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Time of India
a day ago
- Business
- Time of India
South Korean chipmakers accelerate facility investments amid booming AI demand
Academy Empower your mind, elevate your skills South Korea's leading semiconductor companies are increasing their investments in production facilities, driven by strong forecasts for rapid growth in the artificial intelligence ( AI ) chip market, reported the Korea Electronics is reviewing plans to restart construction of chip manufacturing plants in Korea, while SK hynix has recently begun building a new back-end processing industry sources, the Korean English daily said that tech giant Samsung is preparing to resume work on its Pyeongtaek Campus Line 4 (P4), where construction was halted last year.P4, the company's fourth major chip facility at the site, is divided into four phases. While Phases 1 and 3 are nearing completion, sources have reported that work orders have recently been issued for Phases 2 and 4, with full-scale construction expected within two to three months, the news platform planned for foundry production, two areas of the P4 facility are now expected to be converted into DRAM production lines . These will manufacture sixth-generation 1c DRAM using a 10-nanometer process, a technology Samsung confirmed it has successfully developed for next-generation high bandwidth memory (HBM4) Chair Jun Young-hyun, who oversees Samsung's semiconductor division, visited the U.S. last week and met with Nvidia, signalling the company's commitment to closing the gap with competitors and securing new HBM chip 4 is projected to have a monthly capacity of 80,000 wafers, accounting for 40 per cent of P4's total capacity of 200,000 12-inch not officially confirmed, reports suggest Samsung is also considering restarting construction of its fifth plant at the Pyeongtaek Campus, known as P5. Groundwork for P5 began in 2023 but was halted early last year, the news platform P5 facility, requiring an estimated investment of over 30 trillion won ($22 billion), is designed to be a complex fab for DRAM, NAND flash, and foundry production."We are continuously reviewing various scenarios for resuming construction of our facilities," a Samsung official said, quoted by Korea report added that SK hynix is also scaling up production capacity. The chipmaker is expected to complete construction of its new M15X plant in Cheongju later this year. This facility will begin producing fifth-generation 10nm-class DRAM chips for next-generation HBM4 products, with a planned monthly capacity of approximately 90,000 SK hynix is investing in a new back-end production facility, dubbed "P&T 7," also located in Cheongju. The site will enhance packaging capabilities to boost the performance and energy efficiency of advanced DRAM market is expected to remain strong in the second half of the year, driven by demand for HBM chips, which play a key role in powering AI to the Export-Import Bank of Korea, the global AI semiconductor market is projected to grow from $41.1 billion in 2022 to $133 billion by 2028, the Korea Herald added.
Mint
a day ago
- Business
- Mint
South Korean chipmakers accelerate facility investments amid booming AI demand
Seoul [South Korea], : South Korea's leading semiconductor companies are increasing their investments in production facilities, driven by strong forecasts for rapid growth in the artificial intelligence chip market, reported the Korea Herald. Samsung Electronics is reviewing plans to restart construction of chip manufacturing plants in Korea, while SK hynix has recently begun building a new back-end processing facility. Citing industry sources, the Korean English daily said that tech giant Samsung is preparing to resume work on its Pyeongtaek Campus Line 4 , where construction was halted last year. P4, the company's fourth major chip facility at the site, is divided into four phases. While Phases 1 and 3 are nearing completion, sources have reported that work orders have recently been issued for Phases 2 and 4, with full-scale construction expected within two to three months, the news platform added. Initially planned for foundry production, two areas of the P4 facility are now expected to be converted into DRAM production lines. These will manufacture sixth-generation 1c DRAM using a 10-nanometer process, a technology Samsung confirmed it has successfully developed for next-generation high bandwidth memory chips. Vice Chair Jun Young-hyun, who oversees Samsung's semiconductor division, visited the U.S. last week and met with Nvidia, signalling the company's commitment to closing the gap with competitors and securing new HBM chip orders. Phase 4 is projected to have a monthly capacity of 80,000 wafers, accounting for 40 per cent of P4's total capacity of 200,000 12-inch wafers. Although not officially confirmed, reports suggest Samsung is also considering restarting construction of its fifth plant at the Pyeongtaek Campus, known as P5. Groundwork for P5 began in 2023 but was halted early last year, the news platform added. The P5 facility, requiring an estimated investment of over 30 trillion won , is designed to be a complex fab for DRAM, NAND flash, and foundry production. "We are continuously reviewing various scenarios for resuming construction of our facilities," a Samsung official said, quoted by Korea Herald. The report added that SK hynix is also scaling up production capacity. The chipmaker is expected to complete construction of its new M15X plant in Cheongju later this year. This facility will begin producing fifth-generation 10nm-class DRAM chips for next-generation HBM4 products, with a planned monthly capacity of approximately 90,000 wafers. Additionally, SK hynix is investing in a new back-end production facility, dubbed "P&T 7," also located in Cheongju. The site will enhance packaging capabilities to boost the performance and energy efficiency of advanced chips. The DRAM market is expected to remain strong in the second half of the year, driven by demand for HBM chips, which play a key role in powering AI processors. According to the Export-Import Bank of Korea, the global AI semiconductor market is projected to grow from USD 41.1 billion in 2022 to USD 133 billion by 2028, the Korea Herald added. This article was generated from an automated news agency feed without modifications to text.
Korea Herald
2 days ago
- Business
- Korea Herald
AI demand spurs chip giants' facility growth
South Korean semiconductor giants are ramping up facility investments to expand their future market share, encouraged by upbeat projections of explosive growth in the artificial intelligence chip sector. Samsung Electronics is reviewing plans to restart construction of new chip manufacturing plants in Korea, while SK hynix recently began construction of a new back-end processing facility. According to industry sources Thursday, Samsung is preparing to resume the construction of the Pyeongtaek Campus Line 4 (P4), which was halted last year. P4 is Samsung's fourth large-scale chip plant under construction, divided into four phases. Phases 1 and 3 are in their final stages of construction, while sources say orders have recently been issued to resume work on Phases 2 and 4. Full-scale construction is expected to begin within two to three months. Two areas at the P4 facility were originally planned for foundry production lines, but they are now expected to be converted into DRAM production lines to manufacture sixth-generation 1c DRAM using a 10-nanometer process. The chip giant confirmed this week that it has successfully developed the advanced technology, which will be used for the next-generation high bandwidth memory (HBM4) chips. Samsung Electronics Vice Chair Jun Young-hyun, who oversees the company's semiconductor business, traveled to the US last week to meet with Nvidia, signaling a renewed commitment to close the gap with competitors and secure new orders for the lucrative HBM chips. Phase 4 is expected to have a monthly capacity of 80,000 wafers, accounting for 40 percent of P4's total monthly capacity of 200,000 wafers based on 12-inch wafers. While Samsung did not confirm, there are reports that the chip giant is also considering restarting construction of what would be its fifth manufacturing plant at the Pyeongtaek Campus, known as P5. Groundwork for P5 began in 2023, but was halted early last year. P5 is expected to require an investment of more than 30 trillion won ($22 billion) and will be built as a complex fab capable of producing DRAM, NAND flash and foundry products. 'We are continuously reviewing various scenarios for resuming construction of our facilities,' a Samsung official said. SK hynix, a leading memory chip maker, is also preparing to expand its manufacturing volume for the coming years. Later this year, the chipmaker is expected to complete the construction of its new M15X plant in Cheongju, North Chungcheong Province, where it will start production of its fifth-generation 10nm-class DRAM chips for the next-generation HBM4 products. The facility is expected to have a capacity of around 90,000 wafers per month. SK hynix is also expanding investments to build a new back-end production facility, dubbed 'P&T 7,' on a site in Cheongju in a bid to strengthen its packaging capabilities to improve the performance and power efficiency of its advanced chips. The DRAM market is expected to show solid demand in the second half of the year, led by HBM chips, the critical DRAM components supporting AI processors. According to the Export-Import Bank of Korea, the global AI semiconductor market is projected to expand from $41.1 billion in 2022 to $133 billion by 2028.
Korea Herald
3 days ago
- Business
- Korea Herald
Samsung bets on Nvidia to reclaim HBM lead
Vice chair's Silicon Valley visit fuels hopes for Samsung's HBM3E supply to GPU giant Samsung Electronics Vice Chair Jun Young-hyun, who oversees the company's semiconductor business, has traveled to the US to meet with Nvidia, fueling expectations that Samsung could narrow the gap with competitors and win new orders for high bandwidth memory chips. According to industry sources on Wednesday, Jun visited Nvidia last week to discuss the supply of Samsung's fifth-generation HBM3E 12-layer products for the GPU maker's Blackwell Ultra GB300, as well as their foundry partnership. This visit to Silicon Valley came less than two months after a similar trip in early May. HBM chips are critical components that enhance the performance of AI processors. While smaller rivals like SK hynix and US-based Micron Technology have already supplied their latest HBM3E 12-layer chips to Nvidia — the largest customer for the advanced memory products — and secured a boost in earnings in the process, Samsung has struggled to pass qualification tests and has fallen behind. After a yearlong delay, Samsung redesigned its latest chip in the second quarter and is now pushing to supply the renewed version. The chipmaker recently delivered HBM3E 12-layer chips for AMD's next-generation MI350X AI accelerators, easing market doubts about its product quality. This has raised anticipation that Samsung could secure Nvidia's certification in the second half of the year. During the visit, Jun also reportedly discussed with Nvidia its next-generation HBM4 chips, which are expected to see market adoption next year. For the sixth-generation HBM4, Samsung plans to become the industry's first to adopt 1c DRAM technology, aimed to gain a competitive edge. SK hynix and Micron Technology already shipped their respective HBM4 samples to key customers in March and June, respectively. Their products reportedly use DRAM chips built on the older 1b process. "For new markets such as HBM4 and custom HBM chips, we will proceed with development and mass production according to the plan, without repeating last year's mistakes," Jun said at the company's shareholders meeting in March. Beyond memory chips, Samsung is seeking to secure contract manufacturing orders from Nvidia. Currently, the Korean chip giant produces Nvidia Tegra T239 chips for Nintendo's next-generation Switch 2 console, using its 8-nanometer process. The Switch 2 has been a commercial success, selling more than 3.5 million units within just four days of its launch in June, which is expected to help improve earnings for Samsung's foundry business. Samsung is now seeking to win orders for Nvidia's next-generation graphic process units using its cutting-edge 2nm gate-all-around process, which is scheduled for mass production by the end of this year. The GAA process is a transistor architecture first developed by Samsung, offering better power efficiency and performance than the widely used FinFET designs. Samsung began mass production of its 3nm GAA process in 2022, but initially struggled with yield rates, making it difficult to attract customers. The company has since improved 3nm yields and is now working to raise yields for its upcoming 2nm process. If Samsung can win Nvidia's high-volume GPU orders, it could significantly improve its financial results and strengthen its competitiveness in the AI chip market. "Securing Nvidia as a customer is critical to leading the next-generation HBM market," an industry official said. "As Samsung continues to report progress in overcoming the semiconductor downturn, its chances of expanding partnerships with major tech players are growing."
Korea Herald
17-06-2025
- Business
- Korea Herald
Samsung kicks off global strategy meeting amid rising trade, security risks
Samsung Electronics kicked off its semiannual global strategy meeting Tuesday, looking to map out business plans for the second half, as geopolitical tensions in the Middle East and renewed trade friction cloud the global business landscape. The three-day closed-door meeting brings together top executives from headquarters and regional subsidiaries. It is being led separately by Jun Young-hyun, head of the Device Solutions division, and Roh Tae-moon, acting head of the Device eXperience division. As has been the case in recent years, Chairman Lee Jae-yong is not expected to attend the sessions directly. He will instead receive a comprehensive briefing on the outcomes and strategic directions discussed. Samsung's global strategy meetings, held annually in June and December, serve as key touchpoints for aligning regional and divisional goals, reviewing market-specific challenges and refining marketing strategies. This year's meeting comes against a particularly turbulent backdrop. A potential return of former US President Donald Trump has reignited tariff concerns, while escalating hostilities between Israel and Iran have added to supply chain and security risks. On Tuesday, the Mobile eXperience division within the DX division convened to finalize plans for the global rollout of its next-generation foldable smartphones — the Galaxy Z Flip7 and Fold7 — scheduled for release next month. Regional launch strategies and sales targets were central topics. The following days will see strategy sessions held by the Visual Display and Digital Appliances divisions on Wednesday and by corporate-wide divisions on Thursday, focusing on reviewing first-half performance and setting a course for the remainder of the year. Compounding the pressure is the Trump administration's announcement of a steep 50 percent tariff on steel-derived components used in home appliances, such as refrigerators and washing machines, set to take effect on June 23. Meanwhile, the DS division, which oversees the tech giant's semiconductor operations, is set to hold its strategy meeting on Wednesday. In addition to evaluating first-half performance, executives will examine action plans to regain momentum in a faltering chip market. Samsung recently ceded its long-held No. 1 position in the global DRAM market to its crosstown rival SK hynix in the first quarter. Challenges in high-bandwidth memory and foundry services have also weighed on the firm's outlook. Industry sources suggest that the meeting will focus not only on revisiting the semiconductor road map but also on enhancing organizational culture and strengthening long-term competitiveness. Other key affiliates including Samsung Display, Samsung Electro-Mechanics and Samsung SDI are also holding their own strategy sessions this week to align business strategies for the second half.
