Latest news with #MEMS
Yahoo
03-06-2025
- Business
- Yahoo
MEMSCAP: Minutes of the Annual Combined General Meeting Held on June 3, 2025
GRENOBLE, France, June 03, 2025--(BUSINESS WIRE)--Regulatory News: MEMSCAP (Euronext Paris: MEMS), leading provider of high-accuracy, high-stability pressure sensor solutions for the aerospace and medical markets using MEMS technology (Micro Electro Mechanical Systems), today announces that its annual combined general meeting was held on June 3, 2025, at 5:00 PM at the company's headquarters located in Parc Activillage des Fontaines, Bernin (38), France. At the annual combined general meeting held on June 3, 2025, the shareholders of MEMSCAP S.A. approved, by a very large majority, all the resolutions submitted for their approval, with the exception of the 21st resolution (Delegation of authority to increase capital for the benefit of employees), which was rejected in line with the recommendations of the board of directors. The shareholders present, represented, or having voted remotely accounted for 2,094,499 shares, representing 27.57% of the shares with voting rights, and 2,749,924 votes, representing 33.06% of the total voting rights. About MEMSCAP MEMSCAP is a leading provider MEMS based pressure sensors, best-in-class in term of precision and stability (very low drift) for two market segments: aerospace and medical. MEMSCAP also provides variable optical attenuators (VOA) for the optical communications market. For more information, visit our website at: MEMSCAP is listed on Euronext Paris (Euronext Paris - Memscap - ISIN code: FR0010298620 - Ticker symbol: MEMS) View source version on Contacts Yann CousinetChief Financial OfficerPh.: +33 (0) 4 76 92 85 Error in retrieving data Sign in to access your portfolio Error in retrieving data Error in retrieving data Error in retrieving data Error in retrieving data
Business Wire
03-06-2025
- Business
- Business Wire
MEMSCAP: Minutes of the Annual Combined General Meeting Held on June 3, 2025
GRENOBLE, France--(BUSINESS WIRE)--Regulatory News: MEMSCAP (Euronext Paris: MEMS), leading provider of high-accuracy, high-stability pressure sensor solutions for the aerospace and medical markets using MEMS technology (Micro Electro Mechanical Systems), today announces that its annual combined general meeting was held on June 3, 2025, at 5:00 PM at the company's headquarters located in Parc Activillage des Fontaines, Bernin (38), France. At the annual combined general meeting held on June 3, 2025, the shareholders of MEMSCAP S.A. approved, by a very large majority, all the resolutions submitted for their approval, with the exception of the 21 st resolution (Delegation of authority to increase capital for the benefit of employees), which was rejected in line with the recommendations of the board of directors. The shareholders present, represented, or having voted remotely accounted for 2,094,499 shares, representing 27.57% of the shares with voting rights, and 2,749,924 votes, representing 33.06% of the total voting rights. About MEMSCAP MEMSCAP is a leading provider MEMS based pressure sensors, best-in-class in term of precision and stability (very low drift) for two market segments: aerospace and medical. MEMSCAP also provides variable optical attenuators (VOA) for the optical communications market. For more information, visit our website at: MEMSCAP is listed on Euronext Paris (Euronext Paris - Memscap - ISIN code: FR0010298620 - Ticker symbol: MEMS)
Associated Press
27-05-2025
- Automotive
- Associated Press
The 7th Smart Sensor Industry Development Conference opens in Bengbu
BENGBU, China, May 27, 2025 (GLOBE NEWSWIRE) -- On May 24, the 7th Smart Sensor Industry Development Conference kicked off in Bengbu, Anhui Province and attracted over 700 experts and enterprise representatives. The event has been held in Bengbu for six consecutive sessions since 2017, emerging as a key platform to boost the innovative development of the city's smart sensor sector and its leapfrog transformation from a technology chaser to an industry leader. In recent years, Bengbu has concentrated efforts on building China Sensor Valley through collaborative innovation involving government, industry, academia, research, finance, application, and service. It has gathered more than 200 enterprises engaged in the smart sensor sector, including 69 high-tech companies and 40 provincial-level 'little giant' SMEs (that specialize in niche sector, command a high market share, and have strong innovative capacity and core technologies). The city is also home to the only enterprise in Anhui Province that has both integrated circuit and MEMS wafer production lines, which is rare even nationwide. Themed 'Chip Convergence in Jianghuai, Smart Sensing for the World', this session of the conference focused on cutting-edge fields such as automotive, medical, and robotics. At its opening ceremony, the 2025 ReportonChina MEMS Industry Development and Top 10 High-Quality SensorIndustrialParks was released, in which Bengbu Economic Development Zone is included. Enterprises showcased innovative achievements including ultra-low noise bio-signal acquisition chips and multi-channel EEG acquisition systems, and announced the successful trial production of the first batch of products from 8-inch MEMS wafer production line. Scheduled to achieve a monthly capacity of 30,000 wafers, with 10,000 wafers attainable by the end of this year, this production line will become a core force in China's micro-electromechanical systems (MEMS) industry. During the event, 3 innovation platforms including the Yangtze River Delta (Bengbu) Industry-Education Integration Collaborative Center and the Automotive Intelligent Sensing Special Committee were inaugurated, housing settlement allowances were granted to 5 high-level talents, and agreements on 20 key projects were signed, which injected new momentum into the development of this industry. Source: 7th Smart Sensor Industry Development Conference Contact person: Ms. Cao, Tel: 86-10-63074558
Techday NZ
25-05-2025
- Science
- Techday NZ
Wellington researchers pioneer low-cost earthquake alert system
Researchers from Te Kunenga ki Pūrehuroa Massey University have successfully trialled a decentralised, low-cost Earthquake Early Warning System (EEWS) in Wellington. The project, led by Dr Chanthujan Chandrakumar during his doctoral studies at the CRISiSLab within Massey University's Joint Centre for Disaster Research, is described as the first real-time trial of a community-based EEWS in New Zealand, and the first global demonstration of a decentralised, community-engaged EEWS. Aotearoa New Zealand is recognised as one of the world's most seismically active regions, yet there is currently no official early warning system in place. Dr Chandrakumar noted his surprise at this absence, stating that the initiative demonstrates a significant step forward. Dr Chandrakumar explained, "Unlike traditional national systems that rely on expensive equipment and centralised data processing, this innovative system utilises low-cost Micro-Electro-Mechanical Systems (MEMS) sensors hosted by local volunteers. "Each sensor independently detects seismic activity and issues alerts, eliminating the delay of central processing and allowing for faster local responses, which could ultimately reduce devastation and potentially save lives," he explains. The EEWS operates using two specific algorithms tailored to New Zealand. The first, NZ-PLUM, is an adaptation of Japan's PLUM algorithm to fit New Zealand's Modified Mercalli Intensity (MMI) scale. This algorithm focuses on detecting damaging Secondary (S) waves, which are slower, higher-amplitude seismic waves that cause the most shaking and damage during earthquakes. The second algorithm, NZ-PLUM-P, uses data from Primary (P) waves. P-waves typically arrive before S-waves and usually cause minimal shaking. NZ-PLUM-P aims to predict the intensity of the upcoming S-waves, allowing alerts to be issued earlier and thus increasing the window available for protective action. The combined use of both algorithms provides what Dr Chandrakumar describes as a dual-layered approach, enhancing both the system's responsiveness and accuracy. During a three-month trial in Wellington, the EEWS demonstrated its capacity to accurately detect all significant earthquakes that occurred over the period. NZ-PLUM-P consistently provided faster alerts than NZ-PLUM. The system did record a small number of false alerts, which were mainly attributed to the early-detection nature of NZ-PLUM-P, but these remained within what the researchers consider acceptable limits for operational use. Dr Chandrakumar noted the study also highlighted the advantages of a decentralised alerting model, showing that locally-generated alerts can rival the performance of centralised systems while reducing both infrastructure and operating costs. An essential element of the project is its focus on community engagement. Dr Chandrakumar said, "Local volunteers not only hosted the sensors, but also played a vital role in maintaining the system. This participatory model fosters trust, awareness and preparedness at the community level, key elements for resilience in disaster-prone regions," he says. The cost and scalability implications are significant, particularly for countries with restricted resources. Many regions around the world find national-level EEWSs prohibitively expensive. Dr Chandrakumar believes this approach offers a viable alternative: "It's a solution tailored not just to New Zealand but to vulnerable communities globally," he says. The increasing risks posed by climate change and urbanisation add further urgency to earthquake preparedness. Dr Chandrakumar indicated that with appropriate maintenance and continued community involvement, both the number and quality of sensors can be scaled up across New Zealand. "This kind of network could significantly enhance coverage and act as a valuable support to a future national EEW system implemented by the government. Similar low-cost EEW networks are already in place in other countries to complement their national systems. There's no reason New Zealand couldn't do the same. This research proves it's possible," he says. The outcomes of the research have been detailed in a paper published in Seismological Research Letters. The project team included supervision from Associate Professor Raj Prasanna, Dr Caroline Holden, Dr Max Stephens, and Dr Marion Tan.
Yahoo
03-03-2025
- Business
- Yahoo
QCY Partners with USound to Introduce Next-Generation TWS Featuring MEMS Speaker Technology in 2025
DONGGUAN, China, March 3, 2025 /PRNewswire/ -- QCY, a prominent name in the wireless audio industry, has announced a strategic partnership with USound, a leader in MEMS (Micro-Electro-Mechanical Systems) speaker technology. Together, the two companies are set to launch a new True Wireless Stereo (TWS) product in 2025, aiming to redefine audio performance, design, and efficiency in the wireless earbuds market. Advancing Wireless Audio with MEMS Technology Founded in 2009, QCY has established itself as a pioneer in wireless audio innovation. As the flagship brand of Dongguan Hele Electronics—a recognized high-tech enterprise—QCY has consistently delivered innovative and accessible audio products to a global audience. The upcoming TWS product, integrating USound's MEMS speaker technology, is designed to enhance audio precision, reduce distortion, and improve power efficiency, delivering a wider frequency response within a more compact design, elevating the listening experience for users. Insights from Industry Leaders Ferruccio Bottoni, CEO and Co-founder of USound, commented on the collaboration: "We are pleased to partner with QCY, a globally recognized brand, to develop a new generation of TWS earbuds powered by USound's MEMS speaker technology. This partnership reflects the industry's confidence in our technology, which offers superior reliability and bandwidth compared to traditional solutions. With USound's wideband capabilities, the new TWS product will be Hi-Res Audio certified, delivering an exceptional listening experience. We look forward to working with QCY to bring this innovation to market." Bruce Way, QCY's Chief Acoustic Engineer, added: "We are excited to collaborate with USound on this innovative TWS product. By combining QCY's expertise in consumer audio with USound's advanced MEMS speaker technology, we aim to set a new benchmark in wireless sound quality. This collaboration will enable us to offer users an unparalleled audio experience." Looking Ahead The new TWS earbuds are slated for release in 2025, with QCY and USound working diligently to ensure a successful launch. This collaboration represents a significant step forward in the wireless audio industry, promising users a more immersive and high-fidelity listening experience. For further updates, visit About QCYQCY, a leading global audio brand under Dongguan Hele Electronics, is dedicated to advancing wireless audio through technological innovation and smart design. With over 16 years of industry expertise and millions of users worldwide, QCY continues to explore new frontiers in consumer electronics. About USoundUSound is a rapidly growing MEMS speaker company focused on enabling the next generation of audio products. Known for its miniaturization, energy efficiency, and scalable production capabilities, USound empowers brands to create high-performance, cutting-edge audio solutions. Learn more at PR ContactTracy, Senior PR Manager, QCYpr@ Rice, Marketing Director, QCYRice@ View original content to download multimedia: SOURCE QCY Sign in to access your portfolio
