotive, industrial, AI, and IoT," de Bot said. Sponsored Links Sponsored Links Promoted Links Promoted Links You May Like The Cost Of Amusement Park Equipment From Mexico Might Surprise You (See Prices) Amusement Park Equipment | search ads Learn More Undo by Taboola by Taboola Europe is currently formulating a strategy to catch up with the U.S. and China on artificial intelligence. TSMC is building together with Infineon, NXP and Robert Bosch a new €10 billion ($11.33 billion) microchip manufacturing plant in Dresden, Germany, through a joint venture called European Semiconductor Manufacturing Co ( ESMC ). Live Events When asked if ESMC or the design centre could assist in meeting Europe's AI chips ambitions at a later stage, executive Kevin Zhang said TSMC has engaged conversations with its partners. Discover the stories of your interest Blockchain 5 Stories Cyber-safety 7 Stories Fintech 9 Stories E-comm 9 Stories ML 8 Stories Edtech 6 Stories "I'm all for building up the most semiconductor capability in Europe for AI applications... This design center obviously potentially can be leveraged to bring the leading node support," Zhang said in a press briefing with journalists, referring to advanced processes used to make AI chips, among others. The Munich centre will work on all ESMC nodes, not exclusively depending on the future customer base, he said. TSMC joins its largest customer in the Bavarian capital, Apple, which has invested €2 billion to build its largest engineering hub in Europe there. Dresden-based ESMC aims to manufacture chips using smaller manufacturing technology previously unavailable at European chipmakers like Infineon, STMicroelectronics, or NXP. "We have to be on the ground right here closer. We need to have people here to really directly engage with customers," Zhang added. ($1 = € 0.8823)
