Latest news with #JayKramer
Miami Herald
07-08-2025
- Business
- Miami Herald
Graid Technology Announces Global Availability of SupremeRAID(TM) HE (HPC Edition), Wins Best of Show at FMS 2025
Award-winning GPU-based RAID solution delivers unmatched resilience and efficiency for modern HPC and AI workloads. SANTA CLARA, CALIFORNIA / ACCESS Newswire / August 7, 2025 / Graid Technology, inventor of the world's first GPU-based RAID, today announced the global availability of SupremeRAID™ HE (HPC Edition)-a next-generation RAID solution engineered to deliver high availability and resilient NVMe performance for AI, HPC, and large-scale enterprise environments. The announcement follows the product's recognition at FMS (Future of Memory & Storage) 2025, where SupremeRAID™ HE received the Best of Show Award for Most Innovative Enterprise Business Application, HPC Category. The award highlights the industry's growing demand for modern, GPU-accelerated RAID that can meet the unique performance and resiliency challenges of large-scale distributed infrastructure. SupremeRAID™ HE offloads RAID operations from the CPU to the GPU, unlocking the full performance potential of NVMe SSDs while enabling uninterrupted access to critical data. The solution supports cross-node high availability without replication, helping enterprises simplify failover strategies, reduce total cost of ownership, and maximize storage efficiency. It integrates seamlessly with leading parallel file systems such as Ceph, Lustre, MinIO, and IBM SpectrumScale and supports deployment across a broad range of infrastructure-including Supermicro's Petascale High Availability Dual Node All-Flash platform. "SupremeRAID™ HE was built to address a gap in high-performance data environments: how to protect critical workloads without compromising speed or efficiency," said Leander Yu, President and CEO of Graid Technology. "By shifting RAID operations to the GPU, we give customers the ability to scale NVMe performance while maintaining true high availability across nodes-without the complexity of replication or performance tradeoffs." "Graid Technology continues to lead with innovation that challenges the status quo of enterprise storage," said Jay Kramer, Chairman of the FMS Awards Program. "SupremeRAID™ HE offers an elegant, high-performance solution to the critical challenge of providing RAID data protection in high availability environments, especially in conjunction with platforms like Supermicro's Storage Bridge Bay (SBB)." SupremeRAID™ HE is available now through Graid Technology's global partner network. Explore the full solution brief featuring Supermicro's Petascale High Availability Dual Node All-Flash platform: Contact Information Andrea Eaken Senior Director of Marketing, Americas & SOURCE: Graid Technology Inc. press release
Business Wire
07-08-2025
- Business
- Business Wire
VergeIO Wins ‘Best of Show' at 19 th Annual FMS Awards
BUSINESS WIRE)-- VergeIO, the VMware alternative and pioneer in ultraconverged infrastructure, was named Most Innovative Startup Company at FMS: the Future of Memory and Storage, the industry's premier event for next-generation memory and storage technologies. FMS Best of Show (BoS) Awards recognizes companies' products and solutions as innovative leaders in the memory and storage technologies industry. There are eight distinct award categories which address the wide range of high-performance memory and storage innovations in the market. Criteria for nominations include innovative designs as well as the potential for industry leadership. The Most Innovative Startup Company award honors businesses on the entrepreneurial journey from inspiration and learning, all the way through startup, scale up and becoming a market disruptor, and a champion in the technology landscape. 'Virtual infrastructure has created great value for many generations of distributed systems and data centers, but virtualization platforms are increasingly challenged by cost, complexity and fragmentation. The future represents an entirely new class of infrastructure software for memory, storage and compute,' said Jay Kramer, Chair of the Awards Program and President of Network Storage Advisors Inc. 'We are proud to recognize VergeIO as the most innovative startup company for bringing to market a fully integrated, AI-ready infrastructure which merges compute, storage and networking into a single memory optimized operating environment. This includes VergeHV, an AI-optimized hypervisor with direct GPU access, VergeFabric, software-defined networking for high-throughput AI clusters, and VergeIQ to create isolated Virtual Data Centers (VDCs) to run and manage AI models securely, privately and at scale.' VergeIO is the leading VMware Alternative. Unlike hyperconverged infrastructure (HCI), its ultraconverged infrastructure (UCI) collapses the traditional IT stack (virtualization, storage and networking) into an integrated data center operating environment, VergeOS. Its efficiency enables greater workload density using existing hardware while improving data resiliency. The result is dramatically lower costs, improved availability and greatly simplified IT. 'Recognition of a job well done – whether it's by industry experts, partners or your customers – is always a validating experience,' said Yan Ness, CEO of VergeIO. 'In winning Most Innovative Startup Company at this year's FMS Awards, we have earned acknowledgement as a leader of storage technology that showcases our capabilities in delivering reduced costs, improved agility and increased performance for critical workloads. All of us at VergeIO look forward to continuing our mission to simplifying and improving IT infrastructures.' Taking place August 5–7 in the heart of Silicon Valley at the Santa Clara Convention Center, FMS 2025 is the world's largest industry conference and exhibition in this sector, FMS highlights mainstream applications, breakthrough innovations, key enabling technologies and the full spectrum of players – from leading vendors to disruptive startups. Additional information about the event is available at VergeIO is the leading VMware alternative, delivering a unified platform that converges virtualization, storage, networking, AI, and backup into a single software-defined solution. Learn more at
Business Wire
06-08-2025
- Business
- Business Wire
DDN Wins Prestigious Award for the Most Innovative Customer Implementation at FMS: The Future of Memory and Storage
SANTA CLARA, Calif.--(BUSINESS WIRE)-- DDN, the global leader in AI and data intelligence solutions, proudly announces that it has received a Best in Show honor at FMS: the Future of Memory and Storage for the Most Innovative Customer Implementation—recognizing the company's continued leadership in advancing the performance, scalability, and efficiency of AI and data-intensive environments. The prestigious award underscores DDN's unmatched ability to deliver innovation across both technology and customer success, especially in the era of generative AI, where storage performance and data movement are critical to business outcomes. The Best of Show for the Most Innovative Customer Implementation award was presented to DDN for its work with CINECA, one of the world's premier supercomputing centers. At the heart of the collaboration is CINECA's groundbreaking nuclear research—paving the way for clean, safe, and sustainable energy that is foundational to the future of AI and our planet. Leveraging the DDN Data Intelligence Platform, CINECA is also advancing pioneering medical discoveries, enhancing early warning systems for natural disasters, and supporting efforts to digitally restore and preserve cultural heritage. This award underscores how DDN is eliminating data bottlenecks, accelerating time to insight, and enabling critical global research across hybrid HPC and AI environments. 'The real challenge in AI isn't compute—it's moving and managing data fast enough to keep up,' said Sven Oehme, Chief Technology Officer at DDN. 'This recognition underscores the innovation we've brought to bear in real-world deployments—solving for the bottlenecks that stall AI at scale. From national labs to global enterprises, our platforms are eliminating GPU waste, accelerating AI pipelines, and delivering measurable outcomes across science, healthcare, and industry. We're proud to help customers turn infrastructure into insight faster than ever before.' 'Nuclear fusion is increasingly being considered as a viable source of clean, limitless energy to solve the world's increasing needs for energy security and sufficiency,' said Jay Kramer, Chair of the Awards Program and President of Network Storage Advisors Inc. 'We are proud to recognize Cineca, Italy's national supercomputing center and one of Europe's most powerful AI/ HPC facilities partnered with the DDN Data Intelligence Platform. The DDN solution delivers sub-millisecond latency and TBs throughout for real-time plasma simulation and modeling, along with real-time metadata indexing. This ensures that simulations run continuously and efficiently. DDN provides built-in multi-tenancy, encryption, and a fault-tolerant architecture so that Cineca can scale securely from terabytes to exabytes, supporting thousands of compute units without compromising reliability.' Held annually in the heart of Silicon Valley, FMS: the Future of Memory and Storage is the world's premier event for storage, memory, and high-speed data infrastructure. The 'Best of Show' awards represent the highest recognition for product and customer innovation in the space, spotlighting technologies that are reshaping the future of computing. For more information about DDN and its award-winning solutions, please visit About DDN DDN is the world's leading AI and data intelligence company, empowering organizations to maximize the value of their data with end-to-end HPC and AI-focused solutions. Its customers range from the largest global enterprises and AI hyperscalers to cutting-edge research centers, all leveraging DDN's proven data intelligence platform for scalable, secure, and high-performance AI deployments that drive 10x returns. Follow DDN: LinkedIn, X, and YouTube. FMS: the Future of Memory and Storage, produced by Conference ConCepts, is the premier global event showcasing cutting-edge developments in multi-billion-dollar high-speed memory and storage technologies. As the world's largest conference and exhibition in this sector, FMS highlights mainstream applications, breakthrough innovations, key enabling technologies, and the full spectrum of players—from leading vendors to disruptive startups. This event spans critical application areas including AI, enterprise data centers, high-performance computing, mobile devices at the edge, and embedded systems. FMS serves as a dynamic hub where technology professionals, executive leaders, customers, cloud providers, hyperscaler companies, and industry analysts converge to explore the evolving landscape of memory and storage. With a renewed commitment to inclusivity and innovation, FMS is shaping the future of storage—especially at its intersection with artificial intelligence.
Yahoo
06-08-2025
- Business
- Yahoo
Adeia Wins Best of Show Award at FMS: The Future of Memory and Storage Conference
SAN JOSE, Calif., Aug. 06, 2025 (GLOBE NEWSWIRE) -- Adeia Inc., a leading innovator in semiconductor 3D integration and advanced packaging technologies, is proud to announce that it has been presented with the 'Most Innovative Technology' award, which is a 'Best of Show' award – one of the highest honors recognizing outstanding achievement and innovation – at FMS: the Future of Memory and Storage. FMS is recognized as the world's foremost conference highlighting the key advancements, trends, and industry figures shaping the multi-billion-dollar high-speed memory, storage, and SSD markets. This esteemed recognition highlights Adeia's commitment to excellence and innovation in hybrid bonding and advanced interconnect solutions. The 'Most Innovative Technology' award is given to the most outstanding innovation showcased at FMS. Adeia received this honor for its groundbreaking hybrid bonding technology enabling 3D integration of electronic systems with improved interconnect density, speed, power efficiency, and reliability in NAND, DRAM and logic products. This novel, scalable interconnect technology is fueling leading semiconductor roadmaps. 'Vertical stacking has become an innovative architectural technique leading to the creation of 3D NAND and 3D DRAM technologies and has significantly increased storage capacity within the same footprint for applications such as AI workloads requiring high performance and vast amounts of data storage in a small footprint,' said Jay Kramer, Chair of the Awards Program and President of Network Storage Advisors Inc. 'We are proud to recognize Adeia's hybrid bonding technology, an enabler for greater interconnect density, speed, power efficiency and enhanced reliability in NAND, DRAM and logic products. Adeia hybrid bonding helps overcome the "memory wall" by providing faster and more efficient data transfer between the processor and memory.' 'We are honored to receive the 'Most Innovative Technology' award at FMS,' said Dana Escobar, Chief Licensing Officer and General Manager, Semiconductor at Adeia. 'This award is a testament to the incredible work of our team and Adeia's commitment to solving important integration challenges for our customers. Hybrid bonding is more than a novel technology – it's a foundation for the next era of memory and logic performance.' Adeia's die-to-wafer and wafer-to-wafer hybrid bonding technology supports submicron interconnect pitch, unlocking the full potential of chiplet architectures and heterogeneous integration. Memory and logic can now be contiguously integrated, reducing latency, increasing bandwidth, and improving power efficiency in applications including AI workloads of sorting, high performance computing, and edge compute for datacenter, mobile, and automotive. Held annually in August in the heart of Silicon Valley, FMS: the Future of Memory and Storage is the premier memory and storage event attracting top professionals, innovators, and companies from around the world. For more information about FMS, please visit For more information about Adeia and its award-winning hybrid bonding technology, please visit About Adeia Adeia is a leading R&D and intellectual property (IP) licensing company that accelerates the adoption of innovative technologies in the media and semiconductor industries. Adeia's fundamental innovations underpin technology solutions that are shaping and elevating the future of digital entertainment and electronics. Adeia's IP portfolios power the connected devices that touch the lives of millions of people around the world every day as they live, work and play. For more, please visit About FMS: the Future of Memory and StorageFMS: the Future of Memory and Storage, produced by Conference ConCepts, is the premier global event showcasing cutting-edge developments in multi-billion-dollar high-speed memory and storage technologies. As the world's largest conference and exhibition in this sector, FMS highlights mainstream applications, breakthrough innovations, key enabling technologies, and the full spectrum of players—from leading vendors to disruptive startups. This event spans critical application areas including AI, enterprise data centers, high-performance computing, mobile devices at the edge, and embedded systems. FMS serves as a dynamic hub where technology professionals, executive leaders, customers, cloud providers, hyperscaler companies, and industry analysts converge to explore the evolving landscape of memory and storage. With a renewed commitment to inclusivity and innovation, FMS is shaping the future of storage—especially at its intersection with artificial intelligence. Adeia Investor Contact:Chris ChaneyVice President, Investor RelationsIR@ FMS Contact:Michelle Suzuki, Public Relations & Analysts for FMSmichelle@ +1 310.444.7115Sign in to access your portfolio
Yahoo
06-08-2025
- Business
- Yahoo
KIOXIA LC9 Series 245.76 TB Enterprise SSD with Innovative 32-die Stack Memory Named ‘Best of Show' at FMS: the Future of Memory and Storage 2025
SAN JOSE, Calif., August 06, 2025--(BUSINESS WIRE)--KIOXIA America, Inc. today announced that its KIOXIA LC9 Series 245.76 terabyte (TB)1 enterprise SSD, utilizing a 32-die stack KIOXIA BiCS FLASH™ generation 8 QLC 3D flash memory, has received the FMS 'Best of Show' award in the 'SSD Technology' category. These awards recognize the cutting-edge products, services, and customer implementations that are pushing the boundaries of memory and storage technology. The industry's first2 245.76 TB1 NVMe™ SSD in a 2.5-inch and Enterprise and Datacenter Standard Form Factor (EDSFF) E3.L form factor, KIOXIA LC9 Series drives are well-suited to generative AI and enterprise applications. KIOXIA LC9 Series SSDs are now sampling to select customers. "When customers evaluate SSDs, important consideration is given to storage that scales to high capacities while delivering high performance and low power consumption," said Jay Kramer, Chair of the Awards Program and President of Network Storage Advisors Inc. "We are proud to recognize KIOXIA for its BiCS FLASH™ 3D flash memory and KIOXIA LC9 Series SSD. This solution is enabled by their CBA (CMOS directly Bonded to Array) technology and the innovation of a 32-die stacked architecture in a package - delivering the capacity, power and density required for transformational SSDs. Creating the highest capacity2 PCIe® 5.0 enterprise SSD is a remarkable achievement and a clear reflection of Kioxia's leadership position." Featuring a 32-die stack of 2 terabit (Tb)3 BiCS FLASH™ QLC 3D flash memory with innovative CBA technology, KIOXIA LC9 Series SSDs deliver the speed, scale, and density required to support the next wave of AI-centric workloads. This combination of advanced memory architecture and CBA technology enables 8 TB3 in a small 154 BGA package – also an industry first2. This milestone was made possible with advancements in Kioxia's high-precision wafer processing, material design, and wire bonding technologies. "Achieving multiple industry firsts with the KIOXIA LC9 Series reflects the depth of innovation across our engineering, manufacturing, and design teams," said Scott Nelson, Executive Vice President and Chief Marketing Officer for KIOXIA America, Inc. "As AI workloads grow more demanding, we're committed to delivering the flash memory technologies that will power the data infrastructure of tomorrow and accelerate progress across industries." For more information, please visit and follow the company on X, formerly known as Twitter and LinkedIn®. About KIOXIA America, Inc. KIOXIA America, Inc. is the U.S.-based subsidiary of KIOXIA Corporation, a leading worldwide supplier of flash memory and solid-state drives (SSDs). From the invention of flash memory to today's breakthrough BiCS FLASH™ 3D technology, KIOXIA continues to pioneer innovative memory, SSD and software solutions that enrich people's lives and expand society's horizons. The company's innovative 3D flash memory technology, BiCS FLASH, is shaping the future of storage in high-density applications, including advanced smartphones, PCs, automotive systems, data centers and generative AI systems. For more information, please visit © 2025 KIOXIA America, Inc. All rights reserved. Information in this press release, including product pricing and specifications, content of services, and contact information is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable KIOXIA product specifications. Notes: 1: Definition of SSD capacity: Kioxia Corporation defines a kilobyte (KB) as 1,000 bytes, a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as 1,000,000,000 bytes, a terabyte (TB) as 1,000,000,000,000 bytes, and a kibibyte (KiB) is 1,024 bytes. A computer operating system, however, reports storage capacity using powers of 2 for the definition of 1GB = 2^30 bytes = 1,073,741,824 bytes and 1TB = 2^40 bytes = 1,099,511,627,776 bytes and therefore shows less storage capacity. Available storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software and operating system, and/or pre-installed software applications, or media content. Actual formatted capacity may vary.2: As of August 6, 2025, based on Kioxia survey.3: The flash memory capacity is calculated as 1 terabit (1 Tb) = 1,099,511,627,776 (2^40) bits, and 1 terabyte (1 TB) = 1,099,511,627,776 (2^40) bytes. 2.5-inch indicates the form factor of the SSD and not its physical size. NVMe is a registered or unregistered trademark of NVM Express, Inc. in the United States and other countries. PCIe is a registered trademark of PCI-SIG. LinkedIn is a trademark of LinkedIn Corporation and its affiliates in the United States and/or other countries. Other company names, product names and service names may be trademarks of third-party companies. View source version on Contacts Company Contact: Mia CoolKioxia America, (408) Media Contact: Dena JacobsonLages & AssociatesTel: (949) 453-8080dena@ Error in retrieving data Sign in to access your portfolio Error in retrieving data Error in retrieving data Error in retrieving data Error in retrieving data
