Latest news with #EmbeddedWorld2025
Associated Press
26-04-2025
- Business
- Associated Press
ARBOR Technology to Showcase Latest Automation Solutions at Automate 2025, Powering Machine Vision, AMR, and Smart Retail Applications
DETROIT, April 26, 2025 /PRNewswire/ -- ARBOR Technology, a leading provider of industrial-grade embedded computing solutions, is excited to announce its participation in Automate 2025, taking place in Detroit, USA, from May 12–15. Located in Hall E, Booth #9126. Engineered for advanced automation tasks, the FPC-5211 supports powerful edge computing for real-time data processing and AI inference. Ideal for machine vision and smart city applications, it handles data from multiple sources—LiDAR, industrial cameras, traffic sensors—with low latency and high efficiency. This platform recently earned the Best in Show award from Embedded Computing Design at Embedded World 2025. Designed for flexible industrial deployment, the ARES-1983H series features a din-rail mount and EzIO modular I/O system, allowing customers to easily customize configurations for factory automation, process control, and machine interfacing. ARBOR introduces the ARTS-1670 and SB-244-RPLU for autonomous mobile robots (AMR) and automated guided vehicles (AGV). Engineered for performance and durability, these systems meet the rigorous demands of real-time navigation, sensor integration, and operational control in dynamic environments. Built for real-time video and language model (VLM) applications, the AEC-6100 delivers top-tier AI performance at the edge. Ideal for smart surveillance, automated inspection, and robotics, it reduces latency and enhances on-site processing without compromising security. Powered by Intel® Core™ Ultra processors, the IEC-3714 delivers 34 TOPS of AI performance in NUC size. It supports real-time video analytics for age, gender, and object recognition, enabling automated decision-making for promotions, restocking, and customer engagement. With its MediaTek MT8781 processor and Android 14 OS, the Ruby 10 is built for mobility, featuring Wi-Fi 6E, 4G connectivity, and hot-swappable batteries for 24/7 operation. Designed for retail and logistics, it supports NFC payments, and has IP65 and 1.2m drop certifications for dependable performance in harsh environments. ARBOR will also unveil its latest Computer-on-Module solution, offering exceptional computing scalability based on Intel's Core Ultra and Arrow Lake platforms. These modules are optimized for embedded applications requiring compact, high-performance solutions with broad customization options. Stanley, General Manager of ARBOR Solution, commented: 'We are proud to return to Automate 2025 with a strong lineup of automation-focused solutions. Our innovations not only address the needs of traditional industrial applications but also support emerging technologies like AI and edge computing.' Automate 2025 Detroit, Huntington Place May 12-15 Hall E - #9126 View original content to download multimedia: SOURCE ARBOR Technology
Yahoo
26-03-2025
- Business
- Yahoo
Himax Technologies (NasdaqGS:HIMX) Partners With Tata Electronics to Enhance India's Semiconductor Ecosystem
Himax Technologies recently announced a significant strategic partnership with Tata Electronics and PSMC, aimed at bolstering India's semiconductor ecosystem, which might have contributed to the company's 2.47% price increase over the last quarter. Additionally, the company's participation in the Embedded World 2025, showcasing their advanced AI technologies, likely provided positive investor sentiment. This occurred amid broader market trends where the Dow Jones and Nasdaq experienced mixed movements, with a notable decline led by technology stocks like Tesla and Nvidia. Despite market volatility, Himax's strategic moves may have supported its positive quarterly performance. Himax Technologies has 2 warning signs we think you should know about. AI is about to change healthcare. These 23 stocks are working on everything from early diagnostics to drug discovery. The best part - they are all under $10b in market cap - there's still time to get in early. Over the past five years, Himax Technologies has achieved a total return of 296.73%, including share price appreciation and dividends. This performance could be attributed to several key developments. The company has formed significant strategic alliances, such as the Memorandum of Understanding with Tata Electronics and Powerchip Semiconductor Manufacturing Corporation in March 2025, aimed at strengthening India's semiconductor ecosystem. Additionally, Himax has enhanced its product offerings, notably its WiseEye AI technology and automotive IC solutions, showcased during CES 2025 and Embedded World 2025. Himax's earnings growth has been impressive, bolstered by advancements in automotive TDDI, Tcon technologies, and Co-Package Optics (CPO). In the recent earnings report for Q4 2024, Himax's revenue rose to US$237.22 million, with net income reaching US$24.61 million. However, the company anticipates a potential revenue decline for Q1 2025. Despite these short-term fluctuations and dividend adjustments, Himax has sustained its growth through product innovations and strategic market expansions, outperforming the US semiconductor industry returns over the past year. Review our growth performance report to gain insights into Himax Technologies' future. This article by Simply Wall St is general in nature. We provide commentary based on historical data and analyst forecasts only using an unbiased methodology and our articles are not intended to be financial advice. It does not constitute a recommendation to buy or sell any stock, and does not take account of your objectives, or your financial situation. We aim to bring you long-term focused analysis driven by fundamental data. Note that our analysis may not factor in the latest price-sensitive company announcements or qualitative material. Simply Wall St has no position in any stocks mentioned. Companies discussed in this article include NasdaqGS:HIMX. Have feedback on this article? Concerned about the content? with us directly. Alternatively, email editorial-team@ Sign in to access your portfolio
Yahoo
15-03-2025
- Business
- Yahoo
Intel's Panther Lake appears in public for the first time — what we know about the new chip
When you buy through links on our articles, Future and its syndication partners may earn a commission. It's no secret that Intel has struggled the last couple of years, with even the U.S. government considering stepping in to ensure the company survives. So, it's a bit of a big deal that Intel appears excited about its upcoming Panther Lake CPU, which was shown to the public for the first time in Germany. The new system-on-chips were seen by the German publication PC Games Hardware (via Wccftech) during the Embedded World 2025 event. This marks our first look at the Intel Core Ultra 300 mobile platform and, as more information comes out, what Intel's new 18A process will look like. If Intel is to dig out of its hole, the 18A process and Panther Lake need to be successful. The Panther Lake-H lineup will reportedly be the first entry, followed by HX variants at a later date. According to reports, the Core Ultra 300 lineup will feature Cougar Cove P-Cores and Skymont E-Cores. The iGPU is supposedly going to feature Xe3, an Xe architecture update which Wccf says is codenamed Celestial. Apparently, the new chips will have up to 16 cores and hit 180 TOPS for AI power. For reference, Microsoft currently requires PCs to hit 40 TOPs to be considered a Copilot Plus PC. Intel has a lot of competition in the CPU space now, as Qualcomm is building its own ARM-based chips and TSMC seems ready to take over the entire chip world from phones to laptops and everything in between. So, a strong debut for Panther Lake almost feels necessary. During Computex 2024, Intel confirmed that the Panther Lake series would launch in the second half of 2025. Though consumer devices might not launch until 2026. Intel Core Ultra 200U, 200H, 200HX and 200S PCs coming this month — here's everything we know Intel Nova Lake CPU specs leaked — and it's tipped to double PC performance Intel Core Ultra 9 275HX CPU is the best-performing laptop processor according to new benchmarks — but Apple still beats it in this key area
Yahoo
15-03-2025
- Business
- Yahoo
Panther Lake launch timeline looks clearer after first public showcase
Intel's Panther Lake chip has now been showcased in public, with the tech brand putting it on display at the Embedded World 2025 conference in Nuremberg, Germany. The Dutch publication, PC Games Hardware shared images of the chip on display, noting that this is the first time the Panther Lake SoC has been seen publicly, not being held up by Intel's former CEO Pat Gelsinger. With the company discussing more of its plans and timelines for the Panther Lake rollout in 2025 and beyond at the conference, more of the component's release strategy has become a lot clearer. Also referred to as the 'Core Ultra 300' mobile platform, Intel is banking on the Panther Lake being a powerful chip as it will be manufactured on the company's custom 18A process. Panther Lake follows the Core Ultra 100 'Meteor Lake' chip, which was released in 2023, and the Core Ultra 200 'Lunar Lake' chip, which is Intel's current flagship. Wccftech noted that Intel's Foundry business is counting on a successful rollout of the Panther Lake to propel its future in the market. The company has already detailed plans to introduce the Panther Lake-H lineup as its premiere offering, then Panther Lake-HX, and others. The coming chip will likely feature the Cougar Cove P-Cores and Skymont E-Cores architectures, as per current reports. Additionally, it is set to include the third-generation Xe3, onboard iGPU, codenamed 'Celestial.' The component follows the second-generation Xe 2 GPU 'Battlemage'. The Xe3 is expected to support at least 16 cores, powering up to 180 TOPS of AI power among its specifications, Wccftech noted. While the Core Ultra 300 is set to be manufactured under the 18A process, PC Games Hardware noted that Intel has split its production between its own Foundry and TSMC, with the latter manufacturer taking charge of the Xe3 graphics portion of the chip. Overall, Intel is still set to announce Panther Lake during the mid-2025 timeframe. This should put hardware partners on schedule to have products ready by January, in time for the coming CES 2026. The industry will surely be excited to see how the SoC will perform alongside similar next-generation chips from competitors.
Associated Press
11-03-2025
- Business
- Associated Press
AMI and congatec Celebrate 20 Years of Successful Partnership
ATLANTA and DEGGENDORF, Germany, March 11, 2025 /PRNewswire/ -- AMI®, the global leader in Dynamic Firmware for worldwide computing, and congatec, a leading provider of embedded and edge computing technology, today announced the celebration of their 20-year business partnership. Since 2005, AMI and congatec have worked closely together to deliver innovative embedded computing solutions to customers worldwide. This long-standing collaboration has driven both companies to develop advanced technologies and provide exceptional support to their shared customer base - even for the most sophisticated technical challenges for embedded systems. 'We are thrilled to celebrate 20 years of successful partnership with congatec,' said Sanjoy Maity, CEO of AMI. 'Our companies have collaborated extensively to push the boundaries of embedded computing over the past two decades - so it is very fitting that we mark this occasion here at the opening of Embedded World 2025.' 'From the very beginning, AMI has been a trusted and invaluable partner in congatec's journey toward market excellence. Their deep expertise in BIOS and firmware solutions has been instrumental in enabling us to deliver the highest standards of performance, reliability, and security with our COMs. We look forward to continuing our collaboration for decades to come, driving innovation in embedded and edge computing,' said Dr. Dominik Ressing, CEO of congatec. Imran Ahmad, AMI Chief Sales Officer, added that 'As a party to the signing of our original agreement with congatec, I have witnessed what our two companies have achieved together with great pride. This 20-year milestone between AMI and congatec is a testament to our shared commitment to innovation, quality, and customer satisfaction. We look forward to many more years of fruitful collaboration together as we continue to drive progress in the embedded computing industry.' 'AMI has been an extremely reliable partner for congatec for the past 20 years,' said Christian Riesinger, Founding Member and Senior FAE of congatec. 'As our very first technology partner, AMI has been with us every step of the way. In fact, we signed our original agreement with AMI while congatec was still a start-up! But AMI treated us as a valued partner from the beginning, quickly earning our trust through their expertise and high-quality implementation. We have always been satisfied with the high level of technical support AMI has provided to us. Together, we have empowered innovation with secure, high-performance embedded building blocks, so our customers can promptly seize opportunities and establish themselves as industry frontrunners.' The 20-year partnership between AMI and congatec has resulted in the development of numerous successful embedded computing products and solutions. By combining AMI's expertise in UEFI firmware and remote management technologies with congatec's leadership in standardized and customized embedded computer boards and modules, the two companies continue to deliver comprehensive, high-performance embedded computing platforms to our customers. Looking to the future, AMI and congatec remain committed to strengthening their partnership and delivering even more innovative embedded solutions to meet the evolving needs of their global customer base. About congatec congatec is a leading global provider of high-performance hardware and software building blocks for embedded and edge computing solutions based on Computer-on-Modules (COMs). These advanced computer modules drive systems and devices across industries such as industrial automation, medical technology, robotics, telecommunications, and more. congatec's high-performance aReady. ecosystems simplify and accelerate the solution development, from COM to cloud. This application-ready approach combines COMs with services and customizable technologies that enable cutting-edge advancements in system consolidation, IoT, security, and artificial intelligence. Supported by its majority shareholder, DBAG Fund VIII – a German mid-market fund focused on driving growth for industrial enterprises – congatec has the financial backing and M&A expertise to capitalize on expanding market opportunities. For more information, visit or follow us on LinkedIn and YouTube. About AMI AMI is Firmware Reimagined for modern computing. As a global leader in Dynamic Firmware for security, orchestration, and manageability solutions, AMI enables the world's compute platforms from on-premises to the cloud to the edge. AMI's industry-leading foundational technology and unwavering customer support have generated lasting partnerships and spurred innovation for some of the most prominent brands in the high-tech industry.
