Latest news with #RenesasElectronicsCorporation
Business Wire
2 days ago
- Business
- Business Wire
Renesas Introduces 64-bit RZ/G3E MPU for High-Performance HMI Systems Requiring AI Acceleration and Edge Computing
TOKYO--(BUSINESS WIRE)--Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the launch of its new 64-bit RZ/G3E microprocessor (MPU), a general-purpose device optimized for high-performance Human Machine Interface (HMI) applications. Combining a quad-core Arm® Cortex®-A55 running at up to 1.8GHz with a Neural Processing Unit (NPU), the RZ/G3E brings high-performance edge computing with AI inference for faster, more efficient local processing. With Full HD graphics support and high-speed connectivity, the MPU targets HMI systems for industrial and consumer segments including factory equipment, medical monitors, retail terminals and building automation. 'The RZ/G3E builds on the proven performance of the RZ/G series with the addition of an NPU to support AI processing,' said Daryl Khoo, Vice President of Embedded Processing at Renesas. High-Performance Edge Computing and HMI Capabilities At the heart of the RZ/G3E is a quad-core Arm Cortex-A55, a Cortex-M33 core, and the Ethos™-U55 NPU for AI tasks. This architecture efficiently runs AI applications such as image classification, object recognition, voice recognition and anomaly detection while minimizing CPU load. Designed for HMI applications, it delivers smooth Full HD (1920x1080) video at 60fps on two independent displays, with output interfaces including LVDS (dual-link), MIPI-DSI, and parallel RGB. A MIPI-CSI camera interface is also available for video input and sensing applications. 'The RZ/G3E builds on the proven performance of the RZ/G series with the addition of an NPU to support AI processing,' said Daryl Khoo, Vice President of Embedded Processing at Renesas. 'By using the same Ethos-U55 NPU as our recently announced RA8P1 microcontroller, we're expanding our AI embedded processor portfolio and offering a scalable path forward for AI development. These advancements address the demands of next-generation HMI applications across vision, voice and real-time analytics with powerful AI capabilities.' The RZ/G3E is equipped with a range of high-speed communication interfaces essential for edge devices. These include PCI Express 3.0 (2 lanes) for up to 8Gbps, USB 3.2 Gen2 for fast 10Gbps data transfer, and dual-channel Gigabit Ethernet for seamless connectivity with cloud services, storage, and 5G modules. Low-Power Standby with Fast Linux Resume Starting with the third-generation RZ/G3S, the RZ/G series includes advanced power management features to significantly reduce standby power. The RZ/G3E maintains sub-CPU operation and peripheral functions while achieving low power consumption around 50mW and around 1mW in deep standby mode. It supports DDR self-refresh mode to retain memory data, enabling quick wake-up from deep standby for running Linux applications. Comprehensive Linux Software Support Renesas continues to offer the Verified Linux Package (VLP) based on the reliable Civil Infrastructure Platform, with over 10 years of maintenance support. For users requiring the latest versions, Renesas provides Linux BSP Plus, including support for the latest LTS Linux kernel and Yocto. Ubuntu by Canonical and Debian open-source OS are also available for server or desktop Linux environments. Key Features of RZ/G3E CPU: Quad-core Cortex-A55 (up to 1.8GHz), Cortex-M33 NPU: Ethos-U55 (512 GOPS) HMI: Dual Full HD output, MIPI-DSI / Dual-link LVDS / Parallel RGB, 3D graphics, H.264/H.265 codec Memory Interface: 32-bit LPDDR4/LPDDR4X with ECC Connectivity for 5G Communication: PCIe 3.0 (2 lanes), USB 3.2 Gen2, USB 2.0 x2, Gigabit Ethernet x2, CAN-FD Operating Temperature: -40°C to 125°C Package Options: 15mm square 529-pin FCBGA, 21mm square 625-pin FCBGA Product Longevity: 15-year supply under Product Longevity Program (PLP) System-on-Module Solutions from Renesas and Ecosystem Partners Renesas has also introduced system-on-module (SoM) solutions featuring the RZ/G3E. A broad range of SoM solutions will be available from Renesas' ecosystem partners such as a SMARC module from Tria, an OSM (Size-M) from ARIES Embedded, and an OSM (Size-L) from MXT. Winning Combinations Renesas combined the RZ/G3E with other compatible devices to develop Full HD Dual-Display HMI Platform and Digital Otoscope solutions. These Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly. They can be found at Availability The RZ/G3E is available today, along with the Evaluation Board Kit. The kit includes a SMARC v2.1.1 module board and a carrier board. More information about Renesas RZ/G3E is available at: About Renesas Electronics Corporation Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live. Learn more at Follow us on LinkedIn, Facebook, X, YouTube, and Instagram. (Remarks) All names of products or services mentioned in this press release are trademarks or registered trademarks of their respective owners.
Yahoo
7 days ago
- Business
- Yahoo
Renesas Announces Consolidated Forecasts
TOKYO, July 25, 2025--(BUSINESS WIRE)--Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced the consolidated financial forecasts for the nine months ending September 30, 2025. Renesas Electronics Group ("the Group") reports its consolidated forecasts on a quarterly basis as a range because of the difficulty of forecasting full-year results with high accuracy due to the short-term volatility of the semiconductor market. Additionally, in order to provide useful information to better understand the Group's constant business results, figures such as revenue, gross margin, and operating margin are presented in the non-GAAP format, which excludes or adjusts the non-recurring items related to acquisitions and other adjustments, including non-recurring expenses or income from the financial figures (GAAP, IFRS basis) following a certain set of rules. The gross margin and operating margin forecasts are given assuming the midpoint in the revenue forecast. Consolidated forecasts for the nine months ending September 30, 2025(January 1, 2025 to September 30, 2025) In millions of yen Non-GAAPRevenue Non-GAAP Gross Margin Non-GAAP Operating Margin Previous forecasts --- --- --- Forecasts as ofJuly 25, 2025 955,914to 970,914 56.7% 27.5% Increase (decrease) --- --- --- Percentage change --- --- --- Reference: Corresponding period of the previous year (January 1, 2024 to September 30, 2024) 1,055,879 56.4% 30.5% Note: Non-GAAP figures are calculated by removing or adjusting non-recurring items and other adjustments from GAAP (IFRS basis) figures following a certain set of rules. The Group believes non-GAAP measures provide useful information in understanding and evaluating the Group's constant business results, and, therefore, forecasts are provided on a non-GAAP basis. This adjustment and exclusion include the amortization of intangible assets recognized from acquisitions, other PPA (purchase price allocation) adjustments and stock-based compensation, as well as other non-recurring expenses and income the Group believes to be applicable. The consolidated forecasts for the nine months ending September 30, 2025, are calculated by combining the forecasts for the three months ending September 30, 2025, with the financial results of the six months ended June 30, 2025. The consolidated forecasts for the nine months ending September 30, 2025, are calculated at the rate of 148 yen per USD and 164 yen per Euro. Refer to Renesas' earnings report "Renesas Reports Financial Results for the Second Quarter Ended June 30, 2025", issued on July 25, 2025, for more details. The statements with respect to the financial outlook of the Group are forward-looking statements involving risks and uncertainties. The Group cautions that actual results may vary materially from such forward-looking statements due to several important factors listed in the "Forward-Looking Statements" below. About Renesas Electronics Corporation Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live. Learn more at Follow us on LinkedIn, Facebook, Twitter, YouTube, and Instagram. (FORWARD-LOOKING STATEMENTS) The statements in this press release with respect to the plans, strategies and financial outlook of Renesas and its consolidated subsidiaries (collectively "we") are forward-looking statements involving risks and uncertainties. Such forward-looking statements do not represent any guarantee by management of future performance. In many cases, but not all, we use such words as "aim," "anticipate," "believe," "continue," "endeavor," "estimate," "expect," "initiative," "intend," "may," "plan," "potential," "probability," "project," "risk," "seek," "should," "strive," "target," "will" and similar expressions to identify forward-looking statements. You can also identify forward-looking statements by discussions of strategy, plans or intentions. These statements discuss future expectations, identify strategies, contain projections of our results of operations or financial condition, or state other forward-looking information based on our current expectations, assumptions, estimates and projections about our business and industry, our future business strategies and the environment in which we will operate in the future. Known and unknown risks, uncertainties and other factors could cause our actual results, performance or achievements to differ materially from those contained or implied in any forward-looking statement, including, but not limited to, general economic conditions in our markets, which are primarily Japan, North America, Asia, and Europe; demand for, and competitive pricing pressure on, products and services in the marketplace; ability to continue to win acceptance of products and services in these highly competitive markets; and fluctuations in currency exchange rates, particularly between the yen and the U.S. dollar. Among other factors, downturn of the world economy; deteriorating financial conditions in world markets, or deterioration in domestic and overseas stock markets, may cause actual results to differ from the projected results forecast. This press release is based on the economic, regulatory, market and other conditions as in effect on the date hereof. It should be understood that subsequent developments may affect the information contained in this presentation, which neither we nor our advisors or representatives are under an obligation to update, revise or affirm. View source version on Contacts Media Contact:Corporate Communications Office+81 3-6773-3001pr@ Investor Relations Contact: Investor Relations+81 3-6773-3002ir@
Business Wire
7 days ago
- Business
- Business Wire
Renesas Reports Financial Results for the Second Quarter Ended June 30, 2025
TOKYO--(BUSINESS WIRE)--Renesas Electronics Corporation (TSE:6723) today announced consolidated financial results in accordance with IFRS for the three and six months ended June 30, 2025. Summary of Consolidated Financial Results (Note 1) Summary of Consolidated Financial Results (Non-GAAP basis) (Note 2) Three months ended June 30, 2025 Six months ended June 30, 2025 Billion yen % of Revenue Billion yen % of Revenue Revenue 324.6 100.0 633.4 100.0 Gross profit 184.4 56.8 359.6 56.8 Operating profit 91.9 28.3 175.7 27.7 Profit attributable to owners of parent 77.8 24.0 151.1 23.9 EBITDA (Note 3) 110.2 33.9 213.7 33.7 Expand Summary of Consolidated Financial Results (IFRS basis) Reconciliation of Non-GAAP gross profit to IFRS gross profit and Non-GAAP operating profit to IFRS operating profit (Billion yen) (Note) 1. All figures are rounded to the nearest 100 million yen. 2. Non-GAAP figures are calculated by removing or adjusting non-recurring items and other adjustments from GAAP (IFRS) figures following a certain set of rules. The Group believes non-GAAP measures provide useful information in understanding and evaluating the Group's constant business results. 3. Operating profit + Depreciation and amortization. 4. Non-recurring revenue that the Group has determined should be excluded 5. 'Other reconciliation items in non-recurring expenses and adjustments' includes the non-recurring items related to acquisitions and other adjustments as well as non-recurring profits or losses the Group believes to be applicable. Expand Consolidated Financial Results for the Second Quarter Ended June 30, 2025 English translation from the original Japanese-language document July 25, 2025 (Amounts are rounded to the nearest million yen) 1. Consolidated financial results for the six months ended June 30, 2025 1.1 Consolidated financial results (% of change from corresponding period of the previous year) Revenue Operating profit Profit before tax Profit Profit attributable to owners of parent Total comprehensive income Million yen % Million yen % Million yen % Million yen % Million yen % Million yen % Six months ended June 30, 2025 634,311 (10.7) 61,301 (58.4) (169,288) － (175,321) － (175,342) － (475,677) － Six months ended June 30, 2024 710,597 (2.4) 147,508 － 165,985 － 139,743 － 139,587 － 496,716 － Expand Basic earnings per share Diluted earnings per share Yen Yen Six months ended June 30, 2025 (97.34) (97.34) Six months ended June 30, 2024 78.25 77.20 Expand (Note) 1. The Group finalized the provisional accounting treatment for the business combination at the end of December 31, 2024, and each figure for the six months ended June 30, 2024 reflects the details of the finalization of the provisional accounting treatment. 2. Diluted earnings per share is the same as basic earnings per share as there were no dilutive potential common shares outstanding for the six months ended June 30, 2025. Expand 1.2 Consolidated financial position Total assets Total equity Equity attributable to owners Ratio of equity attributable to owners Million yen Million yen Million yen % June 30, 2025 3,872,164 2,036,305 2,031,527 52.5 December 31, 2024 4,490,436 2,542,298 2,537,382 56.5 Expand 2. Cash dividends Cash dividends per share At the end of first quarter At the end of second quarter At the end of third quarter At the end of year Total Yen Yen Yen Yen Yen Year ended December 31, 2024 0.00 0.00 0.00 28.00 28.00 Year ending December 31, 2025 0.00 0.00 Year ending December 31, 2025 (forecast) --- --- --- Expand (Note) Change in forecast of cash dividends since the most recently announced forecast: No Expand 3. Forecast of consolidated results for the nine months ending September 30, 2025 (% of change from corresponding period of the previous year) (Note) 1. The Group reports its consolidated forecast on a quarterly basis (cumulative quarters) as substitute for a yearly forecast in a range format. The non-GAAP gross margin and the non-GAAP operating margin forecasts are provided assuming the midpoint in the non-GAAP revenue forecast. 2. Non-GAAP figures are calculated by removing or adjusting non-recurring items and other adjustments from GAAP (IFRS) figures following a certain set of rules. The Group believes non-GAAP measures provide useful information in understanding and evaluating the Group's constant business results, and therefore forecasts are provided on a non-GAAP basis. Expand 4. Others 4.1 Changes in significant subsidiaries for the six months ended June 30, 2025: No 4.2 Changes in Accounting Policies, Changes in Accounting Estimates and Corrections of Prior Period Errors 1. Changes in accounting policies with revision of accounting standard: No 2. Changes in accounting policies except for 4.2.1: No 3. Changes in accounting estimates: Yes (Note) For details, please refer to P.12 '(Changes in Accounting Estimates)' in the 'Condensed Interim Consolidated Financial Statements, (5) Notes to Condensed Interim Consolidated Financial Statements.' 4.3 Number of shares issued and outstanding (common stock) 1. Number of shares issued and outstanding (including treasury stock) As of June 30, 2025: 1,870,614,885 shares As of December 31, 2024: 1,870,614,885 shares 2. Number of treasury stock As of June 30, 2025: 61,430,002 shares As of December 31, 2024: 75,848,895 shares 3. Average number of shares issued and outstanding Six months ended June 30, 2025: 1,801,305,034 shares Six months ended June 30, 2024: 1,783,808,662 shares (Note) Information regarding the implementation of audit procedures: These financial results are not subject to interim review procedures by the independent auditor. Expand Cautionary Statement The Group will hold an earnings conference for institutional investors and analysts on July 25, 2025. The Group plans to post the materials which are provided at the meeting, on the Group's website on that day. The statements with respect to the financial outlook of Renesas Electronics Corporation (hereinafter 'the Company') and its consolidated subsidiaries (hereinafter 'the Group') are forward-looking statements involving risks and uncertainties. We caution you in advance that actual results may differ materially from such forward-looking statements due to changes in several important factors. Expand About Renesas Electronics Corporation Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live. Learn more at Follow us on LinkedIn, Facebook, Twitter, YouTube, and Instagram. The statements in this press release with respect to the plans, strategies and financial outlook of Renesas and its consolidated subsidiaries (collectively 'we') are forward-looking statements involving risks and uncertainties. Such forward-looking statements do not represent any guarantee by management of future performance. In many cases, but not all, we use such words as 'aim,' 'anticipate,' 'believe,' 'continue,' 'endeavor,' 'estimate,' 'expect,' 'initiative,' 'intend,' 'may,' 'plan,' 'potential,' 'probability,' 'project,' 'risk,' 'seek,' 'should,' 'strive,' 'target,' 'will' and similar expressions to identify forward-looking statements. You can also identify forward-looking statements by discussions of strategy, plans or intentions. These statements discuss future expectations, identify strategies, contain projections of our results of operations or financial condition, or state other forward-looking information based on our current expectations, assumptions, estimates and projections about our business and industry, our future business strategies and the environment in which we will operate in the future. Known and unknown risks, uncertainties and other factors could cause our actual results, performance or achievements to differ materially from those contained or implied in any forward-looking statement, including, but not limited to, general economic conditions in our markets, which are primarily Japan, North America, Asia, and Europe; demand for, and competitive pricing pressure on, products and services in the marketplace; ability to continue to win acceptance of products and services in these highly competitive markets; and fluctuations in currency exchange rates, particularly between the yen and the U.S. dollar. Among other factors, downturn of the world economy; deteriorating financial conditions in world markets, or deterioration in domestic and overseas stock markets, may cause actual results to differ from the projected results forecast. This press release is based on the economic, regulatory, market and other conditions as in effect on the date hereof. It should be understood that subsequent developments may affect the information contained in this presentation, which neither we nor our advisors or representatives are under an obligation to update, revise or affirm.
Business Wire
7 days ago
- Business
- Business Wire
Renesas Announces Loss Resulting from Signing Restructuring Support Agreement with Wolfspeed
TOKYO--(BUSINESS WIRE)--Renesas Electronics Corporation (TSE: 6723, "Renesas"), a premier supplier of advanced semiconductor solutions, today announced the finalized amount of the loss, previously disclosed as an estimate in the announcement titled ' Renesas Announces Expected Loss Resulting from Signing Restructuring Support Agreement with Wolfspeed ' on June 23, 2025. 1. Recording of Loss Renesas previously announced that there was a possibility of recording a loss of approximately 250 billion yen (converted at an average exchange rate of 150 yen to the dollar during the period) on the deposited receivables related to a deposit provided to Wolfspeed, Inc. (NYSE: WOLF, 'Wolfspeed') in its consolidated financial statements for the six months ended June 30, 2025. Following a thorough review based on the restructuring plan that Wolfspeed filed with the U.S. court under Chapter 11 of the U.S. Bankruptcy Code and other related matters, Renesas recorded a loss of 235 billion yen in the consolidated financial results for the six months ended June 30, 2025. 2. Future Outlook The loss mentioned above has been reflected in the " Renesas Reports Financial Results for the Second Quarter Ended June 30, 2025" announced on July 25, 2025. About Renesas Electronics Corporation Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live. Learn more at Follow us on LinkedIn, Facebook, Twitter, YouTube, and Instagram.
Yahoo
01-07-2025
- Business
- Yahoo
Renesas Sets New MCU Performance Bar with 1-GHz RA8P1 Devices with AI Acceleration
Single- and Dual-Core MCUs Combine Arm Cortex-M85 and M33 Cores with Arm Ethos-U55 NPU to Deliver Superior AI Performance up to 256 GOPs Unprecedented 7300+ CoreMarks1 with Dual Arm CPU cores TSMC 22ULL Process Delivers High Performance and Low Power Consumption Embedded MRAM with Faster Write Speeds and Higher Endurance and Retention Dedicated Peripherals Optimized for Vision and Voice AI plus Real-Time Analytics New AI Software Framework Eases Development and Enables Easy Migration with MPUs Leading-Edge Security Features Ensure Data Privacy TOKYO, July 01, 2025--(BUSINESS WIRE)--Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the RA8P1 microcontroller (MCU) Group targeted at Artificial Intelligence (AI) and Machine Learning (ML) applications, as well as real-time analytics. The new MCUs establish a new performance level for MCUs by combining 1GHz Arm® Cortex®-M85 and 250MHz Cortex-M33 CPU cores with the Arm Ethos™-U55 Neural Processing Unit (NPU). This combination delivers the highest CPU performance of over 7300 CoreMarks and AI performance of 256 GOPS at 500 MHz. Designed for Edge/Endpoint AI The RA8P1 is optimized for edge and endpoint AI applications, using the Ethos-U55 NPU to offload the CPU for compute intensive operations in Convolutional and Recurrent Neural Networks (CNNs and RNNs) to deliver up to 256 MACs per cycle that yield 256 GOPS performance at 500 MHz. The new NPU supports most commonly used networks, including DS-CNN, ResNet, Mobilenet TinyYolo and more. Depending on the neural network used, the Ethos-U55 provides up to 35x more inferences per second than the Cortex-M85 processor on its own. Advanced Technology The RA8P1 MCUs are manufactured on the 22ULL (22nm ultra-low leakage) process from TSMC, enabling ultra-high performance with very low power consumption. This process also enables the use of embedded Magnetoresistive RAM (MRAM) in the new MCUs. MRAM offers faster write speeds along with higher endurance and retention compared with Flash. "There is explosive growth in demand for high-performance edge AIoT applications. We are thrilled to introduce what we believe are the best MCUs to address this trend," said Daryl Khoo, Vice President of Embedded Processing Marketing Division at Renesas. "The RA8P1 devices showcase our technology and market expertise and highlight the strong partnerships we have built across the industry. Customers are eager to employ these new MCUs in multiple AI applications." "The pace of innovation in the age of AI is faster than ever, and new edge use cases demand ever-improving performance and machine learning on-device," said Paul Williamson, senior vice president and general manager, IoT Line of Business at Arm. "By building on the advanced AI capabilities of the Arm compute platform, Renesas' RA8P1 MCUs meet the demands of next generation voice and vision applications, helping to scale intelligent, context-aware AI experiences." "It is gratifying to see Renesas harness the performance and reliability of TSMC 22ULL embedded MRAM technology to deliver outstanding results for its RA8P1 devices," said Chien-Hsin Lee, Senior Director of Specialty Technology Business Development at TSMC. "As TSMC continues to advance our embedded non-volatile memory (eNVM) technologies, we look forward to strengthening our long-standing collaboration with Renesas to drive innovation in future groundbreaking devices." Robust, Optimized Peripheral Set for AI Renesas has integrated dedicated peripherals, ample memory and advanced security to address Voice and Vision AI and Real-time Analytics applications. For vision AI, a 16-bit camera interface (CEU) is included that supports sensors up to 5 megapixels, enabling camera and demanding Vision AI applications. A separate MIPI CSI-2 interface offers a low pin-count interface with two lanes, each up to 720Mbps. In addition, multiple audio interfaces including I2S and PDM support microphone inputs for voice AI applications. The RA8P1 offers both on-chip and external memory options for efficient, low latency neural network processing. The MCU includes 2MB SRAM for storing intermediate activations or graphics framebuffers. 1MB of on-chip MRAM is also available for application code and storage of model weights or graphics assets. High-speed external memory interfaces are available for larger models. SIP options with 4 or 8 MB of external flash in a single package are also available for more demanding AI applications. New RUHMI Framework Along with the RA8P1 MCUs, Renesas has introduced RUHMI (Renesas Unified Heterogenous Model Integration), a comprehensive framework for MCUs and MPUs. RUHMI offers efficient AI deployment of the latest neural network models in a framework agnostic manner. It enables model optimization, quantization, graph compilation and conversion, and generates efficient source code. RUHMI provides native support for machine-learning AI frameworks such as TensorFlow Lite, Pytorch & ONNX. It also provides the necessary tools, APIs, code-generator, and runtime needed to deploy a pre-trained neural network, including ready-to-use application examples and models optimized for RA8P1. RUHMI is integrated with Renesas's own e2 Studio IDE to allow seamless AI development. This integration will facilitate a common development platform for MCUs and MPUs. Advanced Security Features The RA8P1 MCUs provide leading-edge security for critical applications. The new Renesas Security IP (RSIP-E50D) includes numerous cryptographic accelerators, including CHACHA20, Ed25519, NIST ECC curves up to 521 bits, enhanced RSA up to 4K, SHA2 and SHA3. In concert with Arm TrustZone®, this provides a comprehensive and fully integrated secure element-like functionality. The new MCUs also provides strong hardware Root-of-Trust and Secure Boot with First Stage Bootloader (FSBL) in immutable storage. XSPI interfaces with decryption-on-the-fly (DOTF) allow encrypted code images to be stored in external flash and decrypted on the fly as it is securely transferred to the MCU for execution. Ready to Use Solutions Renesas provides a wide range of easy-to-use tools and solutions for the RA8P1 MCUs, including the Flexible Software Package (FSP), evaluation kits and development tools. FreeRTOS and Azure RTOS are supported, as is Zephyr. Several Renesas software example projects and application notes are available to enable faster time to market. In addition, numerous partner solutions are available to support development with the RA8P1 MCUs, including a driver monitoring solution from and a traffic/pedestrian monitoring solution from Irida Labs. Other solutions can be found at the Renesas RA Partner Ecosystem Solutions Page. Key Features of the RA8P1 MCUs Processors: 1GHz Arm Cortex-M85, 500MHz Ethos-U55, 250 MHz Arm Cortex-M33 (Optional) Memory: 1MB/512KB On-chip MRAM, 4MB/8MB External Flash SIP Options, 2MB SRAM fully ECC protected, 32KB I/D caches per core Graphics Peripherals: Graphics LCD controller supporting resolutions up to WXGA (1280x800), parallel RGB and MIPI-DSI display interfaces, powerful 2D Drawing engine, parallel 16bit CEU and MIPI CSI-2 camera interfaces, 32bit external memory bus (SDRAM and CSC) interface Other Peripherals: Gigabit Ethernet and TSN Switch, XSPI (Octal SPI) with XIP and DOTF, SPI, I2C/I3C, SDHI, USBFS/HS, CAN-FD, PDM and SSI audio interfaces, 16bit ADC with S/H circuits, DAC, comparators, temperature sensor, timers Security: Advanced RSIP-E50D cryptographic engine, TrustZone, Immutable storage, secure boot, tamper resistance, DPA/SPA attack protection, secure debug, secure factory programming, Device Lifecycle management Packages: 224BGA, 289BGA Winning Combinations Renesas has combined the new RA8P1 MCUs with numerous compatible devices from its portfolio to offer a wide array of Winning Combinations, including Video Conferencing Camera with AI Capabilities, AI Drawing Robot Arm and AI-Enabled Surveillance Camera. These designs are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly. They can be found at Availability The RA8P1 MCUs are available now. Renesas is also shipping an RA8P1 Evaluation Kit. More information is available at Samples and kits can be ordered either on the Renesas website or through distributors. Renesas MCU Leadership A world leader in MCUs, Renesas ships more than 3.5 billion units per year, with approximately 50% of shipments serving the automotive industry, and the remainder supporting industrial and Internet of Things applications as well as data center and communications infrastructure. Renesas has the broadest portfolio of 8-, 16- and 32-bit devices, delivering unmatched quality and efficiency with exceptional performance. As a trusted supplier, Renesas has decades of experience designing smart, secure MCUs, backed by a dual-source production model, the industry's most advanced MCU process technology and a vast network of more than 250 ecosystem partners. For more information about Renesas MCUs, visit About Renesas Electronics Corporation Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live. Learn more at Follow us on LinkedIn, Facebook, X, YouTube and Instagram. (Remarks). All names of products or services mentioned in this press release are trademarks or registered trademarks of their respective owners. ___________________________ 1 EEMBC's CoreMark® benchmark measures performance of MCUs and CPUs used in embedded systems. View source version on Contacts Media Contacts: Americas Don ParkmanRenesas Electronics Corporation+
