Latest news with #MSquare
Yahoo
22-05-2025
- Business
- Yahoo
Powering AI with Chiplet Innovation: MSquare's ML100 IO Die Live at COMPUTEX 2025
TAIPEI, May 22, 2025 /PRNewswire/ -- COMPUTEX 2025, Asia's largest and most influential technology event, is currently underway at the Taipei Nangang Exhibition Center, attracting over 50,000 professionals from 34 countries. Making its debut at the show, MSquare Technology is showcasing the ML100 IO Die—the Chiplet solution designed for AI SoC architectures—demonstrating cutting-edge advancements in Chiplet integration and high-speed interconnect solutions. With the theme "AI Next," the event highlights AI & Robotics, Next-Gen Tech, and Future Mobility. As AI models scale exponentially, traditional SoC integration is hitting bandwidth, power, and cost bottlenecks. In response, MSquare introduces a more flexible and energy-efficient Chiplet-based interconnect solution—the ML100 IO Die. The ML100 IO Die is an interconnect Chiplet designed for data centers and high-performance computing, integrating advanced UCIe protocol and HBM3 memory interface technology. By decoupling Soc and HBM through Chiplet partitioning, ML100 optimizes die area, cost, and power consumption while significantly increasing memory bandwidth. It supports 32Gbps UCIe PHY with a peak bandwidth of 1TB/s, significantly outperforming traditional monolithic SoC packaging solutions. It is ideally suited for AI accelerators, inference engines, and high-performance computing chips. In recognition of its innovation, ML100 received the "Best IP of the Year" award from EE Awards Asia 2024. Founded in 2021, MSquare Technology is led by a global team of semiconductor veterans from AMD, Apple, and MediaTek. The company develops high-speed interface IP and Chiplet solutions across diverse protocols—including UCIe, HBM, ONFI, LPDDR, PCIe, and USB—covering process nodes from 5nm to 180nm. Its technologies are deployed across AI, data center, HPC, and advanced consumer applications. MSquare has offices in APAC, US and Australia, forming a global support network to drive faster customer engagement and international deployment. "Chiplet interconnects are the foundation of scalable AI computing," said Rui Tang, Co-founder of MSquare Technology. "By participating in COMPUTEX, we aim to deepen collaboration with ecosystem partners and drive the adoption of next-gen SoC architectures optimized for bandwidth, power, and flexibility." Visit MSquare Technology at COMPUTEX 2025 – Booth N1231, Hall 1, Taipei Nangang Exhibition Center. View original content to download multimedia: SOURCE MSquare Technology Error in retrieving data Sign in to access your portfolio Error in retrieving data Error in retrieving data Error in retrieving data Error in retrieving data
Korea Herald
22-05-2025
- Business
- Korea Herald
Powering AI with Chiplet Innovation: MSquare's ML100 IO Die Live at COMPUTEX 2025
TAIPEI, May 22, 2025 /PRNewswire/ -- COMPUTEX 2025, Asia's largest and most influential technology event, is currently underway at the Taipei Nangang Exhibition Center, attracting over 50,000 professionals from 34 countries. Making its debut at the show, MSquare Technology is showcasing the ML100 IO Die—the Chiplet solution designed for AI SoC architectures—demonstrating cutting-edge advancements in Chiplet integration and high-speed interconnect solutions. With the theme "AI Next," the event highlights AI & Robotics, Next-Gen Tech, and Future Mobility. As AI models scale exponentially, traditional SoC integration is hitting bandwidth, power, and cost bottlenecks. In response, MSquare introduces a more flexible and energy-efficient Chiplet-based interconnect solution—the ML100 IO Die. The ML100 IO Die is an interconnect Chiplet designed for data centers and high-performance computing, integrating advanced UCIe protocol and HBM3 memory interface technology. By decoupling Soc and HBM through Chiplet partitioning, ML100 optimizes die area, cost, and power consumption while significantly increasing memory bandwidth. It supports 32Gbps UCIe PHY with a peak bandwidth of 1TB/s, significantly outperforming traditional monolithic SoC packaging solutions. It is ideally suited for AI accelerators, inference engines, and high-performance computing chips. In recognition of its innovation, ML100 received the "Best IP of the Year" award from EE Awards Asia 2024. Founded in 2021, MSquare Technology is led by a global team of semiconductor veterans from AMD, Apple, and MediaTek. The company develops high-speed interface IP and Chiplet solutions across diverse protocols—including UCIe, HBM, ONFI, LPDDR, PCIe, and USB—covering process nodes from 5nm to 180nm. Its technologies are deployed across AI, data center, HPC, and advanced consumer applications. MSquare has offices in APAC, US and Australia, forming a global support network to drive faster customer engagement and international deployment. "Chiplet interconnects are the foundation of scalable AI computing," said Rui Tang, Co-founder of MSquare Technology."By participating in COMPUTEX, we aim to deepen collaboration with ecosystem partners and drive the adoption of next-gen SoC architectures optimized for bandwidth, power, and flexibility." Visit MSquare Technology at COMPUTEX 2025 – Booth N1231, Hall 1, Taipei Nangang Exhibition Center.
Yahoo
22-05-2025
- Business
- Yahoo
Powering AI with Chiplet Innovation: MSquare's ML100 IO Die Live at COMPUTEX 2025
TAIPEI, May 22, 2025 /PRNewswire/ -- COMPUTEX 2025, Asia's largest and most influential technology event, is currently underway at the Taipei Nangang Exhibition Center, attracting over 50,000 professionals from 34 countries. Making its debut at the show, MSquare Technology is showcasing the ML100 IO Die—the Chiplet solution designed for AI SoC architectures—demonstrating cutting-edge advancements in Chiplet integration and high-speed interconnect solutions. With the theme "AI Next," the event highlights AI & Robotics, Next-Gen Tech, and Future Mobility. As AI models scale exponentially, traditional SoC integration is hitting bandwidth, power, and cost bottlenecks. In response, MSquare introduces a more flexible and energy-efficient Chiplet-based interconnect solution—the ML100 IO Die. The ML100 IO Die is an interconnect Chiplet designed for data centers and high-performance computing, integrating advanced UCIe protocol and HBM3 memory interface technology. By decoupling Soc and HBM through Chiplet partitioning, ML100 optimizes die area, cost, and power consumption while significantly increasing memory bandwidth. It supports 32Gbps UCIe PHY with a peak bandwidth of 1TB/s, significantly outperforming traditional monolithic SoC packaging solutions. It is ideally suited for AI accelerators, inference engines, and high-performance computing chips. In recognition of its innovation, ML100 received the "Best IP of the Year" award from EE Awards Asia 2024. Founded in 2021, MSquare Technology is led by a global team of semiconductor veterans from AMD, Apple, and MediaTek. The company develops high-speed interface IP and Chiplet solutions across diverse protocols—including UCIe, HBM, ONFI, LPDDR, PCIe, and USB—covering process nodes from 5nm to 180nm. Its technologies are deployed across AI, data center, HPC, and advanced consumer applications. MSquare has offices in APAC, US and Australia, forming a global support network to drive faster customer engagement and international deployment. "Chiplet interconnects are the foundation of scalable AI computing," said Rui Tang, Co-founder of MSquare Technology. "By participating in COMPUTEX, we aim to deepen collaboration with ecosystem partners and drive the adoption of next-gen SoC architectures optimized for bandwidth, power, and flexibility." Visit MSquare Technology at COMPUTEX 2025 – Booth N1231, Hall 1, Taipei Nangang Exhibition Center. View original content to download multimedia: SOURCE MSquare Technology
Korea Herald
03-04-2025
- Business
- Korea Herald
MSquare Technology Wins Dual Gold at the 2025 Asia-Pacific Stevie® Awards
SHANGHAI, April 3, 2025 /PRNewswire/ -- MSquare Technology and its founder & CEO, Wendy Chen, were awarded top honors at the 2025 Asia-Pacific Stevie® Awards. MSquare received the Gold Stevie® for Most Innovative Tech Startup of the Year – Service, in recognition of its cutting-edge IP and Chiplet solutions. Wendy Chen was named the Gold Stevie® winner for Most Innovative Woman of the Year, honored for leading MSquare's innovation journey while empowering women across the technology sector. The Stevie® Awards are widely regarded as the world's premier business honors, celebrating the achievements of organizations and professionals worldwide. The Asia-Pacific Stevie® Awards are the only regional program that specifically recognizes innovation in the workplace across all 29 markets in the Asia-Pacific region. This year, more than 1,000 nominations were submitted. Amid strong competition, MSquare Technology and Wendy Chen stood out as a rare dual winner—recognized both as a company redefining semiconductor innovation and as a female leader driving transformation and inclusion in tech. Since its launch in 2021, MSquare Technology has rapidly emerged as a key innovator in IP and Chiplet solutions, delivering breakthroughs in Chiplet interconnectivity and high-performance computing. Its achievements are backed by 78 granted patents and multiple international certifications, including ISO9001 and ISO26262. Driven by a vision to build an open ecosystem for AI and Chiplet technology, the company has demonstrated strategic focus through robust R&D investments and partnerships with leading foundries. With a global presence and deep innovation capabilities, MSquare is well-positioned to lead the next phase of semiconductor development—aligning with the standards of corporate innovation recognized by the Stevie® Awards. Central to MSquare Technology's innovation journey is the leadership of its founder and CEO, Wendy Chen. With over two decades of semiconductor industry experience, Wendy has led pioneering advancements in Chiplet solution and high-speed interface IP, positioning MSquare as a leader in AI and data center applications. Furthermore, her commitment to inclusive leadership has inspired more women to pursue careers in tech. Wendy's ability to balance business expansion, sustained R&D investment, and people-centered leadership offers a compelling model for success in this traditionally male-dominated industry. Wendy Chen acknowledged the dual honors with gratitude, saying, "These awards are not just for myself or the company, they belong to the entire MSquare team. We will continue striving to drive breakthroughs in AI computing through innovative IP and Chiplet technology, and to foster an open, collaborative ecosystem for global technology progress." About MSquare Technology: MSquare Technology, incorporated in 2021, is a leading provider of integrated circuit IPs and Chiplets, dedicated to addressing the challenges of chip interconnectivity and vertical integration in the smart economy era. MSquare operates offices in Shanghai, Tokyo, Sydney, and San Jose, comprising a team of a few hundred employees, with 80% dedicated to research and development. MSquare strives to foster an open ecosystem service platform for AI and Chiplets, providing comprehensive support for innovation and development within the IC and Chiplet industry. About the Stevie® Awards: Stevie Awards are conferred in nine programs: the Stevie Awards for Women in Business, the Asia-Pacific Stevie Awards, the German Stevie Awards, the Middle East & North Africa Stevie Awards, The American Business Awards®, The International Business Awards®, the Stevie Awards for Great Employers, the Stevie Awards for Sales & Customer Service, and the Stevie Awards for Technology Excellence. Stevie Awards competitions receive more than 12,000 entries each year from organizations in more than 70 nations and territories. Honoring organizations of all types and sizes and the people behind them, the Stevies recognize outstanding performances in the workplace worldwide.
Times of Oman
24-03-2025
- Business
- Times of Oman
India's premium residential market soars with rising demand for luxury living spaces
New Delhi: India's premium residential landscape is witnessing significant growth, fueled by innovative designs and increasing demand for luxury living spaces in both urban centres and emerging metros. According to ANAROCK Research, luxury housing (units priced above Rs 1.5 crore) account for almost 17 per cent of all new residential launches in India as of 2024. Notably, tier-2 and tier-3 cities account for 12 per cent of these projects, signalling a shift in buyer preferences and market focus. Cities like Chandigarh, Ludhiana, Kochi, Indore, and Ahmedabad have emerged as strong players in the luxury real estate segment due to rapid urbanization and enhanced infrastructure. Affluent buyers in these developing cities are seeking residences that offer exclusivity and high-end amenities. This shift is also driven by rising disposable incomes and increased investments from NRIs. For instance, Punjab once primarily known for its manufacturing and trade, the city is now emerging as a hub for luxury residential enclaves, premium retail spaces, and world-class commercial developments. As demand for upscale living and modern infrastructure rises, leading developers are stepping up with innovative projects that cater to the evolving aspirations of residents and investors alike. These new developments like The Wilton and 'M Square' by Malhotra Realty are focusing on offering world-class amenities such as integrated five-star hospitality, high-end retail experiences, and lush green landscapes. The Wilton,' a 12-acre luxury development on Hambran Road, features 550 premium residences and a five-star Courtyard by Marriott hotel while 'M Square,' a 50,000 sq. ft. shopping hub on Gaushala Road, offers modern retail, dining, and entertainment experiences. According to Meenu Malhotra, founder and chairman of Malhotra Group PLC (UK), these projects are not merely about brick and mortar but aim to elevate the city's stature on the global stage with meticulously designed spaces redefining the city's landscape. With more developments planned, cities like Ludhiana are set to emerge as a leading premium real estate hotspot in North India.
