Latest news with #RenesasElectronicsCorporation
Business Wire
a day ago
- Business
- Business Wire
Renesas Announces Executive Leadership Team Appointment
TOKYO--(BUSINESS WIRE)--Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the appointment of Zaher Baidas as Senior Vice President and General Manager of Power, effective July 1, 2025. Zaher will be responsible for overseeing the company's power management and discrete product portfolios and for driving the execution of Renesas' global power strategy. Zaher, currently Vice President of the Timing Division within the Analog & Connectivity product group, joined Renesas in 2019 through the acquisition of Integrated Device Technology, Inc. He brings a strong engineering background and a proven track record of driving innovative solutions. His global mindset and business acumen will be instrumental in accelerating transformation and enhancing Renesas' power business performance on a global scale. Zaher will join Renesas' leadership team and will report directly to CEO Hidetoshi Shibata. Zaher succeeds Chris Allexandre, who will leave Renesas on June 30, 2025. Chris had led and transformed the Power business since assuming the role, aligning it closely with the company's strategic priorities and significantly improving operational performance. Prior to this role, he served as Chief Sales & Marketing Officer, where his leadership accelerated the company's shift toward high-growth segments, restructured the go-to-market strategy, and strengthened the foundation for solutions-led growth. Renesas extends its sincere appreciation to Chris for more than six years of outstanding and dedicated service during a period of transformation, helping position the company for long-term success. About Renesas Electronics Corporation Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live. Learn more at Follow us on LinkedIn, Facebook, X, YouTube and Instagram.
Time of India
14-05-2025
- Automotive
- Time of India
Renesas to design India's first 3nm chips; opens new R&D centres in Noida and Bengaluru
Renesas Electronics Corporation announced that it will design 3-nanometer chips—an industry-first for the company—at its newly inaugurated Renesas Design Centre in Noida. "We are proud to announce that, for the first time, 3-nanometer chips—an industry first—will be designed right here at the new Renesas Design Centre in Noida," said Malini Narayanamoorthi , India Country Manager, Renesas Electronics Corporation. She added that the development marks a major milestone in Renesas' strategy to build for the world from India. The announcement was made during the inauguration of Renesas' new R&D facilities in Noida and Bengaluru, aimed at strengthening its India operations and supporting the country's ambitions in semiconductor innovation. The Japan-based chipmaker also signed two MoUs with the Centre for Development of Advanced Computing (C-DAC) under the Ministry of Electronics and Information Technology's Chips to Startup (C2S) programme to help academic institutions and startups accelerate chip design and embedded systems development. Speaking at the Noida event, Ashwini Vaishnaw , Union Minister for Railways, I&B, and Electronics and IT, called the collaboration 'a crucial step' toward realising India's goal of becoming a semiconductor powerhouse. Expansion into advanced design and talent building Renesas will provide PCB design tools and development kits—including access to Altium Designer and the Altium 365 cloud platform—to over 250 academic institutions and 15 early-stage startups selected under the C2S programme. This will facilitate experiential learning and fast-track product innovation among students and entrepreneurs. Malini highlighted that the company's growing India presence is not just about capacity, but capability. 'We've always been strong in system and product design. India offers a unique opportunity to push the boundaries of innovation—from embedded software to advanced silicon design,' she told ETAuto. The newly opened Bengaluru facility has become Renesas' largest site in India with over 500 employees, including R&D engineers, embedded software teams, and professionals from its acquired firms Altium and Part Analytics. The centre will be pivotal in Renesas' global product development strategy. The Noida office, meanwhile, will serve as a design and customer engagement hub, particularly focused on automotive, AI, and high-performance computing applications. The centre will play a central role in the development of Renesas' flagship R-Car SoC platform for the automotive sector. India-Japan Collaboration Renesas CEO Hidetoshi Shibata , who joined the event virtually, described India as a 'strategic cornerstone' in the company's roadmap. 'From ideation to lifecycle management, we aim to build a full-stack semiconductor ecosystem in India. This is not just expansion—it's long-term collaboration,' he said. The company plans to scale its India workforce to 1,000 employees by the end of 2025, with operations across Noida, Bengaluru, Hyderabad, and Pune. In addition to the design centres, Renesas is engaged in an OSAT joint venture with CG Power and Stars Microelectronics in Gujarat and continues its academic partnerships, including coursework programs at IIT Hyderabad. Shibata emphasised the need to empower local innovation ecosystems, adding, 'By enabling startups and students with the tools they need, we're helping catalyze India's next generation of semiconductor leaders.'
Business Wire
24-04-2025
- Business
- Business Wire
Renesas Reports Financial Results for the First Quarter Ended March 31, 2025
TOKYO--(BUSINESS WIRE)--Renesas Electronics Corporation (TSE:6723) today announced consolidated financial results in accordance with IFRS for the three months ended March 31, 2025. Summary of Consolidated Financial Results (Note 1) Summary of Consolidated Financial Results (Non-GAAP basis) (Note 2) Three months ended March 31, 2025 Billion yen % of revenue Revenue 308.8 100.0 Gross profit 175.2 56.7 Operating profit 83.8 27.1 Profit attributable to owners of parent 73.3 23.7 EBITDA (Note 3) 103.5 33.5 Expand Summary of Consolidated Financial Results (IFRS basis) Three months ended March 31, 2025 Billion yen % of revenue Revenue 308.8 100.0 Gross profit 172.9 56.0 Operating profit 21.5 7.0 Profit attributable to owners of parent 26.0 8.4 EBITDA (Note 3) 75.8 24.5 Expand Reconciliation of Non-GAAP gross profit to IFRS gross profit and Non-GAAP operating profit to IFRS operating profit (Billion yen) Note 1: All figures are rounded to the nearest 100 million yen. Note 2: Non-GAAP figures are calculated by removing or adjusting non-recurring items and other adjustments from GAAP (IFRS) figures following a certain set of rules. The Group believes Non-GAAP measures provide useful information in understanding and evaluating the Group's constant business results. Note 3: Operating profit + Depreciation and amortization. Note 4: 'Other reconciliation items in non-recurring expenses and adjustments' includes the non-recurring items related to acquisitions and other adjustments as well as non-recurring profits or losses the Group believes to be applicable. Expand RENESAS ELECTRONICS CORPORATION Consolidated Financial Results for the First Quarter Ended March 31, 2025 English translation from the original Japanese-language document April 24, 2025 (Amounts are rounded to the nearest million yen) 1. Consolidated financial results for the three months ended March 31, 2025 1.1 Consolidated financial results (% of change from corresponding period of the previous year) Basic earnings per share Diluted earnings per share Yen Yen Three months ended March 31, 2025 14.48 14.30 Three months ended March 31, 2024 44.90 44.28 Expand 1.2 Consolidated financial position Total assets Total equity Equity attributable to owners Ratio of equity attributable to owners Million yen Million yen Million yen % March 31, 2025 4,195,513 2,322,303 2,317,559 55.2 December 31, 2024 4,490,436 2,542,298 2,537,382 56.5 Expand 2. Cash dividends Cash dividends per share At the end of first quarter At the end of second quarter At the end of third quarter At the end of year Total Yen Yen Yen Yen Yen Year ended December 31, 2024 0.00 0.00 0.00 28.00 28.00 Year ending December 31, 2025 0.00 Year ending December 31, 2025 (forecast) ― ― ― ― Expand 3. Forecast of consolidated results for the six months ending June 30, 2025 (% of change from the previous year) Note 1: The Group reports its consolidated forecast in a range format. The Non-GAAP gross margin and the Non-GAAP operating margin forecasts are provided assuming the midpoint in the non-GAAP revenue forecast. Note 2: Non-GAAP figures are calculated by removing or adjusting non-recurring items and other adjustments from GAAP (IFRS) figures following a certain set of rules. The Group believes Non-GAAP measures provide useful information in understanding and evaluating the Group's constant business results, and therefore forecasts are provided on a Non-GAAP basis. Expand 4. Others 4.1 Changes in significant subsidiaries for the three months ended March 31, 2025: No 4.2 Changes in Accounting Policies, Changes in Accounting Estimates and Corrections of Prior Period Errors 1. Changes in accounting policies with revision of accounting standard: No 2. Changes in accounting policies except for 4.2.1: No 3. Changes in accounting estimates: Yes (Note) For details, please refer to P.13 '(Changes in Accounting Estimates)' in the '2. Condensed Consolidated Financial Statements, 2.5 Notes to Condensed Consolidated Financial Statements.' 4.3 Number of shares issued and outstanding (common stock) 1. Number of shares issued and outstanding (including treasury stock) As of March 31, 2025: 1,870,614,885 shares As of December 31, 2024: 1,870,614,885 shares 2. Number of treasury stock As of March 31, 2025: 73,745,939 shares As of December 31, 2024: 75,848,895 shares 3. Average number of shares issued and outstanding Three months ended March 31, 2025: 1,796,022,895 shares Three months ended March 31, 2024: 1,778,621,860 shares (Note) Information regarding the implementation of audit procedures: These financial results are not subject to quarterly review procedures by the independent auditor. Expand Cautionary Statement The Group will hold an earnings conference for institutional investors and analysts on April 24, 2025. The Group plans to post the materials which are provided at the meeting, on the Group's website on that day. The statements with respect to the financial outlook of Renesas Electronics Corporation (hereinafter 'the Company') and its consolidated subsidiaries (hereinafter 'the Group') are forward-looking statements involving risks and uncertainties. We caution you in advance that actual results may differ materially from such forward-looking statements due to changes in several important factors. Expand About Renesas Electronics Corporation Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. The leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live. Learn more at Follow us on LinkedIn, Facebook, Twitter, YouTube, and Instagram. The statements in this press release with respect to the plans, strategies and financial outlook of Renesas and its consolidated subsidiaries (collectively 'we') are forward-looking statements involving risks and uncertainties. Such forward-looking statements do not represent any guarantee by management of future performance. In many cases, but not all, we use such words as 'aim,' 'anticipate,' 'believe,' 'continue,' 'endeavor,' 'estimate,' 'expect,' 'initiative,' 'intend,' 'may,' 'plan,' 'potential,' 'probability,' 'project,' 'risk,' 'seek,' 'should,' 'strive,' 'target,' 'will' and similar expressions to identify forward-looking statements. You can also identify forward-looking statements by discussions of strategy, plans or intentions. These statements discuss future expectations, identify strategies, contain projections of our results of operations or financial condition, or state other forward-looking information based on our current expectations, assumptions, estimates and projections about our business and industry, our future business strategies and the environment in which we will operate in the future. Known and unknown risks, uncertainties and other factors could cause our actual results, performance or achievements to differ materially from those contained or implied in any forward-looking statement, including, but not limited to, general economic conditions in our markets, which are primarily Japan, North America, Asia, and Europe; demand for, and competitive pricing pressure on, products and services in the marketplace; ability to continue to win acceptance of products and services in these highly competitive markets; and fluctuations in currency exchange rates, particularly between the yen and the U.S. dollar. Among other factors, downturn of the world economy; deteriorating financial conditions in world markets, or deterioration in domestic and overseas stock markets, may cause actual results to differ from the projected results forecast. This press release is based on the economic, regulatory, market and other conditions as in effect on the date hereof. It should be understood that subsequent developments may affect the information contained in this presentation, which neither we nor our advisors or representatives are under an obligation to update, revise or affirm.
Yahoo
25-03-2025
- Automotive
- Yahoo
Renesas Introduces Low-Power Bluetooth Low Energy SoC for Automotive Applications
First Auto-Grade Bluetooth Low Energy SoC from Renesas, DA14533 Offers Industry-Leading Low Power Consumption, Small Footprint and System Cost Efficiency TOKYO, March 25, 2025--(BUSINESS WIRE)--Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced a new industry-leading Bluetooth chip that combines a radio transceiver, an Arm® M0+ microcontroller, memory, peripherals and security features in a compact SoC design. The DA14533, the first automotive-qualified device in the company's Bluetooth® Low Energy system-on-chip (SoC) family, includes advanced power management features to simplify system integration and reduce power consumption. With its software stack qualified against Bluetooth Core 5.3 and support for extended temperatures, developers can jump-start projects in applications from tire pressure monitoring and keyless entry to wireless sensors and battery management systems. Optimized Design to Deliver Unparalleled Power Efficiency Building on Renesas' leadership in Bluetooth LE SoCs (SmartBond Tiny Family) with industry-leading low power consumption, the new DA14533 includes some of the most advanced power management features in the industry. The device includes an integrated DC-DC buck converter, which accurately adjusts the output voltage according to system requirements. Active system power consumption is lower than comparable devices in the market, requiring only 3.1mA during transmission and 2.5mA during reception. In hibernation mode, the current drops to 500nA. These power management and power-saving features help extend the operational life of small-capacity battery-powered systems and meet the stringent power requirements of tire pressure monitoring systems' mission profile. Auto-Grade AEC-Q100 Qualified and Up-to-Date Security Features The DA14533 is an AEC-Q100 Grade 2 qualified device, which means the device has passed strict testing to sustain quality and reliability in harsh automotive environments. Moreover, the device's extended temperature range (-40 to +105°C) ensures reliable performance in demanding conditions, making it ideal for automotive and industrial systems where stability and durability are essential. Qualified against Bluetooth Core 5.3 specifications, the device contains the latest security features to safeguard connected devices from various threats. "Our SmartBond Tiny SoC family has seen remarkable success in the industrial market, with over 100 million units shipped to date," said Chandana Pairla, VP of Connectivity Solutions Division at Renesas. "This new automotive-grade device will enable a new class of Bluetooth LE applications that demand high power efficiency, a small footprint and broader temperature tolerance for next-generation battery-powered automotive and industrial systems." Lower Bill-of-Materials Reduces Costs and Simplifies Development Similar to other Bluetooth LE SoC devices in the SmartBond Tiny family, the DA14533 only requires 6 external components, offering a best-in-class engineering bill of materials (eBOM). A single external crystal oscillator (XTAL) is used for both active and sleep modes, eliminating the need for a separate oscillator for sleep mode. Its ultra-compact design – available in a WFFCQFN 22-pin 3.5 x 3.5 mm package – makes the device the smallest automotive Bluetooth LE SoC on the market. With its compact design and low eBOM, the device integrates seamlessly into space-constrained systems, reducing overall system costs and accelerating time-to-market for customers. Key Features of the DA14533 Arm® Cortex®-M0+ microcontroller – Standalone application processor or data pump in hosted systems 64KB RAM and 12KB One-Time Programmable (OTP) memory 2.4 GHz radio transceiver Integrated low IQ buck DC-DC converter External SPI flash Single XTAL operation (single crystal oscillator) Software stack qualified against Bluetooth Core 5.3 AEC-Q100 Grade 2-qualified with wide operating temperature range support (-40 to +105°C) WFFCQFN 22-pin 3.5 x 3.5 mm package Winning Combinations Renesas has combined the new Bluetooth LE SoC with the R-Car H3/M3/E3 SoCs, PMICs, and timing devices to offer a wide array of Winning Combinations including "Tire Pressure Monitoring System." Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly. They can be found at Availability The DA14533 is available today, along with the Bluetooth Low Energy SoC Development Kit Pro. The kit includes a motherboard, a daughterboard, and cables to facilitate application software development. The daughterboard is also available by itself to simplify development. A blog about the new device is available. More information about Renesas Bluetooth Low Energy solutions is available at: About Renesas Electronics Corporation Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live. Learn more at Follow us on LinkedIn, Facebook, X, YouTube, and Instagram. (Remarks) Bluetooth is a registered trademark of Bluetooth SIG, Inc. of the United States. All names of products or services mentioned in this press release are trademarks or registered trademarks of their respective owners. View source version on Contacts Media Contacts: Americas Akiko IshiyamaRenesas Electronics Corporation+
