Latest news with #SEMICONTaiwan2025
Business Wire
3 days ago
- Business
- Business Wire
Nordson Electronics Solutions 將於 SEMICON Taiwan 2025 展示面板級與晶圓級封裝的高產量流體點膠技術
加州卡爾斯巴德--(BUSINESS WIRE)--(美國商業資訊)-- Nordson Electronics Solutions 作為全球可靠電子製造技術的領導者，將於 9 月 10 至 12 日在 SEMICON Taiwan 2025 的 i2326 展位，展示其最新的 半導體製造設備 。 展品包括 ASYMTEK ® Vantage ® 點膠系統 ，配置兩個 ASYMTEK IntelliJet ® 噴射閥 ，專為半導體封裝及微電子製造提供高效精準的生產方案。Vantage 系統提供多種創新配置，以滿足當前技術發展需求，例如面板級封裝。該系統已廣泛應用於晶圓級封裝作業，包括高產量底部填充、間隙填充，以及適用於扇出/扇入、基板及模組組裝的密封生產線。 等離子處理可去除雜質並活化表面，增強流動性與附著力，從而提升半導體封裝的可靠性。Nordson 等離子處理專家將在現場與客戶探討，如何利用該技術成功實現先進封裝作業。 SEMICON Taiwan 2025 的主題為 「世界同行，創新啟航」，將展示半導體社群如何應對供應鏈變化，以及業界如何為當前與未來開發解決方案。 Nordson Electronics Solutions 致力讓可靠電子產品成為現實。我們透過 ASYMTEK、MARCH 及 SELECT 品牌，為全球半導體、電子及精密組裝製造商，提供創新的 流體點膠 、 表面塗覆 、 等離子處理 及 選擇性焊接 解決方案，保護敏感電子元件並提供可靠的使用壽命。四十多年來，在全球範圍內提供卓越的工程和應用服務，協助客戶取得成功。 關於 Nordson 公司 Nordson Corporation（NASDAQ：NDSN）是一家創新型精密技術的公司，通過一個以部門為主導的創業型組織，利用可擴展的成長框架，以領先的利潤和回報實現頂級增長。公司依託直接銷售模式和應用專業知識，透過各種關鍵應用為全球客戶提供服務。其多元化的終端市場包括非耐用消費品、醫療、電子和工業終端市場。公司創立於1954年，總部位於美國俄亥俄州韋斯特萊克，目前在全球35個國家/地區設有運營網站和技術支援辦公室。造訪Nordson官方網站： 。 免責聲明：本公告之原文版本乃官方授權版本。譯文僅供方便瞭解之用，煩請參照原文，原文版本乃唯一具法律效力之版本。
Globe and Mail
4 days ago
- Business
- Globe and Mail
Nordson Electronics Solutions to Exhibit High-Yield Fluid Dispensing Technologies for Panel-Level and Wafer-Level Packaging at SEMICON Taiwan 2025
Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, will demonstrate their latest equipment for semiconductor manufacturing at SEMICON Taiwan 2025, September 10-12, booth i2326. This press release features multimedia. View the full release here: Nordson Electronics Solutions continues to develop fluid dispensing systems to meet the challenges of semiconductor advanced packaging that ensure high-throughput, precise fluid dispensing results. The ASYMTEK Vantage system offers several new and innovative configurations to meet the demands of today's evolving technologies, like panel-level packaging. The Vantage system is already a popular dispenser in wafer-level packaging operations including high-volume underfill, dispense gap fill, and sealing lines for fan-out/fan-in, strips, and module assembly. On display will be the ASYMTEK ® Vantage ® dispensing system , configured with two ASYMTEK IntelliJet ® jet valves for high productivity and accuracy for semiconductor packaging and microelectronics manufacturing. The Vantage system offers several new and innovative configurations to meet the demands of today's evolving technologies, like panel-level packaging, The Vantage system is already a popular dispenser in wafer-level packaging operations, including high-volume underfill, dispense gap fill, and sealing lines for fan-out/fan-in, strips, and module assembly. Plasma treatment removes impurities and activates surfaces to enhance flow and adhesion for improved semiconductor package reliability. Nordson experts in plasma treatment will be available to discuss how customers can use this technology for successful advanced packaging operations. The theme for SEMICON Taiwan 2025, 'Leading with Collaboration. Innovating with the World,' will showcase how the semiconductor community is navigating supply chain shifts and how the industry is developing solutions for today and the future. About Nordson Electronics Solutions Nordson Electronics Solutions makes reliable electronics a reality. Through our ASYMTEK, MARCH, and SELECT brands, we supply the world's semiconductor, electronics, and precision assembly manufacturers with the innovative fluid dispensing, conformal coating, plasma treatment, and selective soldering solutions their products need to protect sensitive electronics and deliver a lifespan of reliability. Day after day, year after year, across the globe, for over 40 years, we've provided engineering and applications excellence to help our customers succeed. About Nordson Corporation Nordson Corporation (NASDAQ: NDSN) is an innovative precision technology company that leverages a scalable growth framework through an entrepreneurial, division-led organization to deliver top tier growth with leading margins and returns. The Company's direct sales model and applications expertise serves global customers through a wide variety of critical applications. Its diverse end-market exposure includes consumer non-durable, medical, electronics and industrial end markets. Founded in 1954 and headquartered in Westlake, Ohio, the Company has operations and support offices in over 35 countries. Visit Nordson on the web at
Yahoo
4 days ago
- Business
- Yahoo
Nordson Electronics Solutions to Exhibit High-Yield Fluid Dispensing Technologies for Panel-Level and Wafer-Level Packaging at SEMICON Taiwan 2025
Visit booth #i2326 to connect with our experts on automated fluid dispensing and plasma treatment for semiconductor advanced packaging CARLSBAD, Calif., August 18, 2025--(BUSINESS WIRE)--Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, will demonstrate their latest equipment for semiconductor manufacturing at SEMICON Taiwan 2025, September 10-12, booth i2326. On display will be the ASYMTEK® Vantage® dispensing system, configured with two ASYMTEK IntelliJet® jet valves for high productivity and accuracy for semiconductor packaging and microelectronics manufacturing. The Vantage system offers several new and innovative configurations to meet the demands of today's evolving technologies, like panel-level packaging, The Vantage system is already a popular dispenser in wafer-level packaging operations, including high-volume underfill, dispense gap fill, and sealing lines for fan-out/fan-in, strips, and module assembly. Plasma treatment removes impurities and activates surfaces to enhance flow and adhesion for improved semiconductor package reliability. Nordson experts in plasma treatment will be available to discuss how customers can use this technology for successful advanced packaging operations. The theme for SEMICON Taiwan 2025, "Leading with Collaboration. Innovating with the World," will showcase how the semiconductor community is navigating supply chain shifts and how the industry is developing solutions for today and the future. About Nordson Electronics Solutions Nordson Electronics Solutions makes reliable electronics a reality. Through our ASYMTEK, MARCH, and SELECT brands, we supply the world's semiconductor, electronics, and precision assembly manufacturers with the innovative fluid dispensing, conformal coating, plasma treatment, and selective soldering solutions their products need to protect sensitive electronics and deliver a lifespan of reliability. Day after day, year after year, across the globe, for over 40 years, we've provided engineering and applications excellence to help our customers succeed. About Nordson Corporation Nordson Corporation (NASDAQ: NDSN) is an innovative precision technology company that leverages a scalable growth framework through an entrepreneurial, division-led organization to deliver top tier growth with leading margins and returns. The Company's direct sales model and applications expertise serves global customers through a wide variety of critical applications. Its diverse end-market exposure includes consumer non-durable, medical, electronics and industrial end markets. Founded in 1954 and headquartered in Westlake, Ohio, the Company has operations and support offices in over 35 countries. Visit Nordson on the web at View source version on Contacts For information:MAIN OFFICE:Roberta Foster-SmithNordson Electronics Solutions2762 Loker Ave WestCarlsbad, CA, USA 92010Tel: +1.760.431.1919Email: For information in Taiwan:Alex WuSales Director, ASYMTEK and SELECTNordson Advanced Technology LLC, Taiwan BranchTel: +886.932.227.770Email:
Business Wire
4 days ago
- Business
- Business Wire
Nordson Electronics Solutions to Exhibit High-Yield Fluid Dispensing Technologies for Panel-Level and Wafer-Level Packaging at SEMICON Taiwan 2025
CARLSBAD, Calif.--(BUSINESS WIRE)-- Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, will demonstrate their latest equipment for semiconductor manufacturing at SEMICON Taiwan 2025, September 10-12, booth i2326. High-yield dispensing technologies for panel- and wafer-level advanced packaging on display at SEMICON Taiwan 2025 Share On display will be the ASYMTEK ® Vantage ® dispensing system, configured with two ASYMTEK IntelliJet ® jet valves for high productivity and accuracy for semiconductor packaging and microelectronics manufacturing. The Vantage system offers several new and innovative configurations to meet the demands of today's evolving technologies, like panel-level packaging, The Vantage system is already a popular dispenser in wafer-level packaging operations, including high-volume underfill, dispense gap fill, and sealing lines for fan-out/fan-in, strips, and module assembly. Plasma treatment removes impurities and activates surfaces to enhance flow and adhesion for improved semiconductor package reliability. Nordson experts in plasma treatment will be available to discuss how customers can use this technology for successful advanced packaging operations. The theme for SEMICON Taiwan 2025, 'Leading with Collaboration. Innovating with the World,' will showcase how the semiconductor community is navigating supply chain shifts and how the industry is developing solutions for today and the future. About Nordson Electronics Solutions Nordson Electronics Solutions makes reliable electronics a reality. Through our ASYMTEK, MARCH, and SELECT brands, we supply the world's semiconductor, electronics, and precision assembly manufacturers with the innovative fluid dispensing, conformal coating, plasma treatment, and selective soldering solutions their products need to protect sensitive electronics and deliver a lifespan of reliability. Day after day, year after year, across the globe, for over 40 years, we've provided engineering and applications excellence to help our customers succeed. About Nordson Corporation Nordson Corporation (NASDAQ: NDSN) is an innovative precision technology company that leverages a scalable growth framework through an entrepreneurial, division-led organization to deliver top tier growth with leading margins and returns. The Company's direct sales model and applications expertise serves global customers through a wide variety of critical applications. Its diverse end-market exposure includes consumer non-durable, medical, electronics and industrial end markets. Founded in 1954 and headquartered in Westlake, Ohio, the Company has operations and support offices in over 35 countries. Visit Nordson on the web at
Malaysian Reserve
7 days ago
- Business
- Malaysian Reserve
Advanced Packaging on the Rise: SEMICON Taiwan 2025 Leads the Way
AI and HPC Fuel Advances in Packaging Technology 3DIC, FOPLP, and Chiplet Forums Gain Global Spotlight HSINCHU, Aug. 15, 2025 /PRNewswire/ — As demand for AI and HPC accelerates, the semiconductor industry is embracing a new era. With Moore's Law slowing and scaling challenges rising, technologies like 3DIC, Fan-Out Panel Level Packaging (FOPLP), chiplets, and co-packaged optics (CPO) are becoming essential for next-level performance and system integration. SEMICON Taiwan 2025 will spotlight these advances through global forums starting September 8, ahead of the main exhibition from September 10–12 at Taipei Nangang Exhibition Center. Explosive Growth in Advanced Packaging Market 'Fueled by soaring AI demand, advanced manufacturing capacity is expected to hit a record 1.4 million wafers per month by 2028,' said Terry Tsao, Global Chief Marketing Officer and President of Taiwan, SEMI. 'As AI demands surpass the limits of single-chip scaling, advanced packaging technologies like 3DIC and FOPLP are essential for system-level integration. With the industry moving from a linear supply chain to a more integrated and collaborative ecosystem, SEMICON Taiwan 2025 will serve as a vital global platform for industry leaders to explore how packaging and manufacturing innovation can unlock new commercial value across the semiconductor landscape.' Launch of 3DIC Advanced Manufacturing Alliance To drive global collaboration and next-gen system integration, SEMI will launch the 3DIC Advanced Manufacturing Alliance (3DICAMA) at SEMICON Taiwan 2025. The alliance aims to boost cross-industry collaboration, enhance supply chain resilience, promote standards adoption, and speed technology commercialization. World's Top Advanced Packaging Platform at SEMICON Taiwan 2025 SEMICON Taiwan 2025 will host the Heterogeneous Integration Global Summit (HIGS), FOPLP Innovation Forum, and 3DIC Global Summit, covering topics from design and materials to process and supply chain. Industry leaders, including ASE, Broadcom, Lightmatter, MediaTek, Nvidia, Sony, and TSMC, will join HIGS Series to address challenges in 3DIC, CPO, and AI packaging. At the FOPLP Innovation Forum, AMD and PTI will share the latest innovations and market strategies. This year's Heterogeneous Integration Area will expand to three pavilions: 3DIC Advanced Packaging, FOPLP, and Semiconductor Packaging. Leading companies such as Innolux, PTI, Comet, Coherent, E&R Engineering, GP, Lam Research, Manz, Mirle, PDF Solutions, PSK, Shibaura, and Utechzone will showcase advanced integration applications and foster partnerships. Registration for SEMICON Taiwan 2025 is now open. Apply for FREE visitor codes by August 31 and receive 20% off the International Semiconductor Forum. Visit the Official website. About SEMI SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management, and other programs. Our SEMICON® expositions and events, technology communities, standards, and market intelligence help advance our members' business growth and innovations in design, devices, equipment, materials, services, and software, enabling smarter, faster, more secure electronics. Visit or join SEMI Facebook, SEMI LinkedIn, and SEMI Official Line Account.
