Latest news with #PatGelsinger
Forbes
5 days ago
- Business
- Forbes
Intel Foundry Direct Connect 2025 Expands Roadmap And Partnerships
Intel CEO Lip-Bu Tan delivers the opening remarks for Intel Foundry Direct Connect 2025. At Intel's annual Direct Connect conference, the company's CEO and foundry leadership team laid out the future of the company's foundry business. Intel Foundry Services is the chip manufacturing arm of Intel and has been one of the areas of the company that has needed a significant turnaround to enable Intel's future success. (Note that Intel is a client of my firm, Moor Insights & Strategy.) One of former CEO Pat Gelsinger's efforts was the delivery of four production nodes in five years, also known as 4N5Y. This was needed because Intel once had a foundry advantage over companies like TSMC, but eventually — through a series of mistakes, delays and lack of execution — it squandered that lead. Later this year, Intel will begin to deliver chips made on production node 18A to customers; volume shipments will begin early next year. Node 18A is the fifth node in five years, if you're counting by the timetable that Gelsinger set when he started the turnaround. Gelsinger left as CEO late last year; he was replaced by former board member Lip-Bu Tan earlier this year, and it seems so far that Tan will continue to execute on Gelsinger's overall strategy, but seemingly with even more focus — yet fewer employees. While Intel's headcount and layoff numbers under Tan are not official yet, there is an expectation that he will run the company with a leaner balance sheet and a smaller payroll. The other upside of Intel delivering 18A is that it will demonstrate Intel's competitiveness both on a product front with chips like the Panther Lake processor, but also on a foundry front in terms of how that product leverages the new node. While it remains unclear how much 18A capacity Intel has available to serve third-party customers, there are no illusions about Intel's need to win foundry customers to enable IFS to scale to a point of profitability. After all, chip fabs cost billions of dollars and depreciate extremely quickly, so the only good way to turn a profit is through high utilization and volume. While there is no doubt that Intel will fill a lot of the capacity making its own products, Intel alone will not be able to sustain IFS's ambitions of growth. Thanks to the Intel Vision event earlier this year, we already know that Intel has moved 18A into risk production, which means that the node is where Intel expects it to be, and that Intel has locked in the node for mass production. There will still be improvements made to 18A to make it fully mass-production ready and commercially available, but Intel's own timeframes for the node indicate it will be ready on schedule, with volume production early next year as mentioned above. This means that we should get some real idea of the state of 18A and Panther Lake around then. So, Intel Foundry's next biggest job at this point is to talk to customers and the industry about what happens beyond 18A. Naga Chandrasekaran, Intel Foundry CTO/COO, on stage with a 14A test wafer. Tan addressed this need at Direct Connect by continuing to talk about Intel's customer-centric approach and about listening to what customers want and need. This is also why Intel brought both Cadence and Synopsis onstage to talk about how they are working together to enable faster time-to-market with new silicon designs for Intel Foundry. Intel also brought out Amkor, QuickLogic, Siemens EDA and PDF Solutions to represent the ecosystem of partners enabling designs for Intel Foundry. Many of the partnerships included Intel's 18A and 18A-P processes, but also its packaging technologies like EMIB. Intel Foundry's updated roadmap Some of the partner conversations also included Intel's new 14A and 14A-E nodes. During Direct Connect, Intel Foundry's executive team announced a slew of details about the upcoming 14A, including the availability of its process design kit. Intel says that 14A will build on the learnings from 18A, including the second generation of its RibbonFET technology — a gate-all-around architecture that debuted in node 20A. Intel says that it expects 14A to deliver about 15% to 20% more performance per watt than 18A, and to enable a potential power savings of 25% to 35%. 14A will also feature the next generation of Intel's PowerVia backside power delivery with PowerDirect, which is a unique form of power delivery. Intel also announced that there would be a 14A-E node, which will be geared to producing more efficient chips than 14A that are optimized for mobile applications. It's the 14A-E node that I expect could lead a company like Apple or Qualcomm to adopt Intel Foundry — for extra capacity, but also potentially to stave off the never-ending TSMC price increases. In addition to the updates on 14A and 14A-E, the Direct Connect audience also heard about new versions of 18A — specifically 18A-P and 18A-PT, both of which both build on 18A but with added power scaling and, in the case of 18A-PT, more advanced packaging options such as 3-D stacking. 18A-PT is much further out on the roadmap, with Intel saying it won't be available until 2028. I believe that Intel 18A-P (scheduled for 2026) will be one of the first nodes that Intel Foundry will announce customers for, which would help to build confidence in Intel's roadmap. To get there, the company still needs to get 18A out the door at the end of this year and ramp that production early in 2026. I do think it was very telling when Intel said that 18A-P customers can easily port their 18A designs to the new node, which makes me think that the company has made adjustments in that direction based on customer feedback. Intel also said that it already has 18A-P running in the fabs, which makes me believe that Intel Foundry is already working on customer silicon. 18A-P is supposed to deliver an 8% performance-per-watt improvement over 18A with the same density. Intel also announced system integration that enables customers to mix 14A dies with 18A-PT using Foveros Direct 3D or EMIB. I believe that Intel Foundry is going to deliver on the 5N4Y promise that Pat Gelsinger made when he started the turnaround of Intel. While I don't believe that 18A will complete the company's turnaround, I do think it's an important inflection point for Intel to show the industry it is back to executing at a high level and doing it on schedule. Reliability is extremely important in the silicon industry, especially now that AI infrastructure is becoming critical for companies' long-range plans. It still remains unclear which customers will use which nodes from Intel, but I believe that we'll start to see early customers on 18A-P and potentially even more on 14A and 14A-E. Intel's Panther Lake and Nova Lake product lines will help Intel Product catch up with the rest of the industry and become more competitive. At this point, Tan's most important job is to continue to execute and deliver while also listening to customers' demands, within reason. He has an extremely difficult job, but I believe that he understands that the company was already on the right trajectory, and to take it away from that would be a fool's errand. Everyone knows that Intel Foundry's success will be dependent on Intel's ability to attract new customers and ensure that those customers can field competitive products. Intel Foundry will need to sign some of the biggest fabless chip companies in the world to achieve the scale that the company needs, but it also seems that Intel is positioning itself so it can be prepared to expand the capacity of its facilities if the demand warrants it. Bringing up new capacity is hard, but bringing up entirely new foundries and facilities would be even harder. Intel Foundry likely still has a few years of hard work until it can turn a profit for the company, but there are going to be many opportunities along the way to see that it is moving in the right direction. If Intel executes well, I don't think it will take more than a couple of years for us to see those signs.
Geek Wire
29-05-2025
- Business
- Geek Wire
Filing: PowerLattice Technologies, a secretive startup with connections to Intel, is raising cash
Former VMware CEO Pat Gelsinger speaks at VMworld 2018. (VMware Photo) A stealthy new company based in Southwest Washington called PowerLattice Technologies is raising cash, according to new SEC filings. The company filed two forms this week that show more than $22 million raised. PowerLattice is 'bringing paradigm shift in power delivery solutions for AI, datacenter and high performance compute processors,' according to its website. The startup lists its headquarters at a co-working space in Camas, Wash. We've reached out to the company for more details. Former Intel CEO Pat Gelsinger is listed a director on one of the filings. Gelsinger spent more than three decades at Intel, more recently as its CEO from 2021 to December 2024. He previously led VMWare as CEO for more than eight years. Steve Fu, a semiconductor industry vet and a partner at Silicon Valley VC firm Celesta, is also listed as a director. Celsta's founding partner Lip-Bu Tan is the current CEO at Intel. The executives listed on the filings are Peng Zou, Sujith Dermal, and Gang Gen. A search on LinkedIn for those names shows potential connections to NUVIA, a chip design startup acquired by Qualcomm in 2021. The Oregonian reported on the filings on Tuesday.
Entrepreneur
27-05-2025
- Business
- Entrepreneur
How Companies Can Develop Leaders Who Actually Deliver Results
An unprecedented wave of CEO departures in 2024 has highlighted a critical shift: Vision alone no longer suffices. Execution is now paramount. Opinions expressed by Entrepreneur contributors are their own. In 2024, U.S. companies witnessed an unprecedented wave of CEO departures, with 327 executives exiting by November — a level of turnover unseen since 2010. This wave of CEO departures reflects a bigger shift in corporate leadership, as boards and investors are no longer content with big ideas alone; they want leaders who can turn strategy into action. Consider Intel's former CEO, Pat Gelsinger. Despite ambitious plans to revitalize the company's chip manufacturing dominance, Gelsinger's strategies were deemed too costly and slow, leading to his resignation in late 2024. Such high-profile exits highlight a growing intolerance for leaders who cannot translate vision into tangible results. This trend signals a broader transformation in leadership expectations. The era of the untethered visionary is fading, replaced by a demand for CEOs who combine strategic foresight with operational excellence. Related: Are You A Visionary, an Executor or a Processor? Why Your Company Needs All 3 to Succeed. The execution imperative Historically, charismatic leaders who could articulate compelling visions were highly sought after. However, recent studies indicate a shift in the traits boards prioritize. According to research from the Harvard Law School Forum on Corporate Governance, there's an increased demand for CEOs with skills in operations and strategy, and a decreased emphasis on interpersonal or "soft" skills. Rapid technological change, global instability and evolving customer expectations have raised the bar for leaders, who need to steer the organization through complexity and deliver results. If you're serious about building a leadership bench that can execute under pressure, it's time to stop relying on outdated playbooks. Execution-first leadership doesn't happen by accident — it's the result of intentional development, smarter hiring and aligned incentives. Here's how to make it real inside your company. 1. Revamp leadership development programs In 2024, leadership development budgets took a significant hit, with average allocations dropping by 70% compared to the previous year. With leadership development budgets slashed, many companies have cut back — or cut out entirely — the programs that prepare mid-level managers for executive roles. As a result, more leaders are stepping into the C-suite without the cross-functional experience or strategic problem-solving skills they need to succeed. This gap shows up in the numbers. In a recent survey, 45% of managers said their companies aren't doing enough to develop future leaders. Additionally, only 8% of managers believe their leadership programs actually work. The message is clear: Organizations need to take a hard look at their leadership pipelines and start investing in them again. Companies can close this gap by creating development programs that give leaders real-world experience, from cross-functional rotations to mentorship with senior executives to high-stakes problem-solving assignments. When these initiatives are built into talent strategies, they help grow leaders who can think big and get things done. Related: Kevin O'Leary Says This Is the One Skill He Looks For in a Leader — But It's 'Almost Impossible to Find' 2. Implement effective succession planning Even though succession planning is critical, many organizations still aren't ready when leadership changes happen. Research from the Association for Talent Development (ATD) shows that just 35% of companies have a formal plan in place. Without one, companies often scramble to fill roles, turning to outside hires who might not fit the culture or long-term strategy. The costs of poor succession planning add up fast. Studies show that external CEO hires not only cost 15% more than internal promotions but are also 84% more likely to leave within three years — often because they're not the right fit. It's a clear reminder that ignoring internal talent development can hurt both the bottom line and leadership stability. The better approach is to focus on your existing bench. That means identifying high-potential employees early and giving them opportunities to stretch their skills, work across teams and learn from seasoned leaders. Companies that invest in their own people don't just save on recruiting costs — they keep their culture intact and avoid the disruption that comes with an outside hire who might not stick. 3. Broaden talent acquisition strategies More companies are looking outside their own industries when hiring executives — and for good reason. Leaders with experience in different sectors bring fresh ideas and new ways of thinking that can spark innovation and help businesses handle tough, unfamiliar challenges. A report by JRG Partners points out that bringing in leaders from other industries can give companies an edge. These executives tend to be adaptable, used to working across different markets and able to apply what they've learned in one sector to another. They also know how to get up to speed fast in unfamiliar territory. LinkedIn research shows that focusing on skills instead of traditional qualifications can completely change the way companies hire — and open the door to a much bigger talent pool. In fact, taking a skills-first approach can expand the number of potential candidates by nearly tenfold worldwide. Related: How to Develop the Best Leadership Mindset to Execute Your Strategy To make the most of this, companies can: Hire for skills, not just resumes: Focus on what candidates can do, not just where they've worked or what degrees they hold. Use AI and data smartly: Tap into tech tools that help spot transferable skills and uncover talent from outside the usual places. Build a more inclusive hiring culture: Stay open to people with nontraditional backgrounds and career paths — they often bring fresh ideas and perspectives. Companies that look beyond their own backyard find leaders who can roll with change and push the business forward. Leadership is changing. Companies that focus on execution, not just vision, will stay in the game. The ones that don't will fall behind.
Yahoo
23-05-2025
- Business
- Yahoo
Intel Could Sell Another Major Business in Turnaround Bid
Intel is reportedly looking to sell its network and edge businesses. This would continue a trend of exiting noncore businesses. While a spin-off or sale would be complicated, refocusing on PCs, servers, and manufacturing makes sense. 10 stocks we like better than Intel › For years, semiconductor giant Intel (NASDAQ: INTC) has been exiting lines of business that don't fit with its overall strategy. Under former CEO Pat Gelsinger, Intel sold off its NAND and SSD operations, wound down its Optane memory unit, spun off Mobileye via an initial public offering (IPO), exited the prebuilt server business, gave up on Bitcoin mining chips, and sold a minority stake in its IMS Nanofabrication business. New Intel CEO Lip-Bu Tan will likely continue this trend as he refocuses the company on what it does best: namely, PC central processing units (CPUs), data center CPUs, and manufacturing. Intel sold a majority stake in field programmable gate array (FPGA) specialist Altera in April, and the company is now reportedly eying its network and edge businesses. Reuters reported on Tuesday that Intel was considering selling off these businesses, which were formerly reported under the NEX segment but consolidated with other segments starting in the first quarter of this year. While divesting the former NEX segment could be trickier than some of Intel's other exits, it would free Intel from yet another distraction as it refocuses on its core businesses. The businesses that were once part of the NEX segment focus on solutions for telecommunications networks and edge computing applications. This includes radio access networks, which connect base stations to individual mobile devices, as well as products aimed at the retail, healthcare, manufacturing, energy, and transportation industries. The NEX segment generated $5.8 billion in revenue during 2024, along with an operating income of $931 million. That works out to roughly 12% of Intel's total products revenue and 7% of Intel's total products operating income. These businesses are meaningful revenue generators but don't contribute much to the bottom line relative to PC and data center CPUs. While Intel has major competitive advantages in the PC and data center CPU markets, that's not necessarily the case in markets served by its network and edge businesses. In PCs, Intel is part of a duopoly with AMD, and competition from Arm-based CPUs has started to ramp up only recently. In the data center, while custom Arm-based CPUs are becoming more common, Intel and the vast ecosystem around its chips still reign supreme. Although Intel leads the radio access network (RAN) market, the company is exposed to the ups and downs of telecom capital spending trends. Arm is making a push to create chips based on its intellectual property (IP) viable for RAN deployments, which raises the prospect of greater competition in the future. The company also competes with Broadcom in multiple areas. The NEX businesses share a lot of IP with Intel's PC and data center businesses. The company sells chips aimed at edge computing workloads under its Core Ultra brand with a mix of architectures, including Arrow Lake and Raptor Lake. Intel also offers Xeon 6 chips for RAN networks and other applications, which are variants of the company's server CPUs. Intel manufactures its Xeon 6 lineup using its Intel 3 manufacturing process and its Raptor Lake chips using its Intel 7 process, while it largely outsources Arrow Lake production to Taiwan Semiconductor Manufacturing. With the former NEX segment intertwined with the rest of Intel, a spin-off or sale would likely be complex and take quite a bit of time to sort out. However, as it stands today, the NEX businesses aren't getting the resources or attention they need to thrive. With Intel focused on PCs, servers, and manufacturing, the company isn't going to win in the network and edge markets if it's viewed as an afterthought. A deal for the NEX businesses could raise billions of dollars in cash for Intel, bolstering the balance sheet and freeing up resources to invest in the manufacturing business. Part of Tan's turnaround plan is to simplify operations and make Intel more efficient, so exiting the NEX businesses would certainly make sense. While there's no guarantee Intel will proceed with any plans to exit its network and edge businesses, a sale or spin-off would be a step in the right direction as the company reins in the sprawl that has contributed to its current predicament. Before you buy stock in Intel, consider this: The Motley Fool Stock Advisor analyst team just identified what they believe are the for investors to buy now… and Intel wasn't one of them. The 10 stocks that made the cut could produce monster returns in the coming years. Consider when Netflix made this list on December 17, 2004... if you invested $1,000 at the time of our recommendation, you'd have $642,582!* Or when Nvidia made this list on April 15, 2005... if you invested $1,000 at the time of our recommendation, you'd have $829,879!* Now, it's worth noting Stock Advisor's total average return is 975% — a market-crushing outperformance compared to 172% for the S&P 500. Don't miss out on the latest top 10 list, available when you join . See the 10 stocks » *Stock Advisor returns as of May 19, 2025 Timothy Green has positions in Intel. The Motley Fool has positions in and recommends Advanced Micro Devices, Bitcoin, Intel, and Taiwan Semiconductor Manufacturing. The Motley Fool recommends Mobileye Global and recommends the following options: short May 2025 $30 calls on Intel. The Motley Fool has a disclosure policy. Intel Could Sell Another Major Business in Turnaround Bid was originally published by The Motley Fool Error in retrieving data Sign in to access your portfolio Error in retrieving data Error in retrieving data Error in retrieving data Error in retrieving data
Yahoo
18-05-2025
- Business
- Yahoo
Intel's Lunar Lake intricacies revealed in new high-resolution die shots
When you buy through links on our articles, Future and its syndication partners may earn a commission. Lunar Lake unequivocally shook the market by blending an ultra-efficient design typically seen in Arm-based SoCs with the established foundation of x86. Fritzchens Fritz, a renowned hardware enthusiast known for capturing incredibly detailed and high-resolution die shots of CPUs, dissected a Lunar Lake sample, offering us a look at its internals and Intel's meticulous engineering. Developing Lunar Lake required Intel to walk a strategic tightrope between cost and a good product. The result is extremely similar to that of Arm-based alternatives from Qualcomm while efficiently trading blows with Apple Silicon. Innovation isn't free, however, as Lunar Lake-powered laptops still hover in the four-figure territory. Even ex-CEO Pat Gelsinger characterized Lunar Lake as "a one-off" design, which explains why Intel's leaked roadmaps do not mention a successor. Despite sharing the same core microarchitectures and process node as Arrow Lake, Intel took a completely different development approach with Lunar Lake. The TSMC N3B fabbed Compute Tile hosts four Lion Cove-based Performance (P) cores, sharing 12MB of L3 cache, with 2.5MB of private L2 cache per P-core. As opposed to Arrow Lake, the Skymont-based efficiency core cluster (E) doesn't share the same L3 cache pool, but sits on a "Low Power Island" with its own dedicated L2 cache (4MB). Next to E-cores is the NPU (Neural Processing Unit), which is believed to have six NCE (Neural Compute Engines) for almost 48 TOPS of AI performance. The Compute Tile is also home to a Battlemage-based integrated GPU with up to eight Xe2-LPG cores and the Media Engine. Intel has essentially packed all key processing elements on one chiplet, significantly reducing inter-die communication's latency and power consumption. Intel also includes an 8MB System-Level-Cache (SLC) cache next to the memory controller, similar to Arm SoCs, which is shared between CPU cores, the integrated GPU, the NPU, and Media Engines. To further tighten integration and reduce latency, the memory physical layer is located directly on top of the Compute Tile, just below the two on-package, soldered, and non-upgradeable LPDDR5x-8533 ICs (16GB or 32GB) that function as the SoC's main memory. Beneath the Compute Tile is the Platform Controller Tile based on TSMC's N6 process and a dummy tile for structural rigidity. The Platform Controller Tile can be considered the I/O Extender Tile with Arrow Lake, even though Intel internally referred to it as Lunar Lake's SoC Tile, based on leaks. This chiplet packs key HSIO and LSIO components, such as USB, Thunderbolt, and PCIe 4.0/5.0 interfaces, as well as Bluetooth and Wi-FI connectivity. All these chiplets are hosted atop a 22FFL-based active interposer, connected via Intel's Foveros 3D packaging technology. These are just the chip's overall specifications; the precise arrangement varies, as it's impossible to know how Intel has laid out all these components without help from an engineer. All annotations are guesses based on visual cues, and each analyst may offer different interpretations. Follow Tom's Hardware on Google News to get our up-to-date news, analysis, and reviews in your feeds. Make sure to click the Follow button.
