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BusinessToday
5 days ago
- Business
- BusinessToday
Weekly Wrap: KOSPI Steady Above 2,600 As Tech Sector Leads Weekly Advance
South Korea's benchmark KOSPI index ended the week of May 26 to May 30 firmly above the 2,600-point level, bolstered by strong gains in the technology sector and improving global trade sentiment. The KOSPI started the week with a sharp rise, surging over 2% on May 26 following the US administration's move to delay tariffs on the European Union. This policy shift eased investor concerns about escalating global trade conflicts and set a positive tone across Asian markets. By midweek, the index climbed to an eight-month high of 2,720.64, before easing slightly to close at 2,697.67 on May 30 due to profit-taking ahead of the weekend. Despite the pullback, the KOSPI managed to post a robust weekly gain and maintain its position well above the psychological 2,600 threshold. Leading the rally was South Korea's heavyweight tech sector, with semiconductor stocks showing particular strength. Market leaders like Samsung Electronics Co Ltd and Sk Hynix Inc drew strong investor interest amid rising global demand for memory chips and optimism surrounding AI-driven infrastructure development. Looking ahead, while sentiment remains broadly positive, analysts caution that external risks including upcoming economic data from the US and China, as well as potential interest rate shifts, could influence short-term momentum. Investors will be watching closely in the coming weeks for signals from the Federal Reserve and updates on trade negotiations, which could determine whether the KOSPI can build on its recent strength or enter a consolidation phase. Related
Globe and Mail
14-02-2025
- Business
- Globe and Mail
3D Semiconductor Packaging Market Size Is Likely To Reach a Valuation of Around $40.7 Billion by 2032
3D Semiconductor Packaging Market Research Report Information By Technology (3D Through Silicon Via, 3D Package on Package, 3D Fan Out Based and 3D Wire Bonded), By End User (Telecommunication, Consumer Electronics, Industrial, and Others) And By Region (North America, Europe, Asia-Pacific, And The Rest Of The World) –Market Forecast Till 2032 The 3D Semiconductor Packaging Market was valued at USD 12.2 billion in 2023 and is projected to grow from USD 14.1825 billion in 2024 to USD 40.7 billion by 2032, exhibiting a compound annual growth rate (CAGR) of 14.09% during the forecast period (2024-2032). The market's growth is primarily driven by the rising demand for miniaturization of electronic devices and the rapid expansion of the information and communications industry. Key Drivers of Market Growth Miniaturization of Electronic Devices: Increased demand for compact and high-performance electronic products. Integration of multiple functionalities in smaller chip sizes. Growth in Information and Communications Industries: Expansion of 5G networks and IoT applications. Rising demand for high-speed, high-efficiency semiconductor solutions. Enhanced Performance and Power Efficiency: 3D packaging enables better heat dissipation and power management. Increased adoption in high-performance computing and AI-based applications. Download Sample Pages: Key Companies in the 3D Semiconductor Packaging Market include Samsung Electronics Co Ltd. United Microelectronics Corporation Intel Corporation ACM Research Taiwan Semiconductor Manufacturing Company ASE Technology Holdings Co. Ltd. Amkor Technology Jiangsu Changjiang Electronics Technology Co. Ltd, among others Market Segmentation By Technology 3D Through-Silicon Via (TSV) High-performance interconnect technology widely used in advanced processors. 3D Fan-Out Wafer Level Packaging (FOWLP) Provides cost-effective and compact solutions for various applications. 3D System-in-Package (SiP) Integration of multiple chips within a single package to enhance performance. 2.5D Interposer Packaging Bridge between traditional and full 3D semiconductor packaging, widely used in GPUs and AI processors. By End-User Industry Consumer Electronics: Rising adoption in smartphones, wearables, and portable electronic devices. Automotive: Increased use in ADAS, electric vehicles, and infotainment systems. Telecommunications: High demand due to 5G infrastructure expansion and network upgrades. Healthcare: Integration in medical devices for better processing and real-time data analysis. Aerospace & Defense: Adoption in mission-critical applications requiring high reliability and compact designs. By Region North America: Leading region due to strong presence of semiconductor manufacturers and R&D investments. Europe: Growth driven by automotive and industrial automation applications. Asia-Pacific: Fastest-growing market due to high production of consumer electronics and growing semiconductor manufacturing sector. Rest of the World: Emerging markets investing in advanced semiconductor technologies. The 3D Semiconductor Packaging Market is experiencing rapid growth due to increasing demand for miniaturized electronic devices and technological advancements in telecommunications and AI computing. With a CAGR of 14.09% from 2024 to 2032, the market is expected to witness significant innovation, investment, and expansion across various sectors. Metrology Market 3D Sensor Market About Market Research Future At Market Research Future (MRFR), we enable our customers to unravel the complexity of various industries through our Cooked Research Report (CRR), Half-Cooked Research Reports (HCRR), Raw Research Reports (3R), Continuous-Feed Research (CFR), and Market Research Consulting Services. The MRFR team have a supreme objective to provide the optimum quality market research and intelligence services for our clients. Our market research studies by Components, Application, Logistics and market players for global, regional, and country level market segments enable our clients to see more, know more, and do more, which help to answer all their most important questions.
