Latest news with #High-DensityInterconnect
Malaysian Reserve
6 hours ago
- Business
- Malaysian Reserve
Polymatech Electronics Limited Announces Completion of PCB Manufacturing Facility in Europe
CHENNAI, India, Aug. 14, 2025 /PRNewswire/ — Polymatech Electronics Limited is thrilled to announce the successful commissioning of its state-of-the-art Printed Circuit Board (PCB) manufacturing facility in Estonia, Europe. This milestone represents a significant advancement in the company's strategic expansion across the European market. The new facility features around 10,000-square-foot cleanroom equipped with cutting-edge machinery, capable of producing up to 50,000 square meters of multi-layer High-Density Interconnect (HDI) PCBs annually. Leveraging advanced European technology, the facility meets the stringent industry standards demanded by premium mobile phone manufacturers and critical sectors, including defense, aerospace, automotive electronics, semiconductor manufacturing, telecommunications infrastructure, industrial electronics, and security. 'Our European-made PCBs, crafted with European expertise and adhering to the highest quality standards, are in high demand across various high-end applications,' said Mr. Eswara Rao Nandam, CEO Polymatech Electronics Limited. 'This facility underscores our commitment to innovation, quality, and precision, positioning us to deliver tailored, engineered solutions to some of the most demanding industries.' This development marks a pivotal step in transforming Polymatech into a comprehensive solutions provider, evolving from a component supplier into a product-centric organization. The Estonia facility underscores Polymatech's evolution from a component supplier to a product-centric solutions provider. 'Since incorporating the Company on November 18, 2024, and commencing operations on August 8, 2025, this facility exemplifies our dedication to quality, reliability, and customer-centric innovation,' said Tarja Rapala, Director of Polymatech Electronics and Head of PCB Business. 'With meticulously maintained equipment and a highly skilled team, we are poised to deliver rapid, sustainable PCB solutions and foster strategic partnerships across Europe.' Dr. Allen Nejah, Chief Innovation Officer of Polymatech Electronics Limited, added, 'This facility is a remarkable achievement that enhances our ability to deliver sophisticated PCB solutions for Europe's technological and defense sectors. PCB is the mother for electronic equipment and this facility enables Polymatech transformation from component manufacturer to product manufacturer, this will be a paradigm shift in the Polymatech's business profile and help us to release products faster in the market. This facility portfolio includes high-speed PCBs, advanced HDI PCBs, high-frequency PCBs, and multi-layer configurations—up to 48 layers—designed for high-end electronics. Mr. Urmas Aruoja, CEO, stated, 'We deliver PCBs in as little as 24 hours. Our flexible PCBs are integral to smartphones, notebooks, smart wearable devices, and many other products. Our Substrate-Like PCBs (SLPs), HDI PCBs, Rigid-Flex PCBs (RPCBs), Integrated Circuit Substrates (ICS), RF PCBs, and high-density modules are designed for advanced applications. Our HDI PCBs feature high-density attributes, including laser microvias, sequential lamination structures, fine lines, and high-performance thin materials, enabling greater functionality per unit area. Advanced HDI PCBs incorporate multiple layers of copper-filled stacked microvias, providing complex interconnections for large pin-count, fine-pitch, and high-speed chips in cutting-edge technology products.' About Polymatech Electronics Limited Polymatech Electronics Limited is a global leader in advanced electronics manufacturing, specializing in semiconductor solutions—from ingots to end products. Committed to innovation, the company delivers transformative technologies every six months, enhancing everyday life by integrating cutting-edge solutions across consumer and industrial applications. Polymatech is a key player in the global technology market, holding significant market share in semiconductors, modules, and electronic components for industries including retail, finance, agriculture, and healthcare. With a vision to become a comprehensive end-to-end solutions provider, Polymatech continues to drive excellence and innovation worldwide. Photo – – View original content:
Time of India
2 days ago
- Business
- Time of India
Polymatech completes ₹1,000 cr PCB plant in Estonia; eyes defence, high-end mobile segments
New Delhi: Polymatech Electronics has commissioned its printed circuit board manufacturing facility in Estonia, Europe, that entails an investment of 100 million euros (around ₹1,000 crore), the company said on Monday. The new facility has around 10,000 square feet of cleanroom equipped with cutting-edge machinery, capable of producing up to 50,000 square meters of multi-layer High-Density Interconnect (HDI) PCBs annually for use in high-end electronic products like telecom equipment, smartphones, wearables, aerospace, etc. "Our European-made PCBs, crafted with European expertise and adhering to the highest quality standards, are in high demand across various high-end applications. This facility underscores our commitment to innovation, quality, and precision, positioning us to deliver tailored, engineered solutions to some of the most demanding industries," Polymatech Electronics CEO Eswara Rao Nandam said in a statement. The Tamil Nadu-based company's Estonian arm was incorporated on November 18, 2024, and commenced operations on August 8. Nandam said that the company has earmarked an investment of 100 million euros in the plant by 2027. "With meticulously maintained equipment and a highly skilled team, we are poised to deliver rapid, sustainable PCB solutions and foster strategic partnerships across Europe," Polymatech Electronics, Director and Head of PCB Business, Tarja Rapala said. Leveraging advanced European technology, the facility claims to meet the stringent industry standards demanded by premium mobile phone manufacturers and critical sectors, including defence, aerospace, automotive electronics, semiconductor manufacturing, telecommunications infrastructure, industrial electronics, and security. Polymatech Electronics Chief Innovation Officer Allen Nejah said that it can deliver sophisticated PCB solutions for Europe's technological and defence sectors. "PCB is the mother of electronic equipment and this facility enables Polymatech transformation from component manufacturer to product manufacturer, this will be a paradigm shift in Polymatech's business profile and help us to release products faster in the market. "This facility portfolio includes high-speed PCBs, advanced HDI PCBs, high-frequency PCBs, and multi-layer configurations-up to 48 layers-designed for high-end electronics," Nejah said.
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Business Standard
27-06-2025
- Business
- Business Standard
Monthly stock picks by Motilal Oswal Financial Services: HDFC Bank, UTI AMC
Stocks to buy: LargeCap HDFC BANK – Target: ₹2,200 HDFC Bank continues to demonstrate resilience in Q4FY25, with net profit at ₹176.2b {+7 per cent year-on-year (Y-o-Y)}, supported by 10.3 per cent net interest income (NII) growth and stable margins at 3.46 per cent. Strong asset quality gross non-performing asset/ net non-performing asset (GNPA/NNPA at 1.33 per cent/0.43 per cent) and healthy deposit growth (14 per cent Y-o-Y) led to a moderation in the C/D ratio to 96.5 per cent. Loan growth remained steady at 5.4 per cent Y-o-Y, led by retail and agri segments. We expect loan growth of 10 per cent/13 per cent over FY26/FY27. The ₹12,500 crore IPO of HDB Financial will unlock value and strengthen HDFC Bank's capital position, enhancing long-term growth visibility. Trent – Target: ₹6,900 Trent aspires to grow 25 per cent annually over the long term, aligned with our FY25–27E revenue compound annual growth rate (CAGR) through its differentiated proposition to drive repeat purchases from a critical mass of consumers while staying relevant to the evolving consumer needs. India's retail market is set to hit $2.2t by 2034, led by a young, urbanised, and digitally connected population. Fashion and lifestyle segment is expected to grow at 10–12 per cent CAGR to ₹18 trillion by 2028. Despite 6.5x revenue growth over FY19-25, Trent's share remains in low-single digits, which augurs well for the company. We remain positive on Trent for its robust footprint additions, strong double-digit growth, long runway for growth in Star (presence in just 10 cities) and emerging categories like beauty and lab-grown diamonds. We expect FY25–27E CAGR of 25–26 per cent in standalone revenue, Earnings before interest, tax, depreciation and amortisation (Ebitda), and profit after tax (PAT), driven by the continuation of robust area additions in Zudio. MidCap Kaynes Tech – Target: ₹7,300 Kaynes Technologies is expanding across electronics manufacturing services (EMS), High-Density Interconnect (HDI) PCB manufacturing, and Outsourced Semiconductor Assembly and Test (Osat), targeting high-tech, high-margin segments. It aims to achieve $1 billion revenue by FY28, supported by strong orders in automotive, aerospace, industrial, and medical sectors, along with strategic North American acquisitions. HDI PCB and OSAT units are expected to commercialise by Q4FY26, targeting ₹2,500 crore revenue in FY27 and ₹5,000 crore by FY28, with robust margins (30 per cent/20 per cent). FY25 revenue rose 51 per cent Y-o-Y to ₹2,700 crore, slightly below guidance due to railway order delays. We estimate revenue/Ebitda/PAT CAGR of 57 per cent/61 per cent/70 per cent over FY25–27, driven by scale and margin gains. Federal Bank - Target: ₹230 Federal Bank has demonstrated strong business growth, rebalancing its portfolio toward medium- and high-yielding segments like loan against property (LAP), used CVs, gold loans and credit cards to drive profitability. We estimate loan growth to sustain at 17 per cent CAGR over FY25-28E, with asset quality remaining robust. Deposit growth is expected to accelerate at 15 per cent CAGR over FY25–28, driven by a CA-led CASA push, a stronger NR franchise, and branch realignment. CASA ratio is expected to rise to 34–35 per cent by FY28E. Asset quality remains strong with GNPA/NNPA at 1.84 per cent/0.44 per cent and provisions coverage ratio above 75 per cent. Under new CEO Mr. KVS Manian, Federal Bank is addressing its gaps and pivoting toward sustainable, return-driven growth across businesses and geographies. We estimate return on asset/ return on equity (RoA/RoE) at 1.4 per cent/15.6 per cent by FY28E, driven by better margins, asset mix shift, and improved cost efficiency. Federal Bank is one of our preferred 'Buy' rated ideas among mid-size private banks. SmallCap Time Techno - Target: ₹578 TIME is the world's largest maker of large-size plastic drums with a 50–60 per cent market share in India and a strong presence in 10 countries. It ranks 3rd globally in intermediate bulk containers (IBC), and is the 2nd largest Type-IV composite LPG/CNG cylinder manufacturer. We remain optimistic on growth led by its value-added composite products segment, backed by stable industrial packaging and strong financial discipline. With annual free cash flow of ₹400 crore, robust OCF/Ebitda (~60 per cent) and free cash flow/ profit after tax (FCF/PAT) (80 per cent), Time targets a net cash position by FY27E. We estimate a CAR of 15 per cent/16 per cent/23 per cent over FY25–28E, supported by asset monetisation, restructuring, and cost optimisation. UTI AMC - Target: ₹1,550 UTI AMC expanded its product suite with launches of a Quant Fund (Q4) and Multi-Cap Fund (Apr'25), along with smart beta & thematic index offerings. Q4 quarterly average asset under management (QAAUM) rose 17 per cent Y-o-Y, led by strong passive inflows and rising systematic investment plan (SIP) traction. It continues to deepen penetration in B30 cities, with 22 per cent of monthly average asset under management (AUM) in Mar '25 from these regions, against industry average of 18 per cent. It also added 68 new Tier-2/3 branches in FY25, aiding 0.9 million net folio additions. We project AUM/Revenue/Core PAT CAGR of 17 per cent/13 per cent/20 per cent over FY25–27. Growth will be supported by product innovation, strong Employees' Provident Fund Organisation (EPFO) mandates, digital distribution, and increasing demand for low-cost passive and hybrid investment strategies.
