Latest news with #EmbeddedWorld
Yahoo
6 days ago
- Business
- Yahoo
Intel Demos Panther Lake CPUs at Computex
While Intel is touting the launch of its two Battlemage Pro GPUs at Computex, the chip maker also has samples of its much-anticipated Core Ultra 300 (Panther Lake) chips on hand, powering demo systems. That's an improvement from Embedded World, when the samples were on display without PCs. Some of the info is familiar: Intel says Panther Lake offers similar power efficiency as Lunar Lake but better performance, like Arrow Lake. That sounds great, but for now, we're hearing more about the processor than seeing it in action. Even on the demo systems, for example, performance numbers were in short supply. The samples completed AI workloads, edited images, and handled other tasks smoothly, but benchmark scores aren't on the table yet. John Burek, an executive editor for our sibling publication PCMag, had a close-up look at the samples in Taipei. Although Panther Lake chips likely won't be hitting the market until early 2026, the tech is far enough along for demonstrations. In fact, Intel reached the risk production stage for its 18A node in April. Panther Lake is built by Intel Foundry on Intel's sub-2nm 18A process, and the Foundry plans to use the same process to build chips for other chip designers. Intel said Panther Lake will likely reach consumers early in 2026. That gives Intel the second half of 2025 to ramp up production. It wasn't all that long ago that Intel was aiming for a 2025 release, but rumors suggested that 2026 was more likely. At this point, there's no reason to expect delays beyond early 2026, but Intel has too much riding on its 18A process to deliver the Panther Lake CPUs before they're ready. Intel had the samples running in PC, SFF, and notebook form factors. The notebooks on display were from OEMs such as Foxxconn. Seeing what Asus, MSI, Razer, and the like can do with Panther Lake will have to wait for later. The integrated graphics are a new design. We know from the chip's appearance at Embedded World that they'll have two to 12 Xe cores, depending on the model. A neural processor for AI calculations, Thunderbolt 4, and LPDDR5 memory are among the other features we're aware of at this point. The graphics chip appears set to be made by TSMC.
Associated Press
24-04-2025
- Business
- Associated Press
Qualcomm at Embedded World: Accelerating Digital Transformation With Edge AI
Written by Ana Schafer Muroff The AI revolution is sparking a wave of innovation in the embedded community, spawning a flurry of new use cases that take advantage of greater intelligence on the edge. Qualcomm Technologies, Inc., is leading the drive to turn these ideas into reality. You'll see that push at Embedded World, one of the largest gatherings of embedded system developers, specialists, project and product managers, system architects and industry experts showcasing embedded systems technologies benefiting everything from automotive, healthcare and the Internet of Things (IoT). At the conference, we're demonstrating new developer kits and have experts on hand to offer advice and guidance on how to make the most of our technology. There will be, of course, our massive wall of boards, with over 90 modules — many from our various ecosystem partners — on display and a host of demos from our ecosystem partners. We also announced ahead of Embedded World that we entered into an agreement to acquire Edge Impulse Inc., a leading end-to-end edge AI platform which enables developers to easily build, deploy and monitor AI models on a wide array of devices, including the ability to target Qualcomm Dragonwing processors. These moves underscore our commitment to bring intelligent computing everywhere. A key element of that mission is ensuring our Qualcomm Dragonwing offerings, from high-speed connectivity to powerful processing and AI edge capabilities, are accessible to the developer community. At Embedded World, you'll see more than 50 of our partners showing off the solutions that make the most of our innovations. The Nuremberg, Germany, conference last year drew 32,000 visitors and 1,100 exhibitors. With big crowds expected to show again this year, here's what we have in store. Expanding our AI tech portfolio for IoT Part of being a trusted and valued partner for the embedded community is making sure we have the right tools and support available. That's why we announced today the entry into an agreement to acquire Edge Impulse. The closing of the Edge Impulse acquisition is subject to customary closing conditions. Edge Impulse is used by over 170,000 developers to build, deploy and monitor AI models on various devices. This development platform provides a comprehensive set of tools and features for data collection, data preparation, model training, model deployment and model monitoring — all with an easy-to-use, user-friendly interface requiring little or no code at all. Qualcomm Technologies anticipates giving developers on Edge Impulse's platform the ability to target Qualcomm Dragonwing processors, which feature superior on-device AI inferencing, computer vision, graphics and processing capabilities. Hands-on with new developer kits At the booth will be the Qualcomm QCC74xM Evaluation kit (EVK) and Qualcomm QCC730M EVKs, which are used to showcase performance and capabilities of the QCC74xM and QCC730M modules. These modules offer a variety of connectivity features including micro-power Wi-Fi, programmable RISC-V capabilities and support for Bluetooth technology and Matter. As a result, they boast extremely long battery life and flexibility — ideal for any embedded system. Qualcomm Technologies is also bringing back the board wall display, which will include 98 different third-party modules and development kits. The vast selection of different components on display gives developers and system architects a wealth of options for prototyping and commercializing new embedded solutions. Making use of our technology Beyond hardware, our booth will play host to more than a dozen demonstrations of our technology, with many of our ecosystem partners taking the spotlight. On one side of the booth, Sunmi, and AuthSignal will be showing off a multi-operating system self-checkout solution with biometric payment, complete with a generative AI assistant for trouble shooting, in a glimpse of the future of retail. Sigma Connectivity has a dual camera set-up utilizing cutting-edge machine learning that seamlessly translates American Sign Language (ASL) gestures into closed-caption text in real time, and on the far end of the booth, Promwad's AI-powered service robot will be delivering packages while navigating and interacting with visitors. The centerpiece of our demos is the marquee dynamic 3D tabletop experience featuring industrial IoT solutions such as worker assistance, worker safety, incident response and asset inspection. Explore Qualcomm Technologies' Embedded World booth This is just scratching the surface of how Qualcomm Technologies is supporting the embedded community through cutting edge platforms that offer an unmatched balance of speed, power and smarts. To experience all our demos, check out hall 5, booth #5-161 at Embedded World from March 11 to 13. Visit us at Embedded World Visit 3BL Media to see more multimedia and stories from Qualcomm
Yahoo
15-03-2025
- Business
- Yahoo
Intel Panther Lake CPUs Shown At Embedded World
Intel's next-generation Panther Lake processors were seen in the silicon flesh at the recent Embedded World show in Nuremberg, Germany. This is the first time the chips have been unveiled since their original debut last year, although they were merely bare dies here; no CPUs were seen in operation. That throws more fuel on the rumors that Intel may struggle to get these Core Ultra 300 processor designs out of the door and into devices before the end of the year. Intel's next-generation Panther Lake CPUs were first unveiled in 2024, by then-Intel CEO Pat Gelsinger. He outlined plans to launch Panther Lake in the second half of 2025, and Intel has reiterated that is the plan still, even with rumors swirling that full production of the new chips won't take place until 2026. The new CPUs are expected to have a mobile focus, with more low-power efficiency cores to improve idle performance while reducing power demands. They will also come equipped with a new generation of Xe graphics, which should make them much more capable at casual gaming without a dedicated GPU. The model pictured at Embedded World by PC Games Hardware (via VideoCardz), is the 16 core variant, featuring four Performance (P) cores, eight Efficiency (E) cores, and four low-power-efficiency cores (LPE). The high-end variants will have up to 12 of the new Xe graphics cores, although other variants will have as few as two. Each will also have support for Thunderbolt 4, faster LPDDR5X memory, and include a new neural processor for AI calculations. Credit: PC Games Hardware All Panther Lake CPUs will be built on a new core design, on a new Intel 18A process node, which has the potential to raise performance and efficiency over the last-generation designs. However, they will also include outside fabricated parts, with the graphics chip being produced on TSMC's N3E node instead. That isn't common in chip design but will lean into Intel's experience fabricating processors and TSMC's greater experience manufacturing GPUs. Despite this promising showing of the new chips in the real world, there are still concerns about whether Intel can meet its plans to launch Panther Lake in 2025. The move to 18A is a dramatic one, requiring changes to Intel's fabrication process. It has already faced some delays in 18A fabrication, so any further problems could push the launch of Panther Lake products until much later in the year, potentially into early 2026. It may be that we see a debut of some new products using these chips as part of an announcement, followed by a wider launch at CES in January next year.
Yahoo
11-03-2025
- Automotive
- Yahoo
Phison Showcases Edge AI and Embedded Solutions at Embedded World
NUREMBURG, Germany, March 11, 2025--(BUSINESS WIRE)--Embedded World 2025 – Embedded World is one of the most influential exhibitions in the global embedded technology sector, attracting numerous experts in industrial computing, automotive electronics, IoT, and AI technologies each year. Phison Electronics (8299TT), a leading innovator of NAND controller and NAND storage solutions, will participate in the Taiwan Excellence Pavilion at Embedded World 2025 in Germany from March 11 to 13. Phison will showcase its exclusive AI solution aiDAPTIV+, the enterprise ultra-high-capacity Pascari PCIe 5.0 122.88TB SSD, and its latest automotive storage technology, the MPT5 Automotive PCIe Gen4 SSD, demonstrating over 15 years of technical expertise in the embedded market. Phison will exhibit three key product series at the Taiwan Excellence Pavilion at Embedded World: 1. Exclusive Patented AI Solution – aiDAPTIV+ Winner of the 2025 Taiwan Excellence Silver Award, aiDAPTIV+ is an edge AI solution designed for enterprises, government institutions, and academia, addressing three critical challenges: data security, AI autonomy, and cost-effectiveness. aiDAPTIV+ has been widely adopted in smart manufacturing, healthcare, government agencies, and higher education, with over 200 enterprises and 25 universities already implementing the solution. 2. Pascari D205V PCIe 5.0 122.88TB SSD – The World's First PCIe Gen5 Enterprise Ultra-High-Capacity SSD Compliant with PCIe 5.0 and NVMe 2.0 standards, offering an unprecedented 122.88TB capacity to meet the extreme storage demands of AI computing, data centers, and cloud services. Features industry-leading endurance and low power consumption, making it ideal for large-scale enterprise and cloud applications. 3. MPT5 Automotive PCIe Gen4 SSD Phison's first PCIe Gen4 automotive SSD, compliant with AEC-Q100 Grade 2/3 standards, designed for autonomous driving, smart cockpits, and connected vehicle applications (such as Central Gateway, EDR, DSSAD). Supports SR-IOV technology to enhance operational efficiency in multi-OS environments, delivering a high-performance solution for next-generation in-vehicle computing needs. In addition to its Taiwan Excellence Award-winning products, Phison will also introduce two new industrial SSDs during Embedded World: E29TI PCIe 4.0 Industrial SSD – Designed for multifunction office machines and industrial computers, featuring up to 2TB capacity, support for pseudo SLC (pSLC) ultra-high durability technology, and multiple form factor options (including M.2 2280/2242/2230) to provide a stable and reliable storage solution. E31TI PCIe 5.0 Industrial SSD – The world's first industrial PCIe 5.0 SSD, offering read/write speeds of up to 10,300MB/s and 8,600MB/s, ideal for fanless industrial PCs and edge AI systems, ensuring a high-speed and stable computing environment. K.S. Pua, CEO of Phison, stated: "We are honored to be invited by Taiwan Excellence to showcase our award-winning storage solutions at Embedded World. As AI, IoT, and edge computing continue to thrive, embedded systems and industrial computing are rapidly advancing towards an era of high performance and reliability. With over 15 years of experience in the embedded and industrial markets, Phison has developed a range of storage solutions specifically designed for harsh environments, catering to applications such as smart manufacturing, automotive electronics, industrial automation, and edge AI. We will continue to drive technological advancements, offering more efficient and secure solutions while collaborating with global partners to accelerate the digital transformation of AI and the embedded market, shaping a smarter and more sustainable future." To explore the latest embedded storage solutions, please visit Phison's booth at the Taiwan Excellence Pavilion. Embedded World Exhibition: March 11–13, 2025Booth Location: Hall 2, Booth No. 2-313, Messe Nuremberg, Germany [PHISON IR Distribution List Application Form] If you would like to receive PHISON press release or announcement, please register our IR distribution application form from the link: Phison IR Distribution List [PHISON's Quick Facts] Over 25 years experiences in NAND controller IC design and module integration. Over 4,000 employees globally, and more than 70% are engineers More than 2,000 NAND-related patents globally. Target long-term revenue of NT$100 billion through the 5+5 growth strategy The global market share of SSD controllers exceeds 20% The global market share of automotive-grade controllers exceeds 40% Phison, along with NAND makers such as KIOXIA, Micron, Western Digital, Samsung, SK Hynix, and others, are long-term partners. Over 70% of Phison's revenue contribution comes from "non-consumer" NAND storage applications, including servers, automotive systems, embedded systems, industrial applications, gaming consoles, and generative AI, allowing Phison to maintain relatively stable revenue and profitability despite fluctuations in the NAND industry. Phison's mastery of the entire NAND industry ecosystem, including its relationships with upstream NAND makers, supply chain partners for NAND controllers and storage modules, and downstream NAND storage application customers, represents invaluable and irreplaceable value that Phison brings to its global clients and partners. It is also a key advantage that enables Phison to stand firm in the NAND industry. [About PHISON] Phison Electronics Corp. (TPEX:8299) is a global leader in NAND Flash controller IC and storage solutions. We provide a variety of services from controller design, system integration, IP licensing to total turnkey solutions, covering applications across SSD (PCIe/SATA/PATA), eMMC, UFS, SD and USB interfaces, reaching out to consumer, industrial and enterprise markets. As an active member of industry associations, Phison is on the Board of Directors for SDA, ONFI, UFSA and a contributor for JEDEC, PCI-SIG, MIPI, NVMe and IEEE-SA. To know more about Phison, please visit Phison Website or Phison Q&A for details. [Forward-looking Statements] Information included in this press release that are not historical in nature are "forward-looking statements". Phison cautions readers that forward-looking statements are based on Phison's reasonable knowledge and current expectations, and are subject to various risks and uncertainties. Actual results may differ materially from those contained in such forward-looking statements for a variety of reasons including without limitation, risks associated with demand and supply change, manufacturing and supply capacity, design-win, time to market, market competition, industrial cyclicality, customer's financial condition, exchange rate fluctuation, legal actions, amendments of the laws and regulations, global economy change, natural disasters, and other unexpected events which may disrupt Phison's business and operations. Accordingly, readers should not place reliance on any forward-looking statements. Except as required by law, Phison undertakes no obligation to update any forward-looking statement, whether as a result of new information, future events, or otherwise. View source version on Contacts PHISON Spokesperson Antonio YuTEL: 037-586-896 #10019Mobile: 0979-105-026Email: antonioyu@ PHISON Deputy Spokesperson Kuo-Ting LuTEL: 037-586-896 #26022Mobile: 0979-075-330Email: kuoting_lu@ Sign in to access your portfolio
Globe and Mail
10-03-2025
- Business
- Globe and Mail
SEALSQ will showcase its latest Quantum Resistant Chip and PKI services next week at Embedded World Electronic Fair in Germany
Geneva, Switzerland, March 10, 2025 (GLOBE NEWSWIRE) -- SEALSQ Corp (NASDAQ: LAES) ("SEALSQ" or "Company"), a company specializing in Semiconductors, PKI, and Post-Quantum technology hardware and software products, today announced its participation at Embedded World 2025, taking place from March 11-13, 2025, in Nuremberg, Germany. SEALSQ will be exhibiting in Hall 3, Booth 417, alongside its valued partner INELTEK, a leading distributor of innovative electronic components. At Embedded World 2025, SEALSQ will unveil its latest advancements in Post-Quantum Cryptography (PQC) and secure IoT solutions, with live demonstrations highlighting the company's commitment to securing connected devices in the quantum era. Live Demonstrations at SEALSQ's Booth Include: Post-Quantum Hardware in Action SEALSQ will showcase its new Post-Quantum Hardware Platform, executing quantum-resistant algorithms selected by NIST, including Kyber for key encapsulation and Dilithium for digital signatures. Visitors will witness first-hand how SEALSQ's hardware is designed to withstand the evolving threat posed by quantum computers. Matter Commissioning Demo with VaultIC292 SEALSQ will also demonstrate seamless Matter commissioning using the VaultIC292, SEALSQ's secure microcontroller optimized for IoT device security and compliance with the Matter standard. This live demo will highlight the ease of securely onboarding devices to Matter ecosystems. Post-Quantum Certificates from INeS PKI SEALSQ will present its INeS PKI platform, demonstrating the generation of post-quantum certificates for IoT devices. This demo will showcase how SEALSQ leverages quantum-resistant algorithms to ensure device identities and communications remain secure even in a post-quantum world. "We are excited to return to Embedded World and to demonstrate how SEALSQ is actively helping businesses future-proof their devices against emerging threats,' said Franck Buonanno, VP of Sales of SEALSQ. 'With the support of our partner INELTEK, we are bringing to the forefront advanced solutions combining our secure hardware, post-quantum cryptography, and scalable PKI for IoT ecosystems.' About Embedded World Embedded World is the leading international trade fair for embedded systems, attracting over 30,000 visitors and hosting more than 1,100 exhibitors from across the globe. Held annually in Nuremberg, Germany, the event serves as a premier platform for showcasing the latest advancements in embedded technologies, from secure microcontrollers and software to connectivity and artificial intelligence. With attendees representing more than 70 countries, Embedded World plays a critical role in shaping the future of the embedded industry, offering SEALSQ a valuable opportunity to engage with key industry players, potential customers, and technology partners About INELTEK INELTEK GmbH is a leading European distributor of semiconductors and electronic components, offering comprehensive support and innovative solutions to its customers across industries. Event Details: Dates: March 11-13, 2025 Location: Exhibition Centre Nuremberg, Nuremberg, Germany Booth: Hall 3, Booth 417 (with INELTEK) About SEALSQ: SEALSQ focuses on selling integrated solutions based on Semiconductors, PKI and Provisioning services, while developing Post-Quantum technology hardware and software products. Our solutions can be used in a variety of applications, from Multi-Factor Authentication tokens, Smart Energy, Smart Home Appliances, Medical and Healthcare and IT Network Infrastructure, to Automotive, Industrial Automation and Control Systems. Post-Quantum Cryptography (PQC) refers to cryptographic methods that are secure against an attack by a quantum computer. As quantum computers become more powerful, they may be able to break many of the cryptographic methods that are currently used to protect sensitive information, such as RSA and Elliptic Curve Cryptography (ECC). PQC aims to develop new cryptographic methods that are secure against quantum attacks. For more information, please visit Forward-Looking Statements This communication expressly or implicitly contains certain forward-looking statements concerning SEALSQ Corp and its businesses. Forward-looking statements include statements regarding our business strategy, financial performance, results of operations, market data, events or developments that we expect or anticipates will occur in the future, as well as any other statements which are not historical facts. Although we believe that the expectations reflected in such forward-looking statements are reasonable, no assurance can be given that such expectations will prove to have been correct. These statements involve known and unknown risks and are based upon a number of assumptions and estimates which are inherently subject to significant uncertainties and contingencies, many of which are beyond our control. Actual results may differ materially from those expressed or implied by such forward-looking statements. Important factors that, in our view, could cause actual results to differ materially from those discussed in the forward-looking statements include SEALSQ's ability to implement its growth strategies, SEALSQ's ability to continue beneficial transactions with material parties, including a limited number of significant customers; market demand and semiconductor industry conditions; and the risks discussed in SEALSQ's filings with the SEC. Risks and uncertainties are further described in reports filed by SEALSQ with the SEC. SEALSQ Corp is providing this communication as of this date and does not undertake to update any forward-looking statements contained herein as a result of new information, future events or otherwise.
