Latest news with #KevinZhang
CNA
27-05-2025
- Business
- CNA
TSMC still evaluating ASML's 'High-NA' as Intel eyes future use
AMSTERDAM :Taiwan Semiconductor Manufacturing Co ( the world's largest contract chipmaker, is still assessing when it will use ASML's cutting-edge high numerical aperture (NA) machines for its future process nodes, an executive said on Tuesday. Chipmakers are weighing when the speed and accuracy benefits of these nearly $400 million machines will outweigh the almost doubled price tag of what is already the most expensive piece of equipment in a chip fabrication plant. Asked if TSMC plans to use the machine for its upcoming A14, and enhanced versions of the future node, Kevin Zhang said the company hasn't yet found a compelling reason. "A14, the enhancement I talk about, is very substantial without using High-NA. So our technology team continues to find a way to extend the life of current (Low-NA EUV machines) by harvesting the scaling benefit," he said at a press briefing. "As long as they continue to find a way, obviously we don't have to use it," Zhang said. Rival Intel has planned to use the High-NA EUV machine in its future manufacturing process, known as 14A, in an attempt to revive its contract chip business and better compete with TSMC. However, Intel also says that customers will still have the option of using older and more proven technologies. During ASML's last earnings report, CEO Christophe Fouquet said he expects customers to test High-NA for high-volume manufacturing readiness through 2026-2027, before they evaluate the tool on their most advanced nodes in a latter phase. Last year, Zhang had told reporters TSMC will not use High-NA for its A16 node, adding he did not like the sticker price. So far, ASML has shipped five of the 180 ton, double-decker sized machine across the world to three customers, counting Intel, TSMC and Samsung.
Time of India
17-05-2025
- Automotive
- Time of India
Global semiconductor industry to grow by over 10% in 2025, says Taiwan's SMC
The global semiconductor industry is expected to grow by more than 10 per cent in 2025, with strong demand being driven by artificial intelligence (AI) technologies, as per a Focus Taiwan report which cited a senior Taiwan Semiconductor Manufacturing Co. ( TSMC ) executive. According to a news report on Thursday in Focus Taiwan, the industry is likely to reach a market value of over USD1 trillion by 2030. The report also highlighted that the TSMC Deputy Co-Chief Operating Officer Kevin Zhang said the semiconductor sector is going through an "invigorating" period despite recent fluctuations in the market. Zhang, who is also the company's Senior Vice President for Business Development and Global Sales, highlighted the growing demand for advanced chips used in AI applications, smartphones, computers, and internet of things ( IoT ) devices. He noted that AI had a breakthrough year in 2024, and this trend is expected to continue in 2025. As a result, demand for chips manufactured using 5 nanometer (nm), 4 nm, and 3 nm technologies will remain strong. These advanced chips are widely used in AI-driven applications. While the automotive market is facing some challenges, Zhang pointed out that new technologies like autonomous driving are boosting demand. "While the automobile market is flagging, there continue to be new technologies, such as autonomous driving, driving demand for 12 nm and 8 nm products, as well as possibly 5 nm in the future", Zhang said, as per a news report by Focus Taiwan. Looking ahead, Zhang said that by 2030, AI applications are projected to account for 45 percent of semiconductor sales. Smartphones will contribute around 25 percent, automobiles 15 percent, and IoT devices 10 percent. On the technology front, Zhang shared that TSMC plans to start mass production of its advanced 14A (1.4 nm) chips in 2028. These chips will be 10-15 percent faster than the upcoming 2 nm chips or use 25-30 percent less power while delivering the same performance. Overall, Zhang expressed confidence that the industry will continue to grow at a healthy pace in the coming years.
Malaysian Reserve
24-04-2025
- Business
- Malaysian Reserve
TSMC's cutting-edge A14 chip tech to start production in 2028
TAIWAN Semiconductor Manufacturing Co. plans to begin production with its A14 fabrication process in 2028, aiming to remain at the cutting edge of the chip industry. The technology will advance the world's biggest chipmaker beyond its current state-of-the-art 3-nanometer fabrication and the upcoming 2-nm later this year. In a change of nomenclature, TSMC also plans an intermediary A16 chip process for late 2026. TSMC's shares rose as much as 1.5% in early trading Thursday as Asian markets gyrated after mixed signals from the Trump administration on its plans for China tariffs. Taiwan's most valuable company has kept up a steady pace of upgrades that's seen it corral Apple Inc. and Nvidia Corp.'s most lucrative chipmaking business. The company plans about $40 billion in capital expenditures this year, and its top executives have said its long-term plans are still geared to capture strong AI-driven demand. At a company event in California Wednesday, executives laid out the new addition to TSMC's road map and detailed how it will help improve power efficiency and performance. Deputy Co-Chief Operating Officer Kevin Zhang said he sees an industry shift afoot: Where smartphone component makers used to be the first adopters of new production technology, the boom in artificial intelligence has made designers of larger AI chips more willing to jump to the latest innovation sooner. TSMC remains confident that overall demand for semiconductors will continue to rise and total industry revenue will 'easily' exceed $1 trillion by the end of the decade, according to Zhang. While that's a sales target the chip industry has largely embraced, investor anxiety about an AI bubble has grown in recent weeks with the announcement of wide-ranging tariffs by the US. –BLOOMBERG
The Hindu
24-04-2025
- Business
- The Hindu
TSMC shows off new tech for stitching together bigger, faster chips
Taiwan Semiconductor Manufacturing Co on Wednesday unveiled technology for making faster chips and putting them together in dinner-plate-sized packages that will boost performance needed for artificial intelligence applications. It said its A14 manufacturing technology will arrive in 2028 and will be able to produce processors that are 15% faster at the same power consumption as its N2 chips due to enter production this year, or will use 30% less power at the same speed as the N2 chips. The world's biggest contract manufacturer, which counts Nvidia and Advanced Micro Devices as clients, said its forthcoming "System on Wafer-X" will be able to weave together at least 16 large computing chips, as well as memory chips and fast optical interconnections and new technology, to deliver thousands of watts of power to the chips. By comparison, Nvidia's current flagship graphics processing units consist of two large chips stitched together, and its "Rubin Ultra" GPUs due out in 2027 will stitch four together. TSMC said plans to build two factories to carry out the work near its chip plants in Arizona, with plans for a total of six chip factories, two packaging factories, and a research and development center at the site. "As we continue to bring more advanced silicon to Arizona, you need a continuous effort to enhance that silicon," Kevin Zhang, deputy co-chief operations officer and senior vice president, said on Wednesday. Intel, which is working to build out a contract manufacturing business to compete with TSMC, is due to announce new manufacturing technologies next week. Last year, it claimed it would overtake TSMC in making the world's fastest chips. Demand for massive AI chips that are packaged together has shifted the battleground between the two firms from simply making fast chips to integrating them - a complex task that requires working closely with customers. "They're both neck-and-neck. You're not going to pick one over the other because they have the technological lead," said Dan Hutcheson, vice chair at analyst firm TechInsights. "You're going to pick one over the other for different reasons." Customer service, pricing and how much wafer allocation can be obtained are likely to influence a company's decision about which chip manufacturer would be best.
Straits Times
24-04-2025
- Business
- Straits Times
TSMC shows off new tech for stitching together bigger, faster chips
SANTA CLARA, California - Taiwan Semiconductor Manufacturing Co (TSMC) on April 23 unveiled technology for making faster chips and putting them together in dinner-plate-sized packages that will boost performance needed for artificial intelligence (AI) applications. It said its A14 manufacturing technology will arrive in 2028 and will be able to produce processors that are 15 per cent faster at the same power consumption as its N2 chips due to enter production this year, or will use 30 per cent less power at the same speed as the N2 chips. The world's biggest contract manufacturer, which counts Nvidia and Advanced Micro Devices as clients, said its forthcoming 'System on Wafer-X' will be able to weave together at least 16 large computing chips, as well as memory chips and fast optical interconnections and new technology, to deliver thousands of watts of power to the chips. By comparison, Nvidia's current flagship graphics processing units consist of two large chips stitched together, and its 'Rubin Ultra' GPUs due out in 2027 will stitch four together. TSMC said it plans to build two factories to carry out the work near its chip plants in Arizona, with plans for a total of six chip factories, two packaging factories, and a research and development centre at the site. 'As we continue to bring more advanced silicon to Arizona, you need a continuous effort to enhance that silicon,' said Kevin Zhang, TSMC's deputy co-chief operations officer and senior vice president. Intel, which is working to build out a contract manufacturing business to compete with TSMC, is due to announce new manufacturing technologies next week. In 2024, it claimed it would overtake TSMC in making the world's fastest chips. Demand for massive AI chips that are packaged together has shifted the battleground between the two firms from simply making fast chips to integrating them - a complex task that requires working closely with customers. 'They're both neck-and-neck. You're not going to pick one over the other because they have the technological lead,' said Dan Hutcheson, vice chair at analyst firm TechInsights. 'You're going to pick one over the other for different reasons.' Customer service, pricing and how much wafer allocation can be obtained are likely to influence a company's decision about which chip manufacturer would be best. REUTERS Join ST's Telegram channel and get the latest breaking news delivered to you.
