Latest news with #Intel18A
Yahoo
14-05-2025
- Business
- Yahoo
QuickLogic Corp (QUIK) Q1 2025 Earnings Call Highlights: Strategic Partnerships and Revenue ...
Release Date: May 13, 2025 For the complete transcript of the earnings call, please refer to the full earnings call transcript. QuickLogic Corp (NASDAQ:QUIK) secured the first of two EFPGA hard IP contracts for Intel 18A designs, with the second expected in Q4. The company has been recognized as the first available source for EFPGA hard IP for Intel 18A, enhancing its market position. QuickLogic Corp (NASDAQ:QUIK) has been named a partner in the Intel Foundry Accelerator Chilet Alliance, indicating strong industry partnerships. The inclusion of EFPGA hard IP in Faraday's new SOC development platform is expected to generate revenue in the second half of 2025. QuickLogic Corp (NASDAQ:QUIK) anticipates solid revenue growth, non-gap profitability, and positive cash flow for the full year 2025. Revenue guidance for Q2 2025 is lower than anticipated due to a delay in a large IP contract, impacting short-term financial performance. Total revenue for Q1 2025 was down 28% from Q1 2024, indicating a decline in year-over-year performance. Non-gap gross margin in Q1 was significantly lower than previous quarters, affected by cost allocations. The company reported a non-gap net loss of $1.1 million for Q1 2025, compared to a net income in the previous year. QuickLogic Corp (NASDAQ:QUIK) continues to face risks related to market acceptance of new products and intense competition. Warning! GuruFocus has detected 5 Warning Signs with QUIK. Q: Can you discuss the progress and revenue expectations related to Intel 18A and its applications in commercial and defense markets? A: Brian Faith, CEO: We have been working on Intel 18A since we got access to the PDK version 1.0. Our efforts have led to a robust IP core, particularly appealing to the defense industrial base. We anticipate revenue from Intel 18A licenses this fiscal year, with royalties expected next year. The process is considered de-risked, and we are the only provider of EFPGA hard IP for Intel 18A, which is attracting significant interest from both commercial and defense sectors. Q: What are the key drivers for QuickLogic's anticipated revenue growth and profitability in the second half of 2025? A: Brian Faith, CEO: The growth will be driven by new IP contracts, including those related to Intel 18A and strategic radar contracts. These contracts have higher average selling prices compared to previous years. Our automated Australis platform allows us to adapt designs efficiently, supporting this growth with our current team size. Q: Can you elaborate on the storefront opportunities and their potential impact on QuickLogic's business? A: Brian Faith, CEO: We have several storefront opportunities, including the strategic radar contract and a direct-to-storefront contract. We are also exploring new opportunities from the Intel Direct Connect conference. Our EFPGA technology is well-suited for these applications, and we expect these storefront opportunities to contribute significantly to our revenue. Q: How does QuickLogic's technology help reduce costs in the defense market, particularly regarding verification and integration? A: Brian Faith, CEO: Our technology allows for the integration of discrete FPGA functions into a single chip, reducing size, weight, and power (SWaP) requirements. This integration also lowers verification costs by consolidating testing to a single chip, which is crucial for defense applications where multiple chips would otherwise require extensive testing. Q: What is the nature of QuickLogic's partnership with Faraday, and what markets are you targeting together? A: Brian Faith, CEO: Faraday will be the primary interface with customers, focusing on low-power industrial and IoT applications. We support them with use cases and training. The partnership aims to leverage our EFPGA technology in Faraday's SOC development platform, targeting applications that require low power and edge computing capabilities. For the complete transcript of the earnings call, please refer to the full earnings call transcript. This article first appeared on GuruFocus. Error in retrieving data Sign in to access your portfolio Error in retrieving data Error in retrieving data Error in retrieving data Error in retrieving data
Yahoo
13-05-2025
- Business
- Yahoo
QuickLogic Reports Fiscal First Quarter 2025 Financial Results
SAN JOSE, Calif., May 13, 2025 /PRNewswire/ -- QuickLogic Corporation (NASDAQ: QUIK) ("QuickLogic" or the "Company"), a developer of embedded FPGA (eFPGA) IP, ruggedized FPGAs and Endpoint AI solutions, today announced its financial results for the fiscal first quarter that ended March 30, 2025. Recent Highlights Delivered design-specific eFPGA Hard IP for Intel 18A customer Test Chip Announced eFPGA integration into Faraday Technology Corporation's FlashKit™-22RRAM SoC Development Platform Awarded $1.4 million Incremental Funding Modification (IFM) for its Strategic Radiation Hardened Program Extended $20 million credit facility maturity date from December 31, 2025 to December 31, 2026 for enhanced operational flexibility "Following significant investments during the last year, we developed and in April, delivered design-specific eFPGA Hard IP for a customer's Test Chip, on Intel 18A," said Brian Faith, CEO of QuickLogic. "We believe that being the first, and currently, only company to offer eFPGA Hard IP for Intel 18A puts us in a very strong position to capitalize on the increasing interest from United States Military, Aerospace, and Government ("USMAG") and commercial companies initiating new designs on Intel 18A technology. With this, the new Faraday Technologies FlashKit™ Development Platform in the market, and several contracts charted for Storefront, we believe our business model is building momentum." Fiscal First Quarter 2025 Financial Results Total revenue from continuing operations for the first quarter of fiscal 2025 was $4.3 million, a decrease of 23.7% compared with the first quarter of 2024 and a decrease of 23.8% compared with the fourth quarter of 2024. New product revenue from continuing operations was approximately $3.7 million in the first quarter of 2025, a decrease of $0.8 million, or 17.4%, compared with the first quarter of 2024 and a decrease of $0.9 million, or 19.1%, compared with the fourth quarter of 2024. The decreases in total revenue and new product revenue from continuing operations from the same period a year ago were mostly due to the timing of awards for certain large eFPGA IP contracts. Mature product revenue from continuing operations was $0.6 million in the first quarter of 2025. This compares to $1.1 million in the first quarter of 2024 and $1.0 million in the fourth quarter of 2024. First quarter 2025 GAAP gross margin from continuing operations was 43.4% compared with 67.1% in the first quarter of 2024 and 62.7% in the fourth quarter of 2024. First quarter 2025 non-GAAP gross margin from continuing operations was 45.6% compared with 72.4% in the first quarter of 2024 and 65.8% in the fourth quarter of 2024. First quarter 2025 GAAP operating expenses from continuing operations were $3.9 million compared with $3.7 million in the first quarter of 2024 and $3.5 million in the fourth quarter of 2024. First quarter 2025 non-GAAP operating expenses from continuing operations were $3.0 million compared with $2.5 million in the first quarter of 2024 and $2.8 million in the fourth quarter of 2024. First quarter 2025 GAAP net loss was ($2.2 million), or ($0.14) per share, compared with net income of $0.1 million, or $0.01 per share, in the first quarter of 2024, and a net loss of ($0.3 million), or ($0.02) per share, in the fourth quarter of 2024. First quarter 2025 non-GAAP net loss was ($1.1 million), or ($0.07) per share, compared with net income of $1.7 million, or $0.12 per share, in the first quarter of 2024, and a net income of $0.6 million, or $0.04 per share, in the fourth quarter of 2024. Conference Call QuickLogic will hold a conference call at 2:30 p.m. Pacific Time / 5:30 p.m. Eastern Time today, May 13, 2025, to discuss its current financial results. The conference call will be webcast on QuickLogic's IR Site Events Page at To join the live conference, you may dial (877) 407-0792 and international participants should dial (201) 689-8263 by 2:20 p.m. Pacific Time. No Passcode is needed to join the conference call. A recording of the call will be available approximately one hour after completion. To access the recording, please call (844) 512-2921 and reference the passcode 13753277. The call recording, which can be accessed by phone, will be archived through May 20, 2025, and the webcast will be available for 12 months on the Company's website. About QuickLogic QuickLogic is a fabless semiconductor company specializing in embedded FPGA (eFPGA) Hard IP, discrete FPGAs, and endpoint AI solutions. QuickLogic's unique approach combines cutting-edge technology with open-source tools to deliver highly customizable low-power solutions for aerospace and defense, industrial, computing, and consumer markets. For more information, visit QuickLogic uses its website ( the company blog ( corporate Twitter account (@QuickLogic_Corp), Facebook page ( and LinkedIn page ( as channels of distribution of information about its products, its planned financial and other announcements, its attendance at upcoming investor and industry conferences, and other matters. Such information may be deemed material information, and QuickLogic may use these channels to comply with its disclosure obligations under Regulation FD. Therefore, investors should monitor the Company's website and its social media accounts in addition to following the Company's press releases, SEC filings, public conference calls, and webcasts. Non-GAAP Financial Measures QuickLogic reports financial information in accordance with United States Generally Accepted Accounting Principles, or U.S. GAAP, but believes that non-GAAP financial measures are helpful in evaluating its operating results and comparing its performance to comparable companies. Accordingly, the Company excludes certain charges related to stock-based compensation, in calculating non-GAAP (i) income (loss) from operations, (ii) net income (loss), (iii) net income (loss) per share, and (iv) gross margin percentage. The Company provides this non-GAAP information to enable investors to evaluate its operating results in a manner like how the Company analyzes its operating results and to provide consistency and comparability with similar companies in the Company's industry. Management uses the non-GAAP measures, which exclude gains, losses, and other charges that are considered by management to be outside of the Company's core operating results, internally to evaluate its operating performance against results in prior periods and its operating plans and forecasts. In addition, the non-GAAP measures are used to plan for the Company's future periods and serve as a basis for the allocation of the Company's resources, management of operations and the measurement of profit-dependent cash, and equity compensation paid to employees and executive officers. Investors should note, however, that the non-GAAP financial measures used by QuickLogic may not be the same non-GAAP financial measures and may not be calculated in the same manner as that of other companies. QuickLogic does not itself, nor does it suggest that investors should, consider such non-GAAP financial measures alone or as a substitute for financial information prepared in accordance with U.S. GAAP. A reconciliation of U.S. GAAP financial measures to non-GAAP financial measures is included in the financial statements portion of this press release. Investors are encouraged to review the related U.S. GAAP financial measures and the reconciliation of non-GAAP financial measures with their most directly comparable U.S. GAAP financial measures. Forward Looking Statements This press release contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. These forward-looking statements include, without limitation, statements regarding our future profitability and cash flows, expectations regarding our future business and statements regarding the timing, milestones, and payments related to our government contracts, and statements regarding our ability to successfully exit SensiML, and actual results may differ due to a variety of factors including: delays in the market acceptance of the Company's new products; the ability to convert design opportunities into customer revenue; our ability to replace revenue from end-of-life products; the level and timing of customer design activity; the market acceptance of our customers' products; the risk that new orders may not result in future revenue; our ability to introduce and produce new products based on advanced wafer technology on a timely basis; our ability to adequately market the low power, competitive pricing and short time-to-market of our new products; intense competition by competitors; our ability to hire and retain qualified personnel; changes in product demand or supply; general economic conditions; political events, international trade disputes, natural disasters and other business interruptions that could disrupt supply or delivery of, or demand for, the Company's products; and changes in tax rates and exposure to additional tax liabilities. These and other potential factors and uncertainties that could cause actual results to differ materially from the results contemplated or implied are described in more detail in the Company's public reports filed with the U.S. Securities and Exchange Commission (the "SEC"), including the risks discussed in the "Risk Factors" section in the Company's Annual Reports on Form 10-K, Quarterly Reports on Form 10-Q and in the Company's prior press releases, which are available on the Company's Investor Relations website at and on the SEC website at In addition, please note that the date of this press release is May 13, 2025, and any forward-looking statements contained herein are based on management's current expectations and assumptions that we believe to be reasonable as of this date. We are not obliged to update these statements due to latest information or future events. QuickLogic and logo are registered trademarks of QuickLogic. All other trademarks are the property of their respective holders and should be treated as such. CODE: QUIK-E –Tables Follow – QUICKLOGIC CORPORATION CONDENSED CONSOLIDATED STATEMENTS OF OPERATIONS (in thousands, except per share amounts) (Unaudited) Three Months EndedMarch 30, 2025 March 31, 2024 December 29,2024Revenue$ 4,325 $ 5,669 $ 5,677Cost of revenue 2,4481,8652,119Gross profit 1,8773,8043,558Operating expenses: Research and development 1,2681,3211,514Selling, general and administrative 2,5362,3512,028Restructuring costs 54——Total operating expense 3,8583,6723,542Operating income (loss) (1,981)13216Interest expense (97)(69)(111)Interest and other (expense) income, net (7)1729Income (loss) before income taxes (2,085)80(66)(Benefit from) provision for income taxes 57(11)Net income (loss) from continuing operations (2,090)73(55)Net income (loss) from discontinued operations, net of taxes and inclusive of $87 in restructuring costs for the three months ended March 30, 2025 (101)35(250)Net income (loss)$ (2,191) $ 108 $ (305)Net income (loss) from continuing operations per share: Basic$ (0.14) $ 0.01 $ 0.00Diluted$ (0.14) $ 0.01 $ 0.00Net income (loss) per share: Basic$ (0.14) $ 0.01 $ (0.02)Diluted$ (0.14) $ 0.01 $ (0.02)Weighted average shares outstanding: Basic 15,29014,17714,869Diluted 15,29014,54514,869 Note: Net income (loss) equals total comprehensive income (loss) for all periods presented. Additionally, the Company notes that income taxes related to discontinued operations were immaterial in nature for the periods presented and as such, only net income (loss) from discontinued operations was reported herein. QUICKLOGIC CORPORATION CONDENSED CONSOLIDATED BALANCE SHEETS (in thousands) (Unaudited)March 30, 2025 December 29,2024ASSETS Current assets: Cash, cash equivalents and restricted cash$ 17,546 $ 21,859Accounts receivable, net of allowance for credit losses of $1 and $0, as of March 30, 2025 and December 29, 2024, respectively 1,5862,426Contract assets 4,1332,682Inventories 905940Prepaid expenses and other current assets 1,1521,666Assets of business held for sale, net 1531Total current assets 25,33729,604Property and equipment, net 17,02815,699Capitalized internal-use software, net 842711Right of use assets, net 687758Intangible assets, net 369378Non-marketable equity investment 300300Inventories, non-current 718718Note receivable, non-current 1,3231,292Other assets 117117Assets of business held for sale, net 2,3562,356TOTAL ASSETS$ 49,077 $ 51,933LIABILITIES AND STOCKHOLDERS' EQUITY Current liabilities: Revolving line of credit$ 15,000 $ 18,000Trade payables 2,6013,097Accrued liabilities 1,1841,587Deferred revenue 701444Notes payable, current 1,7031,928Lease liabilities, current 293284Liabilities of business held for sale —57Total current liabilities 21,48225,397Long-term liabilities: Lease liabilities, non-current 363447Notes payable, non-current 9151,202Total liabilities 22,76027,046Commitments and contingencies Stockholders' equity: Preferred stock, $0.001 par value; 10,000 shares authorized; no shares issued and outstanding ——Common stock, $0.001 par value; 200,000 authorized; 15,824 and 15,336 shares issued and outstanding as of March 30, 2025 and December 29, 2024, respectively 1615Additional paid-in capital 337,888334,268Accumulated deficit (311,587)(309,396)Total stockholders' equity 26,31724,887TOTAL LIABILITIES AND STOCKHOLDERS' EQUITY$ 49,077 $ 51,933 QUICKLOGIC CORPORATION SUPPLEMENTAL RECONCILIATIONS OF US GAAP AND NON-GAAP FINANCIAL MEASURES (in thousands, except per share amounts and percentages) (Unaudited)Three Months EndedMarch 30, 2025 March 31, 2024 December 29,2024US GAAP operating income (loss)$ (1,981) $ 132 $ 16Adjustment for stock-based compensation within: Cost of revenue 95298178Research and development 205199136Selling, general and administrative 636969575Restructuring costs 54——Non-GAAP operating income (loss)$ (991) $ 1,598 $ 905US GAAP net income (loss) from continuing operations$ (2,090) $ 73 $ (55)Adjustment for stock-based compensation within: Cost of revenue 95298178Research and development 205199136Selling, general and administrative 636969575Restructuring costs 54——Non-GAAP net income (loss) from continuing operations$ (1,100) $ 1,539 $ 834US GAAP net income (loss) from discontinued operations$ (101) $ 35 $ (250)Adjustment for stock-based compensation within: Research and development (32)15835Adjustment for restructuring costs 87——Non-GAAP net income (loss) from discontinued operations$ (46) $ 193 $ (215)Non-GAAP net income (loss)$ (1,146) $ 1,732 $ 619US GAAP net income (loss) from continuing operations per share, basic$ (0.14) $ 0.01 $ —Adjustment for stock-based compensation 0.060.100.06Adjustment for restructuring costs 0.01——Non-GAAP net income (loss) from continuing operations per share, basic$ (0.07) $ 0.11 $ 0.06US GAAP net income (loss) from discontinued operations per share, basic$ (0.01) $ — $ (0.02)Adjustment for stock-based compensation —0.01—Adjustment for restructuring costs 0.01——Non-GAAP net income (loss) from discontinued operations per share, basic$ — $ 0.01 $ (0.02)Non-GAAP net income (loss) per share, basic$ (0.07) $ 0.12 $ 0.04US GAAP net income (loss) from continuing operations per share, diluted$ (0.14) $ 0.01 $ —Adjustment for stock-based compensation 0.060.100.06Adjustment for restructuring costs 0.01——Non-GAAP net income (loss) from continuing operations per share, diluted$ (0.07) $ 0.11 $ 0.06US GAAP net income (loss) from discontinued operations per share, diluted$ (0.01) $ — $ (0.02)Adjustment for stock-based compensation —0.01—Adjustment for restructuring costs 0.01——Non-GAAP net income (loss) from discontinued operations per share, diluted$ — $ 0.01 $ (0.02)Non-GAAP net income (loss) per share, diluted$ (0.07) $ 0.12 $ 0.04US GAAP gross margin percentage 43.4 % 67.1 % 62.7 % Adjustment for stock-based compensation included in cost of revenue 2.2 % 5.3 % 3.1 % Non-GAAP gross margin percentage 45.6 % 72.4 % 65.8 % QUICKLOGIC CORPORATION SUPPLEMENTAL DATA (Unaudited)Percentage of Revenue Change in RevenueQ1 2025 Q1 2024 Q4 2024 Q1 2025 toQ1 2024 Q1 2025 toQ4 2024COMPOSITION OF REVENUE Revenue by product: (1) New products 87 % 75 % 81 % (17) % (19) % Mature products 13 % 19 % 18 % (49) % (45) % Discontinued Operations: New products — % 6 % 1 % (97) % (61) % Revenue by geography: Asia Pacific 8 % 12 % 10 % (51) % (33) % North America 90 % 78 % 85 % (17) % (20) % Europe 2 % 4 % 5 % (67) % (72) % Discontinued Operations: Asia Pacific — % — % — % — % (60) % North America — % 6 % — % (98) % (67) % Europe — % — % — % 100 % 100 % _____________________ (1) New products include all products manufactured on 180 nanometer or smaller semiconductor processes, eFPGA IP intellectual property, professional services, and QuickAI and SensiML AI software as a service (SaaS) revenue. Mature products include all products produced on semiconductor processes larger than 180 nanometer and includes related royalty revenue. View original content to download multimedia: SOURCE QuickLogic Corporation Error in retrieving data Sign in to access your portfolio Error in retrieving data Error in retrieving data Error in retrieving data Error in retrieving data
Forbes
30-04-2025
- Business
- Forbes
Key Takeaways From Intel Foundry Direct Connect 2025
Intel CEO Lip-Bu Tan On Stage At Direct Connect. Day one of Intel Foundry's Direct Connect event, which is currently underway in San Jose, California, just wrapped and I wanted to share some thoughts. The day was filled with interesting developments from both Intel itself and its diverse array of ecosystem partners. There was a time when no one in the semiconductor industry could build transistors like Intel, but a series of missteps and changes in strategy spread out over the better part of the last decade shifted that paradigm. Now, Intel is attempting to propel its manufacturing processes back into a leadership position, while simultaneously trying to woo fabless semiconductor customers to manufacture their chips in Intel's fabs. To do that, Intel has to establish more trust in the industry and not only prove the competitiveness of its processes, but also that partners can make the chips with familiar and established workflows, consistently and with high reliability. Just about everything I heard today made me believe Intel is on track to do just that. Intel's Dr. Naga Chandrasekaran Holding A Intel 14A Test Wafer. The day began with a keynote address by newly-minted CEO Lip-Bu Tan. Lip-Bu was refreshingly direct and to the point. He outlined a number of Intel Foundry's challenges, and what moves the company was making to address them and chart a successful course for Intel Foundry's future. What I found most assuring during Lip-Bu's time speaking, however, was the parade of partners he brought out on stage and what they had to say. In today's advance semiconductor market, there is no single entity that can be successful on its own – there are simply too many technologies and packaging innovations at play in modern multi-chiplet devices. To that end, Lip-Bu brought out the CEOs of essentially all of the leading EDA tools providers. Sassine Ghazi, Synopsys CEO, At Intel Foundry Direct Connect. Sassine Ghazi of Synopsys, Cadence's Anirudh Devgan, Mike Ellow of Siemens EDA, and PDF/Solutions' John Kibarian came out in succession and all explained how their tools, IP and/or flows have been optimized for Intel's upcoming 18A process and the work is underway for future nodes, like 18A-P, 14A and its derivatives (among others). This strong commitment from Intel's ecosystem partners should carry a lot of weight; the overwhelming majority of fabless semiconductor players will be familiar with these tools, which should facilitate transitions to Intel Foundry's manufacturing processes. All of the EDA providers also voiced their impressions of Intel 18A, which were universally positive. In fact, the scuttlebutt amongst industry insiders has been mostly positive regarding 18A for quite a while. Multiple conversations I've had with trusted folks from the automotive, mobile, and processor industries have all suggested Intel 18A is a highly competitive process. That said, there weren't any new customer announcements today. I suspect there will be more coming soon, however, once Intel Foundry begins talking more about Intel 18A-P, which is a higher performance derivative of 18A that's better suited to a wider array of applications. 18A is already a competitive process and Intel will be shipping its next-generation Panther Lake-based processors built on 18A in volume later this year, but 18A-P addresses some technical issues that should make it a better fit for a more diverse array of architectures. Cadence President & CEO Anirudh Devgan At Direct Connect. Anyone scrutinizing and paying close attention to Intel and its moves with Intel Foundry needs to understand some fundamental realities related to 18A. In addition to being a leading-edge process, with smaller features, it introduces two innovations – Ribbon FETs and PowerVia backside power delivery. It's hard enough to bring a new manufacturing process to market, let alone one with two new key technologies. And to realize the full capabilities of 18A requires chip designers to make specific considerations from the start. To move an existing design or a design that was already in-flight that was originally slated for an existing process to18A is possible, but it may not benefit from Ribbon FETs and to utilize backside power delivery, can incur additional cost. However, optimizing a design for 18A from the start will offset most of the cost related to backside power delivery by easing density requirements and eliminating the need for some metal layers on the frontside. It will also enable designers to realize the maximum benefits of Ribbon FETs, and optimize power, performance, and area. Of course, chip designs don't happen overnight, so it's going to take some time for Intel Foundry's future customers to navigate these waters and decide if 18A, one of its derivatives, or a future process will be the best fit. Intel 18A Details. As for the processes themselves, Intel made plenty of encouraging claims. 18A has already achieved 95%+ of its targets and the optimization areas have already been identified to tweak the process to hit or exceed 100% of those targets next quarter. Intel 18A should deliver a >15% improvement in performance per watt, with 1.3x improvement in chip density versus Intel 3, with an additional ~8% improvement in perf-per-watt coming with 18A-P, along with support for 3D die stacking. Intel 14A Disclosures. Intel Foundry also disclosed some numbers related to its future 14A process. 14A is looking particularly strong at this early stage; Intel is expecting a 15-20% performance per watt increase versus 18A, with another 1.3x increase in density, and a 25-35% reduction in power. Intel 14A will also make use of High NA EUV and introduce second generation Ribbon FETs and PowerDirect. PowerDirect is an evolution of PowerVia that enables direct contact power delivery. Intel Foundry Process Roadmap There was a lot more disclosed during Intel Foundry Direct Connect, including a number of advancements in packing technology that improve interconnect density and performance, but it's just too much to cram into this report. Suffice it to say, after digesting day one's disclosures, my confidence in Intel's foundry efforts has reached a new high. The innovations, technologies, and tools to enable them appear to be in place. Now it's a matter of bringing in new customers, executing, and getting new products to market. Considering the company's huge investments, and the geopolitical pressures to bring more advanced semiconductor manufacturing back to the U.S., I think Intel Foundry can pull this off.
TECHx
30-04-2025
- Business
- TECHx
Intel Foundry Unveils New Process and Packaging Updates
Home » Tech Value Chain » Global Brands » Intel Foundry Unveils New Process and Packaging Updates Intel Foundry hosted its Direct Connect 2025 event, revealing progress across process technology, advanced packaging, and manufacturing. The company also introduced new ecosystem programs and partnerships that support its systems foundry strategy. CEO Lip-Bu Tan opened the event, highlighting Intel Foundry's commitment to building a world-class systems foundry. He emphasized customer trust and the importance of an engineering-first culture. Other keynote speakers included Naga Chandrasekaran, chief technology and operations officer, and Kevin O'Buckley, general manager of Foundry Services. Throughout the day, Intel executives were joined by leaders from Synopsys, Cadence, Siemens EDA, PDF Solutions, MediaTek, Microsoft, and Qualcomm. They discussed collaborative efforts to help customers bring innovative products to market. Key Announcements Process Technology Intel Foundry shared early access to its new Intel 14A Process Design Kit (PDK). Multiple customers plan to build test chips on Intel 14A, the successor to Intel 18A. Intel 14A will feature PowerDirect, an enhancement over Intel 18A's PowerVia. Intel 18A is in risk production and will enter volume manufacturing this year. Two variants, Intel 18A-P and 18A-PT, are now in development. Intel 18A-P offers broader performance. Intel 18A-PT uses hybrid bonding with sub-5µm pitch. Intel's first 16nm tape-out is in the fab, with work underway on 12nm nodes in partnership with UMC. Advanced Packaging New offerings include EMIB-T, Foveros-R, and Foveros-B. These technologies enhance 3D stacking and high-bandwidth memory support. Intel is partnering with Amkor to expand packaging flexibility for customers. Manufacturing Intel's Arizona Fab 52 has processed its first 18A wafer. Volume production for 18A will begin in Oregon, with Arizona to follow. Intel 14A and 18A production will remain U.S.-based. Ecosystem Development Intel added new programs to its Foundry Accelerator Alliance. The new Intel Foundry Chiplet Alliance focuses on secure chiplet infrastructure. It aims to support government and commercial applications. The event demonstrated Intel Foundry's growing momentum across multiple fronts. With updates on process nodes, packaging technologies, domestic manufacturing, and ecosystem alliances, Intel continues to position itself as a strong player in the global semiconductor space. Intel Foundry plans to scale these capabilities further to support customers seeking trusted, U.S.-based manufacturing with advanced technology.
Zawya
30-04-2025
- Business
- Zawya
Intel Foundry gathers customers and partners, outlines priorities
UAE — Today at Intel Foundry Direct Connect, the company will share progress on multiple generations of its core process and advanced packaging technologies. The company will also announce new ecosystem programs and partnerships, and welcome industry leaders to discuss how a systems foundry approach enables collaboration with partners and unlocks innovation for customers. Intel CEO Lip-Bu Tan will open the event by discussing Intel Foundry's progress and priorities as the company drives the next phase of its foundry strategy. Naga Chandrasekaran, Intel Foundry chief technology and operations officer, and Kevin O'Buckley, general manager of Foundry Services, will also deliver keynotes during the morning session, sharing process and advanced packaging news while highlighting Intel Foundry's globally diverse manufacturing and supply chain. Tan will be joined on stage by ecosystem partners including Synopsys, Cadence, Siemens EDA and PDF Solutions to highlight collaboration in serving foundry customers. O'Buckley will be joined by executives from MediaTek, Microsoft and Qualcomm. 'Intel is committed to building a world-class foundry that serves the growing need for leading-edge process technology, advanced packaging and manufacturing,' said Tan. 'Our No. 1 job is to listen to our customers and earn their trust by creating solutions to enable their success. The work we are doing to drive an engineering-first culture across Intel while strengthening our partnerships throughout the foundry ecosystem will help us to advance our strategy, improve our execution and win in the market long term.' Event Press Kit: Intel Foundry Direct Connect 2025 Today's announcements encompass core process and advanced packaging technology, a milestone in domestic U.S. manufacturing, and ecosystem support required to earn the trust of foundry customers. They include: Process Technology Intel Foundry has engaged with lead customers on the Intel 14A process technology, the successor to Intel 18A. The company has distributed to lead customers an early version of the Intel 14A Process Design Kit (PDK), and multiple customers have expressed their intent to build test chips on the new process node. Intel 14A will feature PowerDirect direct contact power delivery, building on the PowerVia backside power delivery technology in Intel 18A. Intel 18A is now in risk production and expected to reach volume manufacturing this year. Intel Foundry's ecosystem partners have electronic design automation (EDA) enablement, reference flows and intellectual property (IP) ready for production designs today. The new Intel 18A variant, called Intel 18A-P, is designed to deliver enhanced performance to a broader set of foundry customers. Early wafers based on Intel 18A-P are in the fab now. Because Intel 18A-P will be design rule-compatible with Intel 18A, IP and EDA partners have already started updating their offerings for the variant. Intel 18A-PT is another new variant that builds on Intel 18A-P performance and power efficiency advancements. Intel 18A-PT can be connected to top die using Foveros Direct 3D with hybrid bonding interconnect pitch less than 5 micrometers (µm). Intel Foundry's first production 16 nanometer (nm) tape-out is in the fab now, and the company is engaging with lead customers on a 12nm node and derivatives built in collaboration with UMC. Advanced Packaging Intel Foundry offers system-level integration using Intel 14A on Intel 18A-PT, connected via Foveros Direct (3D stacking) and embedded multi-die interconnect bridging (2.5D bridging). New advanced packaging technology offerings include EMIB-T to enable future high bandwidth memory needs and two new additions to the Foveros architecture: Foveros-R and Foveros-B provide additional efficient and flexible options for customers. A new engagement with Amkor Technology increases customer flexibility in choosing the right advanced packaging technology for their needs. Manufacturing Fab 52 in Arizona has successfully 'run the lot,' marking the first wafer processed through the facility, demonstrating progress in domestic manufacturing of leading-edge Intel 18A wafers. Intel 18A volume production will begin in Intel's Oregon fabs as Arizona manufacturing ramps later this year. Intel 18A and Intel 14A research, development and wafer production will all be U.S.-based. Ecosystem New programs have been added within Intel Foundry's Accelerator Alliance – Intel Foundry Chiplet Alliance and Value Chain Alliance – along with a range of announcements from top ecosystem partners. Delivering Trusted Ecosystem Tools and IP Intel Foundry is supported by a comprehensive portfolio of IP, EDA and design services solutions delivered by trusted, proven ecosystem partners to drive advancements beyond traditional node scaling. As the newest program in Intel Foundry's Accelerator Alliance, the new Intel Foundry Chiplet Alliance will initially focus on defining and driving infrastructure on advanced technology for government applications and key commercial markets. The Intel Foundry Chiplet Alliance will provide an assured and scalable path for customers looking to deploy designs that leverage interoperable and secure chiplet solutions for targeted applications and markets. (Quote Sheet: Introducing the Intel Foundry Chiplet Alliance) The Intel Foundry Accelerator Alliance also includes IP Alliance, EDA Alliance, Design Services Alliance, Cloud Alliance and USMAG Alliance.
