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KIOXIA LC9 Series 245.76 TB Enterprise SSD with Innovative 32-die Stack Memory Named ‘Best of Show' at FMS: the Future of Memory and Storage 2025
KIOXIA LC9 Series 245.76 TB Enterprise SSD with Innovative 32-die Stack Memory Named ‘Best of Show' at FMS: the Future of Memory and Storage 2025

Yahoo

time06-08-2025

  • Business
  • Yahoo

KIOXIA LC9 Series 245.76 TB Enterprise SSD with Innovative 32-die Stack Memory Named ‘Best of Show' at FMS: the Future of Memory and Storage 2025

SAN JOSE, Calif., August 06, 2025--(BUSINESS WIRE)--KIOXIA America, Inc. today announced that its KIOXIA LC9 Series 245.76 terabyte (TB)1 enterprise SSD, utilizing a 32-die stack KIOXIA BiCS FLASH™ generation 8 QLC 3D flash memory, has received the FMS 'Best of Show' award in the 'SSD Technology' category. These awards recognize the cutting-edge products, services, and customer implementations that are pushing the boundaries of memory and storage technology. The industry's first2 245.76 TB1 NVMe™ SSD in a 2.5-inch and Enterprise and Datacenter Standard Form Factor (EDSFF) E3.L form factor, KIOXIA LC9 Series drives are well-suited to generative AI and enterprise applications. KIOXIA LC9 Series SSDs are now sampling to select customers. "When customers evaluate SSDs, important consideration is given to storage that scales to high capacities while delivering high performance and low power consumption," said Jay Kramer, Chair of the Awards Program and President of Network Storage Advisors Inc. "We are proud to recognize KIOXIA for its BiCS FLASH™ 3D flash memory and KIOXIA LC9 Series SSD. This solution is enabled by their CBA (CMOS directly Bonded to Array) technology and the innovation of a 32-die stacked architecture in a package - delivering the capacity, power and density required for transformational SSDs. Creating the highest capacity2 PCIe® 5.0 enterprise SSD is a remarkable achievement and a clear reflection of Kioxia's leadership position." Featuring a 32-die stack of 2 terabit (Tb)3 BiCS FLASH™ QLC 3D flash memory with innovative CBA technology, KIOXIA LC9 Series SSDs deliver the speed, scale, and density required to support the next wave of AI-centric workloads. This combination of advanced memory architecture and CBA technology enables 8 TB3 in a small 154 BGA package – also an industry first2. This milestone was made possible with advancements in Kioxia's high-precision wafer processing, material design, and wire bonding technologies. "Achieving multiple industry firsts with the KIOXIA LC9 Series reflects the depth of innovation across our engineering, manufacturing, and design teams," said Scott Nelson, Executive Vice President and Chief Marketing Officer for KIOXIA America, Inc. "As AI workloads grow more demanding, we're committed to delivering the flash memory technologies that will power the data infrastructure of tomorrow and accelerate progress across industries." For more information, please visit and follow the company on X, formerly known as Twitter and LinkedIn®. About KIOXIA America, Inc. KIOXIA America, Inc. is the U.S.-based subsidiary of KIOXIA Corporation, a leading worldwide supplier of flash memory and solid-state drives (SSDs). From the invention of flash memory to today's breakthrough BiCS FLASH™ 3D technology, KIOXIA continues to pioneer innovative memory, SSD and software solutions that enrich people's lives and expand society's horizons. The company's innovative 3D flash memory technology, BiCS FLASH, is shaping the future of storage in high-density applications, including advanced smartphones, PCs, automotive systems, data centers and generative AI systems. For more information, please visit © 2025 KIOXIA America, Inc. All rights reserved. Information in this press release, including product pricing and specifications, content of services, and contact information is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable KIOXIA product specifications. Notes: 1: Definition of SSD capacity: Kioxia Corporation defines a kilobyte (KB) as 1,000 bytes, a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as 1,000,000,000 bytes, a terabyte (TB) as 1,000,000,000,000 bytes, and a kibibyte (KiB) is 1,024 bytes. A computer operating system, however, reports storage capacity using powers of 2 for the definition of 1GB = 2^30 bytes = 1,073,741,824 bytes and 1TB = 2^40 bytes = 1,099,511,627,776 bytes and therefore shows less storage capacity. Available storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software and operating system, and/or pre-installed software applications, or media content. Actual formatted capacity may vary.2: As of August 6, 2025, based on Kioxia survey.3: The flash memory capacity is calculated as 1 terabit (1 Tb) = 1,099,511,627,776 (2^40) bits, and 1 terabyte (1 TB) = 1,099,511,627,776 (2^40) bytes. 2.5-inch indicates the form factor of the SSD and not its physical size. NVMe is a registered or unregistered trademark of NVM Express, Inc. in the United States and other countries. PCIe is a registered trademark of PCI-SIG. LinkedIn is a trademark of LinkedIn Corporation and its affiliates in the United States and/or other countries. Other company names, product names and service names may be trademarks of third-party companies. View source version on Contacts Company Contact: Mia CoolKioxia America, (408) Media Contact: Dena JacobsonLages & AssociatesTel: (949) 453-8080dena@ Error in retrieving data Sign in to access your portfolio Error in retrieving data Error in retrieving data Error in retrieving data Error in retrieving data

KIOXIA LC9 Series 245.76 TB Enterprise SSD with Innovative 32-die Stack Memory Named ‘Best of Show' at FMS: the Future of Memory and Storage 2025
KIOXIA LC9 Series 245.76 TB Enterprise SSD with Innovative 32-die Stack Memory Named ‘Best of Show' at FMS: the Future of Memory and Storage 2025

Business Wire

time06-08-2025

  • Business
  • Business Wire

KIOXIA LC9 Series 245.76 TB Enterprise SSD with Innovative 32-die Stack Memory Named ‘Best of Show' at FMS: the Future of Memory and Storage 2025

SAN JOSE, Calif.--(BUSINESS WIRE)-- KIOXIA America, Inc. today announced that its KIOXIA LC9 Series 245.76 terabyte (TB) 1 enterprise SSD, utilizing a 32-die stack KIOXIA BiCS FLASH™ generation 8 QLC 3D flash memory, has received the FMS 'Best of Show' award in the 'SSD Technology' category. These awards recognize the cutting-edge products, services, and customer implementations that are pushing the boundaries of memory and storage technology. 'Achieving multiple industry firsts with the KIOXIA LC9 Series reflects the depth of innovation across our engineering, manufacturing, and design teams." Share The industry's first 2 245.76 TB 1 NVMe™ SSD in a 2.5-inch and Enterprise and Datacenter Standard Form Factor (EDSFF) E3.L form factor, KIOXIA LC9 Series drives are well-suited to generative AI and enterprise applications. KIOXIA LC9 Series SSDs are now sampling to select customers. 'When customers evaluate SSDs, important consideration is given to storage that scales to high capacities while delivering high performance and low power consumption,' said Jay Kramer, Chair of the Awards Program and President of Network Storage Advisors Inc. 'We are proud to recognize KIOXIA for its BiCS FLASH™ 3D flash memory and KIOXIA LC9 Series SSD. This solution is enabled by their CBA (CMOS directly Bonded to Array) technology and the innovation of a 32-die stacked architecture in a package - delivering the capacity, power and density required for transformational SSDs. Creating the highest capacity 2 PCIe ® 5.0 enterprise SSD is a remarkable achievement and a clear reflection of Kioxia's leadership position.' Featuring a 32-die stack of 2 terabit (Tb) 3 BiCS FLASH™ QLC 3D flash memory with innovative CBA technology, KIOXIA LC9 Series SSDs deliver the speed, scale, and density required to support the next wave of AI-centric workloads. This combination of advanced memory architecture and CBA technology enables 8 TB 3 in a small 154 BGA package – also an industry first 2. This milestone was made possible with advancements in Kioxia's high-precision wafer processing, material design, and wire bonding technologies. 'Achieving multiple industry firsts with the KIOXIA LC9 Series reflects the depth of innovation across our engineering, manufacturing, and design teams,' said Scott Nelson, Executive Vice President and Chief Marketing Officer for KIOXIA America, Inc. 'As AI workloads grow more demanding, we're committed to delivering the flash memory technologies that will power the data infrastructure of tomorrow and accelerate progress across industries.' For more information, please visit and follow the company on X, formerly known as Twitter and LinkedIn ®. About KIOXIA America, Inc. KIOXIA America, Inc. is the U.S.-based subsidiary of KIOXIA Corporation, a leading worldwide supplier of flash memory and solid-state drives (SSDs). From the invention of flash memory to today's breakthrough BiCS FLASH™ 3D technology, KIOXIA continues to pioneer innovative memory, SSD and software solutions that enrich people's lives and expand society's horizons. The company's innovative 3D flash memory technology, BiCS FLASH, is shaping the future of storage in high-density applications, including advanced smartphones, PCs, automotive systems, data centers and generative AI systems. For more information, please visit © 2025 KIOXIA America, Inc. All rights reserved. Information in this press release, including product pricing and specifications, content of services, and contact information is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable KIOXIA product specifications. Notes: 1: Definition of SSD capacity: Kioxia Corporation defines a kilobyte (KB) as 1,000 bytes, a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as 1,000,000,000 bytes, a terabyte (TB) as 1,000,000,000,000 bytes, and a kibibyte (KiB) is 1,024 bytes. A computer operating system, however, reports storage capacity using powers of 2 for the definition of 1GB = 2^30 bytes = 1,073,741,824 bytes and 1TB = 2^40 bytes = 1,099,511,627,776 bytes and therefore shows less storage capacity. Available storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software and operating system, and/or pre-installed software applications, or media content. Actual formatted capacity may vary. 2: As of August 6, 2025, based on Kioxia survey. 3: The flash memory capacity is calculated as 1 terabit (1 Tb) = 1,099,511,627,776 (2^40) bits, and 1 terabyte (1 TB) = 1,099,511,627,776 (2^40) bytes. 2.5-inch indicates the form factor of the SSD and not its physical size. NVMe is a registered or unregistered trademark of NVM Express, Inc. in the United States and other countries. PCIe is a registered trademark of PCI-SIG. LinkedIn is a trademark of LinkedIn Corporation and its affiliates in the United States and/or other countries. Other company names, product names and service names may be trademarks of third-party companies.

KIOXIA LC9 Series 245.76 TB Enterprise SSD with Innovative 32-die Stack Memory Named ‘Best of Show' at FMS: the Future of Memory and Storage 2025
KIOXIA LC9 Series 245.76 TB Enterprise SSD with Innovative 32-die Stack Memory Named ‘Best of Show' at FMS: the Future of Memory and Storage 2025

Yahoo

time06-08-2025

  • Business
  • Yahoo

KIOXIA LC9 Series 245.76 TB Enterprise SSD with Innovative 32-die Stack Memory Named ‘Best of Show' at FMS: the Future of Memory and Storage 2025

SAN JOSE, Calif., August 06, 2025--(BUSINESS WIRE)--KIOXIA America, Inc. today announced that its KIOXIA LC9 Series 245.76 terabyte (TB)1 enterprise SSD, utilizing a 32-die stack KIOXIA BiCS FLASH™ generation 8 QLC 3D flash memory, has received the FMS 'Best of Show' award in the 'SSD Technology' category. These awards recognize the cutting-edge products, services, and customer implementations that are pushing the boundaries of memory and storage technology. The industry's first2 245.76 TB1 NVMe™ SSD in a 2.5-inch and Enterprise and Datacenter Standard Form Factor (EDSFF) E3.L form factor, KIOXIA LC9 Series drives are well-suited to generative AI and enterprise applications. KIOXIA LC9 Series SSDs are now sampling to select customers. "When customers evaluate SSDs, important consideration is given to storage that scales to high capacities while delivering high performance and low power consumption," said Jay Kramer, Chair of the Awards Program and President of Network Storage Advisors Inc. "We are proud to recognize KIOXIA for its BiCS FLASH™ 3D flash memory and KIOXIA LC9 Series SSD. This solution is enabled by their CBA (CMOS directly Bonded to Array) technology and the innovation of a 32-die stacked architecture in a package - delivering the capacity, power and density required for transformational SSDs. Creating the highest capacity2 PCIe® 5.0 enterprise SSD is a remarkable achievement and a clear reflection of Kioxia's leadership position." Featuring a 32-die stack of 2 terabit (Tb)3 BiCS FLASH™ QLC 3D flash memory with innovative CBA technology, KIOXIA LC9 Series SSDs deliver the speed, scale, and density required to support the next wave of AI-centric workloads. This combination of advanced memory architecture and CBA technology enables 8 TB3 in a small 154 BGA package – also an industry first2. This milestone was made possible with advancements in Kioxia's high-precision wafer processing, material design, and wire bonding technologies. "Achieving multiple industry firsts with the KIOXIA LC9 Series reflects the depth of innovation across our engineering, manufacturing, and design teams," said Scott Nelson, Executive Vice President and Chief Marketing Officer for KIOXIA America, Inc. "As AI workloads grow more demanding, we're committed to delivering the flash memory technologies that will power the data infrastructure of tomorrow and accelerate progress across industries." For more information, please visit and follow the company on X, formerly known as Twitter and LinkedIn®. About KIOXIA America, Inc. KIOXIA America, Inc. is the U.S.-based subsidiary of KIOXIA Corporation, a leading worldwide supplier of flash memory and solid-state drives (SSDs). From the invention of flash memory to today's breakthrough BiCS FLASH™ 3D technology, KIOXIA continues to pioneer innovative memory, SSD and software solutions that enrich people's lives and expand society's horizons. The company's innovative 3D flash memory technology, BiCS FLASH, is shaping the future of storage in high-density applications, including advanced smartphones, PCs, automotive systems, data centers and generative AI systems. For more information, please visit © 2025 KIOXIA America, Inc. All rights reserved. Information in this press release, including product pricing and specifications, content of services, and contact information is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable KIOXIA product specifications. Notes: 1: Definition of SSD capacity: Kioxia Corporation defines a kilobyte (KB) as 1,000 bytes, a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as 1,000,000,000 bytes, a terabyte (TB) as 1,000,000,000,000 bytes, and a kibibyte (KiB) is 1,024 bytes. A computer operating system, however, reports storage capacity using powers of 2 for the definition of 1GB = 2^30 bytes = 1,073,741,824 bytes and 1TB = 2^40 bytes = 1,099,511,627,776 bytes and therefore shows less storage capacity. Available storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software and operating system, and/or pre-installed software applications, or media content. Actual formatted capacity may vary.2: As of August 6, 2025, based on Kioxia survey.3: The flash memory capacity is calculated as 1 terabit (1 Tb) = 1,099,511,627,776 (2^40) bits, and 1 terabyte (1 TB) = 1,099,511,627,776 (2^40) bytes. 2.5-inch indicates the form factor of the SSD and not its physical size. NVMe is a registered or unregistered trademark of NVM Express, Inc. in the United States and other countries. PCIe is a registered trademark of PCI-SIG. LinkedIn is a trademark of LinkedIn Corporation and its affiliates in the United States and/or other countries. Other company names, product names and service names may be trademarks of third-party companies. View source version on Contacts Company Contact: Mia CoolKioxia America, (408) Media Contact: Dena JacobsonLages & AssociatesTel: (949) 453-8080dena@ Error in retrieving data Sign in to access your portfolio Error in retrieving data Error in retrieving data Error in retrieving data Error in retrieving data

Scale AI Without Limits: KIOXIA Showcases Breakthrough Flash Storage Solutions at FMS 2025
Scale AI Without Limits: KIOXIA Showcases Breakthrough Flash Storage Solutions at FMS 2025

Business Upturn

time05-08-2025

  • Business
  • Business Upturn

Scale AI Without Limits: KIOXIA Showcases Breakthrough Flash Storage Solutions at FMS 2025

By Business Wire India Published on August 5, 2025, 14:54 IST Business Wire India Kioxia group, a world leader in memory solutions,will once again take center stage at FMS: the Future of Memory and Storage to spotlight how its flash memory and SSD innovations are driving scalable, efficient infrastructure for artificial intelligence (AI). With a focus on real-world applications and performance gains, Kioxia will demonstrate how its latest solutions meet the evolving demands of AI across data center and enterprise environments. This press release features multimedia. View the full release here: Scale AI Without Limits: KIOXIA Showcases Breakthrough Flash Storage Solutions at FMS 2025 Kioxia will spotlight its newest products, including the high-capacity KIOXIA LC9 Series – the industry's first1 245.76 terabyte (TB)2 NVMe™ SSD. Additional highlights include the KIOXIA CM9 Series and KIOXIA CD9P Series SSDs built with the company's BiCS FLASHTM generation 8 3D flash memory, delivering performance, power efficiency, and versatility. Kioxia will also display 1 terabit (Tb)3 3bit/cell (TLC) products with BiCS FLASHTM generation 9 and generation 10 3D flash memory technology. BiCS FLASHTM generation 9 and generation 10 3D flash memory incorporate interface standards, Toggle DD6.0, and leverage the SCA (Separate Command Address) protocol and a novel command address input method of its interface, and PI-LTT (Power Isolated Low-Tapped Termination) technology, which provide improvements in data input and output speed and power consumption reduction. At FMS 2025, Kioxia will give a keynote presentation and technical sessions covering a range of topics: FMS 2025 Keynote Presentation: 'Optimize AI Infrastructure Investments with Flash Memory Technology and Storage Solutions' Tuesday, August 5 at 11:00 am PDT Venue: Mission City Ballroom, Santa Clara Convention Center, First Floor Speakers: Katsuki Matsudera, General Manager of the Memory Technical Marketing Managing Department for Kioxia Corporation and Neville Ichhaporia, Senior Vice President and General Manager of the SSD Business Unit for KIOXIA America, Inc. Executive AI Premier Level Panel: 'Memory and Storage Scaling for AI Inferencing' Thursday, August 7 at 11:00 am PDT Venue: Mission City Ballroom, Santa Clara Convention Center, First Floor Speaker: Rory Bolt, Senior Fellow and Principal Architect of the SSD Business Unit for KIOXIA America Inc. KIOXIA Booth Demos Product and technology demonstrations will be given in the iconic 2-level KIOXIA booth #307 – featuring ten separate exhibit locations – on the show floor, including: Expanding Use Cases – High-Capacity Package/Low Latency Flash memory: 32-die stack in a small BGA package of BiCS FLASH TM generation 8 QLC 3D flash memory /XL-FLASH with a CXL™ interface 32-die stack in a small BGA package of BiCS FLASH generation 8 QLC 3D flash memory /XL-FLASH with a CXL™ interface KIOXIA BiCS FLASH TM generation 9 3D Flash Memory: 1 Tb 3 wafer and a small BGA package with 512Gb chip 1 Tb wafer and a small BGA package with 512Gb chip KIOXIA BiCS FLASH TM generation 10 3D Flash Memory: 1 Tb 3 wafer and model display 1 Tb wafer and model display KIOXIA UFS – Consumer and Automotive: High performance solutions for evolving markets High performance solutions for evolving markets High Capacity 245.76 TB 2 SSD in a Dell PowerEdge™ 7715: Featuring KIOXIA LC9 Series Enterprise NVMe SSDs Featuring KIOXIA LC9 Series Enterprise NVMe SSDs Performance and Power Demo: Featuring KIOXIA CD9P Series Data Center NVMe SSDs Featuring KIOXIA CD9P Series Data Center NVMe SSDs ML Perf Storage Training: Featuring KIOXIA CM9 Series Enterprise NVMe SSDs Featuring KIOXIA CM9 Series Enterprise NVMe SSDs GPU Direct SSD Emulation: Investigating GPU direct storage devices at 143 million IOPS Investigating GPU direct storage devices at 143 million IOPS KIOXIA AiSAQ™ Software: Enabling flexible balancing of capacity and performance Enabling flexible balancing of capacity and performance RAID Offload and Data Scrubbing: Featuring KIOXIA CM7 Series Enterprise NVMe SSDs Related Link: FMS 2025 Official Site Notes: 1: As of August 5, 2025. Based on Kioxia Corporation survey. 2: Definition of SSD capacity: Kioxia Corporation defines a kilobyte (KB) as 1,000 bytes, a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as 1,000,000,000 bytes, a terabyte (TB) as 1,000,000,000,000 bytes, and a kibibyte (KiB) is 1,024 bytes. A computer operating system, however, reports storage capacity using powers of 2 for the definition of 1GB = 2^30 bytes = 1,073,741,824 bytes and 1TB = 2^40 bytes = 1,099,511,627,776 bytes and therefore shows less storage capacity. Available storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software and operating system, and/or pre-installed software applications, or media content. Actual formatted capacity may vary. 3: The flash memory capacity is calculated as 1 terabit (1 Tb) = 1,099,511,627,776 (2^40) bits, and 1 terabyte (1 TB) = 1,099,511,627,776 (2^40) bytes. Universal Flash Storage (UFS) is a product category for a class of embedded memory products built to the JEDEC UFS standard specification. NVMe is a registered or unregistered mark of NVM Express, Inc. in the United States and other countries. CXL is a trademark of Compute Express Link Consortium, Inc. Dell, PowerEdge and other trademarks are trademarks of Dell Inc. or its subsidiaries. Other company names, product names and service names may be trademarks of third-party companies. About Kioxia Kioxia is a world leader in memory solutions, dedicated to the development, production and sale of flash memory and solid-state drives (SSDs). In April 2017, its predecessor Toshiba Memory was spun off from Toshiba Corporation, the company that invented NAND flash memory in 1987. Kioxia is committed to uplifting the world with 'memory' by offering products, services and systems that create choice for customers and memory-based value for society. Kioxia's innovative 3D flash memory technology, BiCS FLASH™, is shaping the future of storage in high-density applications, including advanced smartphones, PCs, automotive systems, data centers and generative AI systems. *Information in this document, including product prices and specifications, content of services and contact information, is correct on the date of the announcement but is subject to change without prior notice. View source version on Disclaimer: The above press release comes to you under an arrangement with Business Wire India. Business Upturn take no editorial responsibility for the same. Ahmedabad Plane Crash Business Wire India, established in 2002, India's premier media distribution company ensures guaranteed media coverage through its network of 30+ cities and top news agencies.

KIOXIA Launches UFS Ver. 4.1 Embedded Flash Memory Devices for Automotive Applications
KIOXIA Launches UFS Ver. 4.1 Embedded Flash Memory Devices for Automotive Applications

Yahoo

time31-07-2025

  • Automotive
  • Yahoo

KIOXIA Launches UFS Ver. 4.1 Embedded Flash Memory Devices for Automotive Applications

Inventors of Flash Memory Drive Next-Gen Automotive Innovation with Higher Performance, More Efficient Data Handling, and Automotive-Grade Reliability SAN JOSE, Calif., July 31, 2025--(BUSINESS WIRE)--KIOXIA America, Inc. today announced that it has begun sampling1 new Universal Flash Storage2 (UFS) Ver. 4.1 embedded memory devices designed for automotive applications. Engineered to meet the rigorous demands of next-generation in-vehicle systems, these new devices deliver significant performance, flexibility, and diagnostic enhancements - powered by KIOXIA's 8th generation BiCS FLASH™ 3D flash memory technology and in-house designed controller technology. Available in capacities of 128 gigabytes (GB), 256 GB, 512 GB and 1 terabyte (TB), the new UFS 4.1 devices are designed to fit the needs of infotainment, ADAS3, telematics, domain controllers, and vehicle computers. They meet AEC-Q100/1044 Grade 2 standards, supporting case temperature up to 115°C. Elevating the performance from KIOXIA's previous UFS 3.1 generation5, the new UFS 4.1 (512 GB) devices deliver6: Approximately 2.1 times sequential read performance Approximately 2.5 times sequential write performance Approximately 2.1 times random read performance Approximately 3.7 times random write performance These improvements provide a more responsive user experience in data-intensive automotive environments. Key features include: Compliant with the UFS 4.1 Specification, which includes WriteBooster related extensions such as WriteBooster Buffer Resizing and Pinned Partial Flush Mode, providing better flexibility for optimal performance. UFS 4.1 is backward compatible with UFS 4.0 and UFS 3.1 Enhanced Diagnostic Capabilities, including a newly added vendor-specific device health descriptor, simplifying device status monitoring and predictive maintenance 8th Generation KIOXIA BiCS FLASH 3D flash memory UFS Ver. 4.1 devices from KIOXIA integrate the company's innovative BiCS FLASH 3D flash memory and a controller in a JEDEC®-standard package. KIOXIA's 8th generation BiCS FLASH 3D flash memory introduces CBA (CMOS directly Bonded to Array) technology - an architectural innovation that marks a step-change in flash memory design. "KIOXIA continues to drive innovation in automotive memory with our new UFS 4.1 devices," said Maitry Dholakia, vice president, Memory Business Unit, KIOXIA America, Inc. "As modern vehicles grow more complex and technologies like AI, multi-gigabit Ethernet and real-time data processing become essential, our UFS 4.1 solutions empower developers to design the next generation of intelligent, responsive vehicles." For more information, please visit and follow the company on X, formerly known as Twitter and LinkedIn®. About KIOXIA America, Inc. KIOXIA America, Inc. is the U.S.-based subsidiary of KIOXIA Corporation, a leading worldwide supplier of flash memory and solid-state drives (SSDs). From the invention of flash memory to today's breakthrough BiCS FLASH™ 3D technology, KIOXIA continues to pioneer innovative memory, SSD and software solutions that enrich people's lives and expand society's horizons. The company's innovative 3D flash memory technology, BiCS FLASH, is shaping the future of storage in high-density applications, including advanced smartphones, PCs, automotive systems, data centers and generative AI systems. For more information, please visit © 2025 KIOXIA America, Inc. All rights reserved. Information in this press release, including product pricing and specifications, content of services, and contact information is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable KIOXIA product specifications. Notes: 1: Sample shipments of the 1TB device began in June, 128 GB and 256 GB device began in July. Specification of the samples may differ from commercial products2: Universal Flash Storage (UFS) is a product category for a class of embedded memory products built to the JEDEC UFS standard specification. Due to its serial interface, UFS supports full duplexing, which enables both concurrent reading and writing between the host processor and UFS device3: Advanced Driver Assistance System4: Electrical component qualification requirements defined by the AEC (Automotive Electronics Council)5: UFS3.1 512 GB device "THGJFGT2T85BAB5"6: Based on Kioxia internal testing In every mention of a KIOXIA product: Product density is identified based on the density of memory chips(s) within the product, not the amount of memory capacity available for data storage by the end user. In terms of product capacity, available user storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software and operating system, pre-installed software applications, media content, and other constraints. Actual formatted capacity may vary. KIOXIA Corporation defines a gigabit (Gb) as 1,073,741,824 bits, a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as 1,000,000,000 bytes and a terabyte (TB) as 1,000,000,000,000 bytes. However, a computer operating system, reports storage capacity using powers of 2 for the definition of 1 GB = 2^30 bytes = 1,073,741,824 bytes and 1 TB = 2^40 bytes = 1,099,511,627,776 bytes. Read and write speeds are the best values obtained in a specific test environment at Kioxia Corporation and Kioxia Corporation warrants neither read nor write speeds in individual devices. Read and write speed may vary depending on a device used and file size read or written. LinkedIn is a trademark of LinkedIn Corporation and its affiliates in the United States and/or other countries. JEDEC is a registered trademark of JEDEC Solid State Technology Association All company names, product names and service names may be trademarks of third-party companies. View source version on Contacts MEDIA CONTACT:Dena JacobsonLages & AssociatesTel.: (949) 453-8080dena@ COMPANY CONTACT:Mia CoolKIOXIA America, (408) Error in retrieving data Sign in to access your portfolio Error in retrieving data

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