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Time of India
6 days ago
- Business
- Time of India
Cabinet approves four semiconductor units in Odisha, Andhra Pradesh and Punjab
The Union Cabinet has approved the establishment of four new semiconductor manufacturing units at a total cost of ₹4,594 crore. Two of the facilities will be set up in Odisha, with one each in Andhra Pradesh and Punjab, according to a statement by the Ministry of Electronics & IT. These four proposals approved are from SiCSem , Continental Device India Private Limited (CDIL), 3D Glass Solutions Inc., and Advanced System in Package (ASIP) Technologies. While SiCSem and 3D Glass will be set up in Odisha, CDIL is located in Punjab and ASIP will be set up in Andhra Pradesh. Union Minister for Information and Technology Ashwini Vaishnaw had earlier said that India's first domestically produced semiconductor chip would be rolled out 'very soon', with six other semiconductor plants already under construction in Gujarat, Assam and Uttar Pradesh. Vaishnaw reiterated the government's objective of making artificial intelligence technologies widely accessible. He said the India AI mission has made 34,000 graphics processing units (GPUs) available as a common computing resource for innovators. With the approval of these projects, semiconductor ecosystem in the country would get a significant boost as these projects include the country's first commercial compound fab as well as highly advanced glass-based substrate semiconductor packaging unit, the ministry said. About the projects To establish an integrated facility of Silicon Carbide (SiC)-based compound semiconductors in Info Valley, Bhubaneshwar, Odisha, SicSem Private Limited is collaborating with Clas-SiC Wafer Fab Ltd., UK. This will be the first commercial compound fab in the country. Also, 3D Glass Solutions Inc. (3DGS) will be setting up a vertically integrated advanced packaging and embedded glass substrate unit in Info Valley, Bhubaneshwar, Odisha. On the other hand, Advanced System in Package Technologies (ASIP) will set up a semiconductor manufacturing unit in Andhra Pradesh, under technology tie-up with APACT Co. Ltd, South Korea, with an annual capacity of 96 million units, the statement added. In addition, Continental Device (CDIL) will expand its discrete semiconductor manufacturing facility at Mohali, Punjab, that will manufacture high-power discrete semiconductor devices such as MOSFETs, IGBTs, Schottky Bypass Diodes, and transistors, both in Silicon and Silicon Carbide.
Hans India
12-08-2025
- Business
- Hans India
Cabinet okays 4 semiconductor manufacturing units with Rs 4,600 crore outlay
New Delhi: The Union Cabinet, chaired by Prime Minister Narendra Modi, on Tuesday approved four more semiconductor projects under the India Semiconductor Mission (ISM) with an outlay of Rs 4,600 crore. The four proposals approved are from SiCSem, Continental Device India Private Limited (CDIL), 3D Glass Solutions Inc., and Advanced System in Package (ASIP) Technologies. With these, the total approved projects under the ISM have reached 10, with cumulative investments of around Rs 1.60 lakh crore in six states. "These four approved proposals will set up semiconductor manufacturing facilities with a cumulative investment of around Rs 4,600 crore and are expected to generate a cumulative employment for 2,034 skilled professionals, which would catalyse the electronic manufacturing ecosystem, resulting in the creation of many indirect jobs," a Cabinet communique said. SiCSem and 3D Glass will be set up in Odisha. CDIL is located in Punjab, and ASIP will be set up in Andhra Pradesh. SicSem Private Limited is collaborating with Clas-SiC Wafer Fab Ltd., UK, to establish an integrated facility of silicon carbide-based Compound Semiconductors in Info Valley, Bhubaneshwar. This will be the first commercial compound fab in the country. The project proposes to manufacture silicon carbide devices. This compound semiconductor fab will have an annual capacity of 60,000 wafers and a packaging capacity of 96 million units. The proposed products will have applications in missiles, defence equipment, electric vehicles (EVs), railways, fast chargers, data centre racks, consumer appliances, and solar power inverters, the Cabinet note said. 3D Glass Solutions Inc. (3DGS) will set up a vertically integrated advanced packaging and embedded glass substrate unit in Odisha. This unit will bring the world's most advanced packaging technology to India. The facility will have a large variety of advanced technologies, including glass interposers with passives and silicon bridges, and 3D heterogeneous integration (3DHI) modules. Planned capacity of this unit will be approximately 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules per annum. The proposed products will have significant applications in defence, high-performance computing, artificial intelligence, RF and automotive, photonics and co-packaged optics, etc. According to the Cabinet, the Advanced System in Package Technologies (ASIP) will set up a semiconductor manufacturing unit in Andhra Pradesh, under a technology tie-up with APACT Co. Ltd, South Korea, with an annual capacity of 96 million units. The manufactured products will find applications in mobile phones, set-top boxes, automobile applications, and other electronic products. Continental Device (CDIL) will expand its discrete semiconductor manufacturing facility at Mohali, Punjab. The proposed facility will manufacture high-power discrete semiconductor devices such as MOSFETs, IGBTs, Schottky Bypass Diodes, and transistors, both in silicon and silicon carbide. The annual capacity of this brownfield expansion will be to the tune of 158.38 million units. The devices manufactured by these proposed units will have applications in automotive electronics, including EVs and their charging infrastructure, renewable energy systems, power conversion applications, industrial applications and communication infrastructure. "These would complement the growing world-class chip design capabilities coming up in the country, which are propelled by design infrastructure support provided by the government to 278 academic institutions and 72 start-ups. Already more than 60,000 students have availed the benefits of the talent development programme," said the Cabinet.
Indian Express
12-08-2025
- Business
- Indian Express
Cabinet clears four new chip plants for Rs 4,600 crore in Odisha, Punjab and Andhra Pradesh
The Union Cabinet on Tuesday cleared four new semiconductor assembly and testing plants under its India Semiconductor Mission, which have a total financial outlay of Rs 4,594 crore. Two of these plants will come up in Odisha, and one each in Punjab and Andhra Pradesh. With these, the government is now offering financial incentives for the construction of a total of 10 chip-related factories, ranging from a fabrication plant to assembly and testing operations. The two plants in Odisha include a Rs 2,066 crore assembly and testing (ATMP) facility being set up by SiCSem Pvt Ltd, which will produce silicon carbide based diodes and MOSFETs, and another ATMP plant by 3D Glass Solutions Inc. worth Rs 1,943 crore. Union IT Minister Ashwini Vaishnaw said the second plant has investments from Intel, Lockheed Martin, and other VC and PE funds. The first plant will have an ATMP capacity of 96 million chips per year, and the second has a capacity of producing 50 million chips a year. Both these plants will be constructed in Bhubaneswar. Advanced System in Package Technologies (ASIP) will set up a semiconductor manufacturing unit in Andhra Pradesh, under a technology tie-up with APACT Co. Ltd, South Korea, with an annual capacity of 96 million units. The manufactured products will find applications in mobile phones, set-top boxes, automobile applications, and other electronic products. Continental Device (CDIL) will expand its discrete semiconductor manufacturing facility at Mohali, Punjab. The proposed facility will manufacture high-power discrete semiconductor devices such as MOSFETs, IGBTs, Schottky Bypass Diodes, and transistors, both in Silicon and Silicon Carbide. The annual capacity of this brownfield expansion will be to the tune of 158.38 million units. The devices manufactured by these proposed units will have applications in automotive electronics including EVs and its charging infrastructure, renewable energy systems, power conversion applications, industrial applications and communication infrastructure. The new locations for the chip plants mark a break from a majority of the facilities which have been approved for construction in Gujarat. Of the 10 plants now approved, four are in Gujarat. Before these, the government has managed to attract six chip plants under its Rs 76,000 crore India Semiconductor Mission. This includes the Tata-PSMC fab, being built at a cost of roughly $11 billion, along with assembly and testing plants by US-based Micron Technology, the Tatas, Murugappa Group's CG Power in partnership with Japan's Renesas, Kaynes Semicon, and HCL-Foxconn. Some of these facilities are in an advanced stage of construction, with the first made-in-India chip expected to roll out later this year. In August 2024, The Indian Express had reported that the Centre had created a fresh $15 billion blueprint for the second phase of the India Semiconductor Mission. Under the renewed scheme, the government was planning to offer capital support for raw materials and gases used in chip manufacturing, this paper had reported.
