Latest news with #SKC
News18
02-08-2025
- Politics
- News18
Religion should be a personal matter for every individual: Sukhu
New Delhi, Aug 2 (PTI) Himachal Pradesh Chief Minister Sukhvinder Singh Sukhu on Saturday said religion should be a personal matter for every individual and the states should be secular in their approach. Chairing the second session on 'Religion and the Constitution: Guardrails and Guidelines' at the national conclave on 'Constitutional Challenges: Perspective and Pathways', he said every religion should be respected and the ancient traditions of peace and brotherhood should be upheld. The chief minister said every religion is respected in our country and the basis of our rich traditions of unity and brotherhood lies there, a statement from his office said. 'We are known for our religious tolerance," he said, and added that in the absence of rich values, there always remains a possibility of the emergence of violence and conflicts in the society. Sukhu said religion is an important part of our lives and it has been at the centre of human society's existence since time immemorial. He said religion should not be used for dividing people and every effort should be made to separate religion from politics. Noting that no religion instigates against another, the chief minister said, 'Those who always take pride in our ancient civilisation, why do they not understand the fundamental justification of our secularism and religious freedom?" Religious freedom under the Indian Constitution is based on the belief that every human being has an inherent dignity to explore their conscience, he said. 'If we provide religious freedom, then we provide unity. The word used for unity in the Preamble of the Constitution is fraternity," the chief minister said. Former Chhattisgarh chief minister Bhupesh Baghel, senior Congress leaders Digvijaya Singh, Abhishek Singhvi, Alka Lamba, Pramod Tiwari and others spoke on the occasion. PTI SKC SKC KSS KSS view comments First Published: Disclaimer: Comments reflect users' views, not News18's. Please keep discussions respectful and constructive. Abusive, defamatory, or illegal comments will be removed. News18 may disable any comment at its discretion. By posting, you agree to our Terms of Use and Privacy Policy.
The Print
09-07-2025
- Politics
- The Print
Punjab CM seeks ‘legitimate' share of Indus water, says state has not a drop to share
Participating in a meeting held at Shram Shakti Bhawan here on the SYL canal issue, Mann said Punjab has no surplus water to share with others and asserted that a reassessment of the availability of water in the state is needed according to international norms. He also mooted the idea of a Yamuna Sutlej Link (YSL) canal instead of the Sutlej Yamuna Link (SYL) canal. New Delhi, Jul 9 (PTI) Punjab Chief Minister Bhagwant Singh Mann on Wednesday asserted the state has no surplus water for others and demanded its legitimate share in the Indus waters. The groundwater situation in Punjab is very grim, he said, adding that since most of the river resources of the state have dried up, it needs more water to cater to its irrigation needs. The scant amount of water Punjab has is being provided to farmers, and in such a scenario, there is no question of sharing even a drop of water with any other state, the chief minister said. He said the opportunity that has opened up with the suspension of the Indus Waters Treaty with Pakistan must be duly utilised to fulfil the water needs of the state. Efforts should be made to bring water from the western rivers (Indus, Jhelum and Chenab) to meet the growing demand, Mann added. He pointed out that India's decision to suspend the water treaty with Pakistan after the Pahalgam terror attack opens up the possibility of greater utilisation of water from the western rivers. Mann went on to stress that Punjab, which is currently facing groundwater depletion, must be prioritised in any future strategies for the usage, diversion, or allocation of river waters. PTI SKC NSD NSD This report is auto-generated from PTI news service. ThePrint holds no responsibility for its content.
The Print
24-06-2025
- Politics
- The Print
Parliamentary panel asks why no FIR lodged in recovery of unaccounted cash at Justice Varma's house
During a meeting of the Parliamentary Committee on Personnel, Public Grievances, Law and Justice, MPs of various parties raised the issue and posed several questions to the Ministry of Law and Justice on what it was doing in the matters raised concerning the judiciary. The MPs also demanded a code of conduct for judges, and justices in the higher judiciary should not take up government assignments till a period of five years post-retirement, they said. New Delhi, Jun 24 (PTI) Several MPs at a Parliamentary panel meeting on Tuesday asked why no FIR has been lodged over the recovery of unaccounted cash from a high court judge's residence here and told the Department of Justice to prepare a detailed note on the matter, sources said. Sources said the secretary in the Department of Justice, who made a presentation on 'Judicial processes and their reform' concerning issues of Code of Conduct for the judges of higher judiciary and taking up post-retirement assignments by judges', was asked to prepare a comprehensive report on the issues raised and told to present it at the next panel meeting. They add that the members also sought a comprehensive bill addressing various issues and concerns on ethics and code of conduct of judges which were raised by them during the meeting. The MPs sought to know why no action had been taken on the matter concerning the recovery of unaccounted cash from the residence of Justice Yashwant Varma and demanded a code of conduct should be in place. Some MPs also asked why no motion to remove Justice Varma has been moved so far. Sources said some demanded that justice should be equitable since a government employee may lose his/her job over a small corruption issue but no action has been initiated against a senior member of the judiciary even after the recovery of unaccounted cash. MPs of several parties also demanded that the government should have brought a motion by now to remove the judge concerned, especially after a Supreme Court-appointed committee of judges found the recovery of cash to be true. After the cash recovery, Justice Varma was repatriated to his parent court — the Allahabad High Court. He has denied the charges against him. The MPs also deliberated upon post-retirement assignments of judges and said they should not get such appointments till a period of five years after their retirement. Some MPs also said that former judges should not be appointed as MPs or to any other assignments by the President of India immediately post-retirement. The committee of the Rajya Sabha is headed by BJP MP Brij Lal and has former Chief Justice of India Ranjan Gogoi, who is a nominated MP, former minister of state for law P P Chaudhary, TMC MPs Sukhendu Sekhar Ray and Kalyan Banerjee, Congress's Vivek Tankha, and DMK's P Wilson and A Raja as its key members. Former CJI Ranjan Gogoi did not attend Tuesday's meeting. PTI SKC SKC NSD NSD This report is auto-generated from PTI news service. ThePrint holds no responsibility for its content.
Korea Herald
30-05-2025
- Business
- Korea Herald
Could glass help Samsung crack next semiconductor conundrum?
Glass substrates inch closer to commercialization — poised to redefine performance, power efficiency in chips Glass substrates, long viewed as a promising next-generation component in advanced chip packaging, are now nearing real-world deployment, as Samsung Electronics signals a transition away from conventional silicon interposers. According to industry sources Wednesday, Samsung plans to adopt glass substrate interposers for its advanced semiconductors by 2028 to 'meet customer demands.' While the company neither confirmed nor denied the development, it stated, 'We are investing in (research and development) and preparing in line with industry trends.' In semiconductor manufacturing, interposers are critical in advanced packaging technologies. They connect high-bandwidth memory (HBM) chips with graphics processing units (GPUs) or other logic chips, enabling faster data transfer and improved overall performance. Although chipmakers have traditionally relied on silicon substrates for their manufacturing maturity and compatibility, they are increasingly exploring glass as a high-performance alternative that offers improved energy efficiency. 'If glass substrates are successfully adopted, they could become a very attractive material,' said a chip materials professor on condition of anonymity. 'But there are still significant hurdles to clear before they can be commercialized.' A game changer for advanced packaging Glass core substrates are widely seen as a potential game changer in the semiconductor landscape. They serve as thin, rigid platforms that allow for side-by-side mounting of logic and memory chips, forming the foundation of high-performance computing systems. Their advantages are substantial: exceptional heat resistance, ultra-flat surfaces for greater chip density and finer patterning capabilities. According to SKC, the parent company of glass substrate maker Absolics, the material can improve chip processing speeds by up to 40 percent and reduce power consumption by more than 40 percent compared to traditional silicon substrates. Despite these benefits, commercialization has been slow, primarily due to the brittleness of glass and the high-precision demands of the manufacturing process. Nevertheless, leading chipmakers — including Samsung, Intel, AMD, Broadcom and Nvidia — are actively exploring the adoption of glass substrates in their next-generation chip products. 'Competition in the chip market is intensifying, and players are constantly seeking breakthroughs to set themselves apart,' said Lee Byung-hun, professor of electrical engineering at Pohang University of Science and Technology. 'It's encouraging that Samsung continues to pursue differentiation to strengthen its competitive edge.' Amid growing momentum, the global glass substrate market is projected to grow from $7.2 billion in 2024 to $10.3 billion by 2034, according to market tracker Global Market Insight. Who's winning the game? The first company expected to commercialize glass core substrates is Absolics, a semiconductor materials subsidiary of SKC. The firm has already begun prototype production at its Georgia, US facility, which boasts an annual capacity of 12,000 square meters. Absolics is currently undergoing product qualification with clients and aims to complete preparations for mass production within this year. Its Georgia plant, completed in the first half of last year, made Absolics the first Korean firm to receive $40 million in subsidies under the US CHIPS and Science Act — part of a broader $75 million support package from the US government. Samsung Electro-Mechanics, which announced its entry into the glass substrate market last year, aims to produce its first prototype by the second quarter of this year. It has reportedly begun operating a pilot line at its Sejong plant. LG Innotek is also preparing to enter the space, building a pilot line at its Gumi plant and planning to begin prototype production by year-end. As a latecomer, the company aims to differentiate itself through a strategic partnership with a 'major North American client,' according to its CEO. While companies are racing to develop prototypes in 2024, experts caution that the timeline for full commercialization remains uncertain. 'Company activities are largely driven by client interest, but that does not necessarily guarantee immediate deployment,' said another professor specializing in glass core technologies, also requesting anonymity. 'Absolics, for instance, announced more than a year ago that it had begun product qualification with clients, but no results have been disclosed to date.' 'Glass substrates clearly offer compelling advantages,' the professor added. 'But so do their limitations, especially in terms of long-term reliability. Their use will depend heavily on specific applications, and competing materials remain in play. So while the potential is there, it's still too early to speak with certainty.'
Korea Herald
28-05-2025
- Business
- Korea Herald
Could glass help Samsung crack next semiconductor conundrum?
Glass substrates inch closer to commercialization — poised to redefine performance, power efficiency in chips Glass substrates, long viewed as a promising next-generation component in advanced chip packaging, are now nearing real-world deployment, as Samsung Electronics signals a transition away from conventional silicon interposers. According to industry sources Wednesday, Samsung plans to adopt glass substrate interposers for its advanced semiconductors by 2028 to 'meet customer demands.' While the company neither confirmed nor denied the development, it stated, 'We are investing in (research and development) and preparing in line with industry trends.' In semiconductor manufacturing, interposers are critical in advanced packaging technologies. They connect high-bandwidth memory (HBM) chips with graphics processing units (GPUs) or other logic chips, enabling faster data transfer and improved overall performance. Although chipmakers have traditionally relied on silicon substrates for their manufacturing maturity and compatibility, they are increasingly exploring glass as a high-performance alternative that offers improved energy efficiency. 'If glass substrates are successfully adopted, they could become a very attractive material,' said a chip materials professor on condition of anonymity. 'But there are still significant hurdles to clear before they can be commercialized.' A game changer for advanced packaging Glass core substrates are widely seen as a potential game changer in the semiconductor landscape. They serve as thin, rigid platforms that allow for side-by-side mounting of logic and memory chips, forming the foundation of high-performance computing systems. Their advantages are substantial: exceptional heat resistance, ultra-flat surfaces for greater chip density and finer patterning capabilities. According to SKC, the parent company of glass substrate maker Absolics, the material can improve chip processing speeds by up to 40 percent and reduce power consumption by more than 40 percent compared to traditional silicon substrates. Despite these benefits, commercialization has been slow, primarily due to the brittleness of glass and the high-precision demands of the manufacturing process. Nevertheless, leading chipmakers — including Samsung, Intel, AMD, Broadcom and Nvidia — are actively exploring the adoption of glass substrates in their next-generation chip products. 'Competition in the chip market is intensifying, and players are constantly seeking breakthroughs to set themselves apart,' said Lee Byung-hun, professor of electrical engineering at Pohang University of Science and Technology. 'It's encouraging that Samsung continues to pursue differentiation to strengthen its competitive edge.' Amid growing momentum, the global glass substrate market is projected to grow from $7.2 billion in 2024 to $10.3 billion by 2034, according to market tracker Global Market Insight. Who's winning the game? The first company expected to commercialize glass core substrates is Absolics, a semiconductor materials subsidiary of SKC. The firm has already begun prototype production at its Georgia, US facility, which boasts an annual capacity of 12,000 square meters. Absolics is currently undergoing product qualification with clients and aims to complete preparations for mass production within this year. Its Georgia plant, completed in the first half of last year, made Absolics the first Korean firm to receive $40 million in subsidies under the US CHIPS and Science Act — part of a broader $75 million support package from the US government. Samsung Electro-Mechanics, which announced its entry into the glass substrate market last year, aims to produce its first prototype by the second quarter of this year. It has reportedly begun operating a pilot line at its Sejong plant. LG Innotek is also preparing to enter the space, building a pilot line at its Gumi plant and planning to begin prototype production by year-end. As a latecomer, the company aims to differentiate itself through a strategic partnership with a 'major North American client,' according to its CEO. While companies are racing to develop prototypes in 2024, experts caution that the timeline for full commercialization remains uncertain. 'Company activities are largely driven by client interest, but that does not necessarily guarantee immediate deployment,' said another professor specializing in glass core technologies, also requesting anonymity. 'Absolics, for instance, announced more than a year ago that it had begun product qualification with clients, but no results have been disclosed to date.' 'Glass substrates clearly offer compelling advantages,' the professor added. 'But so do their limitations, especially in terms of long-term reliability. Their use will depend heavily on specific applications, and competing materials remain in play. So while the potential is there, it's still too early to speak with certainty.'
