Latest news with #JEDEC
Yahoo
22-05-2025
- Automotive
- Yahoo
Navitas Redefines Reliability with Industry's First Automotive ‘AEC-Plus' Qualified SiC MOSFETs in HV-T2Pak Top-Side Cooled Package
Unprecedented reliability combined with superior performance & optimized, high-creepage package sets a new benchmark in automotive and industrial applications Navitas Redefines Reliability with Industry's First Automotive 'AEC-Plus' Qualified SiC MOSFETs in HV-T2Pak Top-Side Cooled Package TORRANCE, Calif., May 05, 2025 (GLOBE NEWSWIRE) -- Navitas Semiconductor (Nasdaq: NVTS), the only pure-play, next-generation power semiconductor company and industry leader in gallium nitride (GaN) power ICs and silicon carbide (SiC) technology, introduces a new level of reliability to meet the system lifetime requirements of the most demanding automotive and industrial applications. Navitas' latest generation of 650 V and 1200 V 'trench-assisted planar' SiC MOSFETs combined with an optimized, HV-T2Pak top-side cooled package, delivers the industry's highest creepage of 6.45 mm to meet IEC-compliance for applications up to 1200V. Navitas' HV-T2Pak SiC MOSFETs significantly increase system-level power density and efficiency while improving thermal management and simplifying board-level design and manufacturability. Target applications include EV on-board chargers (OBC) & DC-DC converters, data-center power supplies, residential solar inverters & energy storage systems (ESS), EV DC fast chargers, and HVAC motor drives. AEC-Q101 is an automotive industry standard developed by the Automotive Electronics Council (AEC) to establish common part-qualification and quality-system standards. Navitas has created an industry-first benchmark, 'AEC-Plus'*, indicating parts qualified above and beyond the existing AEC-Q101 and JEDEC product qualification standards. This new benchmark showcases Navitas' deep understanding of system-level lifetime requirements and a strong commitment to enabling rigorously designed and validated products for demanding mission profiles in automotive and industrial applications. The 'AEC-Plus' qualification standards extend further into rigorous multi-lot testing and qualification. Key additions to the existing AEC-Q101 requirements include: Dynamic reverse bias (D-HTRB) & dynamic gate switching (D-HTGB) to represent stringent application mission profiles Over 2x longer power & temperature cycling Over 3x longer duration for static high-temperature, high-voltage tests (e.g. HTRB, HTGB) 200°C TJMAX qualification for overload operation capability Navitas' HV-T2Pak top-side cooled package, in an industry-standard compact form factor (14 mm x 18.5 mm), is optimized with an innovative groove design in the package mold compound that extends the creepage to 6.45 mm without reducing the size of the exposed thermal pad and ensuring optimal heat dissipation. In addition, the exposed thermal pad has a nickel, nickel-phosphorus (NiNiP) plating, as opposed to tin (Sn) plating from existing TSC package solutions, which is critical to preserving the post-reflow surface planarity of the exposed pad and ensuring thermally efficient and reliable attachment to the thermal interface material (TIM). Enabled by over 20 years of SiC technology innovation leadership, Navitas' GeneSiC™ 'trench-assisted planar SiC MOSFET technology' offers up to 20% lower on-resistance under in-circuit operation at high temperatures compared to competition and superior switching figure-of-merits which result in the lowest power losses across a wider operating range. All GeneSiC™ SiC MOSFETs have the highest-published 100%-tested avalanche capability, excellent short-circuit withstand energy, and tight threshold voltage distributions for easy paralleling. The initial HV-T2Pak portfolio includes 1200 V SiC MOSFETs with on-resistance ratings ranging from 18 mΩ to 135 mΩ and 650 V SiC MOSFETs with on-resistance ratings ranging from 20 mΩ to 55 mΩ. Lower on-resistance (<15 mΩ) SiC MOSFETs in HV-T2Pak package will be announced later in 2025. For more information, please contact info@ or visit *Navitas uses the term 'AEC-Plus' to indicate parts exceeding AEC-Q101 standards for reliability testing, published by the Automotive Electronics Council (AEC), based on Navitas test results About NavitasNavitas Semiconductor (Nasdaq: NVTS) is the only pure-play, next-generation power-semiconductor company, celebrating 10 years of power innovation founded in 2014. GaNFast™ power ICs integrate gallium nitride (GaN) power and drive, with control, sensing, and protection to enable faster charging, higher power density, and greater energy savings. Complementary GeneSiC™ power devices are optimized high-power, high-voltage, and high-reliability silicon carbide (SiC) solutions. Focus markets include AI data centers, EV, solar, energy storage, home appliance / industrial, mobile, and consumer. Over 300 Navitas patents are issued or pending, with the industry's first and only 20-year GaNFast warranty. Navitas was the world's first semiconductor company to be CarbonNeutral®-certified. Navitas Semiconductor, GaNFast, GaNSense, GeneSiC, and the Navitas logo are trademarks or registered trademarks of Navitas Semiconductor Limited and affiliates. All other brands, product names, and marks are or may be trademarks or registered trademarks used to identify products or services of their respective owners. Contact InformationLlew Vaughan-Edmunds, Sr Director, Product Management & Marketing info@ Photos accompanying this announcement are available at: in to access your portfolio
Yahoo
20-05-2025
- Business
- Yahoo
MetaOptics Launches Automatic Metalens Tester to Improve Mass Production Sorting Capabilities
SINGAPORE, May 19, 2025 /PRNewswire/ -- MetaOptics today announced the launch of its new Automatic Metalens Tester, an advanced system developed in collaboration with Elsoft Research Bhd (KLSE: a manufacturer of testing equipment for leading global technology brands. The tester marks a significant addition to MetaOptics' production process flow as it improves volume manufacturing of next-generation optics. Purpose-built for MetaOptics' 12-inch glass-based metalens wafers operating in visible wavelengths, the system automates critical testing steps including wavelength and polarization dependent optical efficiency and focus quality. It supports a wide testing range, with a 360° x 120° field-of-view and for working distances from a few centimetres to infinity. Integrated pick-and-place functionality enables precise handling of individual dies from a 12-inch diced wafer. This streamlines the testing, enables binning based on optical performance, and facilitates sorting into different JEDEC trays for good and defective metalenses. "Our Automatic Metalens Tester marks a significant step forward in scaling our production capabilities," said Mark Thng, CEO of MetaOptics Technologies. "By combining rigorous performance validation with automated handling and categorization, we are investing in the quality assurance capabilities that customers expect as they prepare for the next generation of optical devices." The system improves throughput, measurement consistency, and traceability across the manufacturing line — critical factors for supporting high-volume production with the reliability standards demanded by leading global technology brands. Following its debut of breakthrough metalens technologies at CES 2025, MetaOptics remains focused on translating innovation into manufacturable solutions for mobile, augmented reality, and other precision-driven applications. The Automatic Metalens Tester will be ready for deployment in Q4 2025. About MetaOptics Inc. MetaOptics Inc. is a leading-edge semiconductor optics company pioneering glass-based metalens solutions enhanced by AI-driven image processing. Using advanced optical design and a scalable 12-inch DUV lithography process, it powers next-generation applications in mobile, AR VR, automotive and other emerging markets. Headquartered in Singapore, MetaOptics aims to deliver high-performance optics with the reliability and scalability demanded by today's most innovative technology brands. About Elsoft Research Bhd Elsoft Research Bhd (KLSE:0090), a company based in Penang, Malaysia, specializes in the design and manufacture of high-precision automated test and measurement solutions. It supports some of the world's leading consumer electronics and semiconductor companies, with proven expertise in high-throughput testing platforms that help clients meet stringent quality and performance standards at scale. For media inquiries, please contact: ir@ View original content: SOURCE METAOPTICS INC Error in retrieving data Sign in to access your portfolio Error in retrieving data Error in retrieving data Error in retrieving data Error in retrieving data
Yahoo
13-05-2025
- Business
- Yahoo
Rambus Delivers Industry-Leading Client Chipsets for Next-Generation AI PC Memory Modules
Highlights: Introduces industry-leading LPDDR5 CAMM2 PMIC and DDR5 Gen 2 Client PMIC alongside Client Clock Driver and SPD Hub for high-performance notebooks, desktops and workstations Supports wide range of module performance and capacity use cases in LPCAMM2, CUDIMM and CSODIMM form factors Expands memory chipset offering to cover all JEDEC defined memory modules for servers and PCs SAN JOSE, Calif., May 13, 2025--(BUSINESS WIRE)--Rambus Inc. (NASDAQ: RMBS), a premier chip and silicon IP provider making data faster and safer, today announced the availability of complete client chipsets for next-generation AI PC memory modules, featuring two new Power Management ICs (PMICs) for client computing. PMICs are critical to efficiently power memory modules providing breakthrough levels of performance for advanced computing applications. The two new Rambus industry-leading PMICs are the PMIC5200, for LPDDR5 CAMM2 (LPCAMM2) memory modules and the PMIC5120, which supports DDR5 CSODIMMs and CUDIMMs. These PMICs, alongside the Client Clock Driver (CKD) and Serial Presence Detect Hub (SPD Hub), comprise a complete chipset offering to enable memory modules for AI PC notebooks, desktops and workstations. Further, with the addition of these new PMICs, Rambus now offers complete memory interface chipsets for all JEDEC standard DDR5 and LPDDR5 memory modules for both servers and clients. "The proliferation of AI-enabled client systems is driving new memory subsystem requirements that demand modules delivering higher bandwidth and optimized power efficiency," said Rami Sethi, SVP and general manager of Memory Interface Chips at Rambus. "Having established a leadership position with the introduction of our DDR5 server PMIC family, we're now extending that leadership with two client PMICs that round out a complete DDR5 and LPDDR5 client memory module chipset, which also includes our Client Clock Driver and SPD Hub. Our memory interface chipsets, for LPCAMM2 and DDR5 CUDIMMs and CSODIMMs, enable our customers to address the broad range of form factor, capacity and bandwidth options required by this next wave of exciting AI PC platforms." "Micron's first-to-market leadership in LPCAMM2 technology is advancing computing performance in AI PCs while disrupting the industry with unprecedented modularity and flexibility," said Ross Dermott, vice president of mobile product line management in Micron's Mobile and Client Business Unit. "Rambus' latest PMIC solutions are a critical component in our next-generation LPCAMM2 modules — allowing us to push the boundaries of memory performance and strengthen our gen-over-gen LPCAMM2 industry leadership." "AI PCs powered by Intel processors ushers in a new era of productivity, creativity and entertainment experience. The latest Intel® Core™ Ultra processors family features cutting-edge AI enhancements, increased efficiency and performance improvements," said Dimitrios Ziakas, VP of Memory & IO Technologies, Intel Corporation. "From ultra-thin notebooks to the most powerful workstations, Rambus memory interface chips can support the multitude of form factors both businesses and consumers will employ to harness the power of AI." "As the rapid evolution of AI reshapes the PC market, the demands on memory bandwidth and capacity will only accelerate," said Brandon Hoff, executive analyst at IDC. "High-performance LPDDR5 and DDR5 memory modules, enabled by advanced memory interface chipsets, will be key to unlocking the tremendous possibilities of AI." As data rates continue to rise to support the needs of AI and other advanced workloads, signal integrity (SI) and power integrity (PI) management become increasingly vital. With 35 years of high-performance memory experience, Rambus is renowned for its SI/PI expertise. This expertise helps enable DDR5 and LPDDR5 memory interface chips to deliver superior signal integrity and power efficiency at higher performance for server and client DIMMs. To deliver the highest levels of performance and reliability, Rambus offers complete memory interface chipsets for all JEDEC standard DDR5 and LPDDR5 memory modules, including: LPCAMM2 Chipset: PMIC5200, SPD Hub DDR5 CSODIMM and CUDIMM Chipset: Client Clock Driver (CKD), PMIC5120, SPD Hub DDR5 RDIMM 4800 – 8000 Chipsets: Registering Clock Driver (RCD), PMIC, Serial Presence Detect Hub (SPD Hub), Temperature Sensor ICs (TS) DDR5 MRDIMM 12800 Chipset: Multiplexing Registering Clock Driver (MRCD), Multiplexing Data Buffer (MDB), PMIC, SPD Hub, TS Join Us at COMPUTEX: Rambus will be at COMPUTEX 2025 in Taipei sharing the latest information on the LPDDR5 and DDR5 Client DIMM chipsets. Reach out to schedule a meeting with our memory interface chip experts here. More Information: Learn more about the Rambus DDR5 and LPDDR5 Client DIMM Chipsets here. Follow Rambus:Company website: Rambus blog: LinkedIn: About Rambus Inc. Rambus is a provider of industry-leading chips and silicon IP making data faster and safer. With 35 years of advanced semiconductor experience, we are a pioneer in high-performance memory solutions that solve the bottleneck between memory and processing for data-intensive systems. Whether in the cloud, at the edge or in your hand, real-time and immersive applications depend on data throughput and integrity. Rambus products and innovations deliver the increased bandwidth, capacity and security required to meet the world's data needs and drive ever-greater end-user experiences. For more information, visit Source: Rambus Inc. Forward-looking statements Information set forth in this press release, including statements as to Rambus' outlook and financial estimates and statements as to the expected timing and effects of Rambus products, constitute forward-looking statements within the meaning of the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. These statements are based on various assumptions and the current expectations of the management of Rambus and may not be accurate because of risks and uncertainties surrounding these assumptions and expectations. Factors listed below, as well as other factors, may cause actual results to differ significantly from these forward-looking statements. There is no guarantee that any of the events anticipated by these forward-looking statements will occur, or what effect they will have on the operations or financial condition of Rambus. Forward-looking statements included herein are made as of the date hereof, and Rambus undertakes no obligation to publicly update or revise any forward-looking statement unless required to do so by federal securities laws. Major risks, uncertainties and assumptions include, but are not limited to: any statements regarding anticipated operational and financial results; any statements of expectation or belief; other factors described under "Risk Factors" in Rambus' Annual Report on Form 10-K and Quarterly Reports on Form 10-Q; and any statements of assumptions underlying any of the foregoing. It is not possible to predict or identify all such factors. Consequently, while the list of factors presented here is considered representative, no such list should be considered to be a complete statement of all potential risks and uncertainties. View source version on Contacts Press Contact: Cori PasinettiRambus Corporate Communicationst: (650) 309-6226cpasinetti@ Error in retrieving data Sign in to access your portfolio Error in retrieving data Error in retrieving data Error in retrieving data Error in retrieving data
Associated Press
21-03-2025
- Business
- Associated Press
Advanced Semiconductor Packaging for The Post-mooer's Law Era
03/20/2025, Singapore, Singapore // KISS PR Brand Story PressWire // According to Semiconductor Review's report. For decades, the semiconductor industry has been shrinking transistors, squeezing more power into smaller chips. It's been a relentless march toward the infinitesimal. But as we reach the limits of Moore's Law, the ability to innovate in advanced semiconductor packaging will determine market dominance. The game is no longer just about shrinking transistors; it's about cleverly packaging and which is an established company in Singapore, cements its cornerstone here. The young and dynamic engineering company helps the advanced semiconductor assembly and packaging industry push the boundaries of what's possible with its equipment solutions, paving the way for the next generation of high-performance, compact devices with even lower cost. Wang Honggang, Co-founder and CTO： 'We're not interested in churning out cookiecutter solutions. Our goal is to co-create the future of semiconductor packaging with our clients, tackling the challenges that others shy away from,' says Wang Honggang, co-founder and CTO. True to his words, Capcon's focus on innovative solutions and customer collaboration helps clients maximize their production throughput or units per hour (UPH), covering both wafer-level and panel-level packaging. The focus is not on standard processes. Instead, it concentrates on new processes and requirements that build upon standardized processes, which can bring the most value to end customers. The approach's effectiveness is evident in the company's market penetration. The solutions are already being used by top-tier semiconductor mass-manufacturers across Europe, Taiwan, Korea and China, including leading integrated device manufacturers (IDM). Pioneering Advanced Packaging for AI and Beyond Capcon's approach to semiconductor packaging is evident in its versatile solutions, which span three key segments—bonding to substrate, wafer and panel. All are produced with precision and efficiency. Underpinned by patented technology, these solutions address the diverse and evolving needs of the industry. All equipment features dual independent wafer stage and 12 placement heads at both front and rear, which allows simultaneous handling of various components within a compact footprint. This design maximizes efficiency while offering flexibility in feeding sources, accommodating wafers, tape reels, waffle pack trays and even JEDEC tray feeder. A significant advantage of Capcon's equipment is its ability to support both face-up and face-down bonding options for various packaging processes, in a single machine. This versatility enables handling of multiple processes, including FOWLP, FOPLP, inFO, COW, SiP, CoWoS and eWLB, 2.5D, 3D —crucial in an industry where requirements change latest A series and L series integrate these capabilities, reducing investment risk for customers. The A series caters to cutting-edge technologies like 2.5D, 3D and hybrid bonding, addressing the growing demands of AI chip production. Within this series, the A1 model specializes in hybrid bonding, while A2 and A6 cover 2.5D and 3D bonding, each tailored to different customer preferences in accuracy, flexibility and productivity. Recognizing the high costs associated with AI chip fabrication, Capcon introduced the L series (Leo family) in 2023, focusing on panel-level solutions. This move addresses the industry's shift toward more cost-effective alternatives to wafer-level packaging, a trend pursued by major players like Nvidia and AMD. 'We're proud to be the first company offering flexible, high-UPH solutions for panel-level packaging,' notes Honggang. 'Our success is evident in our partnership with a leading European IDM, which now produces three million units daily using our machines, operating 24/7.' This adaptability is a game-changer for Capcon's clients, enabling them to adjust production capabilities dynamically and accept orders from various design houses. The ability to change processes via software and recipes without investing in separate equipment offers significant cost savings and operational agility. Capcon's equipment typically delivers 50 percent higher or even double the UPH compared to competitors at the same cost, translating to a lower total cost of ownership—a critical factor in the competitive semiconductor industry. A Multidisciplinary Approach Capcon's success in the semiconductor equipment industry stems from its diverse expertise and collaborative innovation. It unites specialists from mechanics, software, motion, optics and system control. This internal team is complemented by a network of external experts, including university fellows and retired professionals. This type of multidisciplinary approach is crucial in a field characterized by long development cycles and rapid technological advancements. 'We're proud to be the first company offering flexible, high-UPH solutions for panel-level packaging. Our success is evident in our partnership with a leading European IDM, who now produces three million units daily using our machines, operating 24/7' Adapting to Change 'The issue isn't change itself, but how we respond to it,'says Honggang, reflecting Capcon's approach to staying competitive in a fast-paced industry. Looking ahead, it plans to enhance its engineering capabilities to meet growing process requirements and design house requests. It will concentrate on advancing mass transfer technology and developing lower-cost interconnectivity technologies from a design perspective. Simultaneously, Capcon will address critical challenges in thermal efficiency applied packaging. It is also pushing the envelope of accuracy in its products. By developing hybrid bonding technology, Capcon aims to deliver sub-micron precision for advanced computing requirements, demonstrating its commitment to higher accuracy. In terms of long-term planning, a pragmatic approach is adopted. Rather than creating five- or 10-year plans that may become obsolete in the rapidly changing semiconductor industry, the company focuses on one-year cycles to remain agile and responsive to market shifts while maintaining a clear direction. 'If we can effectively plan for the next two years, we can win the battle,' says Honggang. Capcon's strategic positioning in the advanced semiconductor packaging space reflects a keen understanding of where the industry is headed. Its ability to transform complex challenges into high-performance solutions positions it well to capitalize on the industry's shift toward advanced packaging techniques, potentially redefining the competitive landscape in the years to come.
Yahoo
27-01-2025
- Business
- Yahoo
Keysight Introduces Comprehensive LPDDR6 Solution for End-to-End Memory Design and Test Workflows
Delivers complete design and validation solution for Low-Power Double Data Rate 6 (LPDDR6) memory in mobile, client computing, and AI applications. Supports JEDEC's ongoing development of the new LPDDR6 memory standard. Enables enhanced performance analysis focusing on speed optimization, power efficiency, and reliability testing. Features advanced measurement-based noise compensation technology for superior signal integrity. SANTA ROSA, Calif., January 27, 2025--(BUSINESS WIRE)--Keysight Technologies, Inc. (NYSE: KEYS) announced the Low-Power Double Data Rate 6 (LPDDR6) design and test solution, a complete design and test solution to support the next technology wave for memory systems. The solution significantly improves device and system validation, providing new test automation tools necessary for advancing AI, especially in mobile and edge devices. The memory market is evolving due to the rising demand for high-performance computing, AI, and energy-efficient mobile applications. LPDDR6 significantly enhances performance and efficiency to support next-generation compute system requirements, making it a crucial upgrade for contemporary devices. Test complexity has grown with the adoption of next-generation memory devices such as LPDDR6, HBM4, and GDDR7. These technologies demand advanced test methods to ensure reliability and performance, and reducing test times while maintaining accuracy is a constant challenge. Keysight's complete workflow solution consists of transmitter and receiver test applications and the Advanced Design System (ADS) Memory Designer workflow solution. The LPDDR6 test solution can be paired with Keysight EDA software and the Keysight Memory Designer bundle to achieve faster design confidence from simulation to verification and test. The LPDDR6 test automation solution is based on Keysight's UXR oscilloscope and high-performance M8040A Bit Error Ratio Tester. LPDDR6's impact is expected to reach beyond mobile devices. The new memory standard's combination of high performance and power efficiency makes it particularly suitable for AI and machine learning applications, high-speed digital computing, automotive systems, data centers, and other edge applications areas where the balance between processing power and energy consumption is crucial. Key Benefits of Keysight's LPDDR6 Test Solution: Accelerate Time-to-Market with Advanced Transmitter Testing Reduce validation time with fully automated compliance testing and characterization Capture precise measurements quickly using industry-leading low-noise technology Debug design issues faster with streamlined data analysis tools Analyze device BER performance with extrapolated eye mask margin testing Achieve accurate signal measurements directly from BGA packages with specialized de-embedding capabilities Optimize Device Performance with Comprehensive Receiver Testing Validate designs confidently using proven Bit Error Ratio testing methodology Pinpoint performance issues early by testing against multiple jitter, crosstalk, and noise scenarios Maximize signal integrity through detailed BER analysis and receiver equalization optimization Ensure high interoperability with both device and host controller validation Deliver Next-Generation Memory Solutions Enable faster user experiences with higher data rates support Extend battery life and reduce power consumption in mobile and data center applications Build more reliable products with enhanced data integrity and system stability features Dr. Joachim Peerlings, Vice President and General Manager, Network and Datacenter Solutions, Keysight, said: "As a leader in memory design and test solutions, Keysight continues to collaborate with JEDEC to develop the LPDDR6 standard. This new LPDDR6 standard is set to revolutionize the market, offering unprecedented speed, efficiency, and reliability, enabling the industry's AI Edge rollout. As the deployment and use of next-generation memory devices are growing, Keysight has achieved a significant milestone in enabling faster time to market for LPDDR6 memory designs." The new receiver and transmitter solution will be shown to the public for the first time at DesignCon 2025, Jan 29-30, at booth number 1039 in Santa Clara, California. Resources Keysight's memory solutions Keysight D9060LDDC LPDDR6 Tx Compliance Test Software Keysight M80896RCA LPDDR6 Receiver Conformance and Characterization Test Application Keysight Memory Designer W3626B About Keysight Technologies At Keysight (NYSE: KEYS), we inspire and empower innovators to bring world-changing technologies to life. As an S&P 500 company, we're delivering market-leading design, emulation, and test solutions to help engineers develop and deploy faster, with less risk, throughout the entire product lifecycle. We're a global innovation partner enabling customers in communications, industrial automation, aerospace and defense, automotive, semiconductor, and general electronics markets to accelerate innovation to connect and secure the world. Learn more at Keysight Newsroom and View source version on Contacts Keysight Media Contacts North America PR Teampdl-americas-keysight-pr@ Fusako DohiAsia+81 42 660-2162fusako_dohi@ Jenny GallacherEurope+44 (0) 7800 737
