Latest news with #SumanNarayan
Time of India
4 days ago
- Business
- Time of India
Cyient Semiconductors partners with GlobalFoundries to provide chipmaking services in India
NEW DELHI: Cyient Semiconductors on Thursday said it has signed a strategic channel partner agreement with US-based chipmaker GlobalFoundries for providing semiconductor manufacturing services . Hyderabad-based Cyient had launched its semiconductor unit in April this year to provide application-specific integrated circuit (ASIC) turnkey solutions for companies. 'Under the agreement, Cyient Semiconductors becomes an authorised reseller of GF's semiconductor manufacturing services and technologies,' Cyient Semiconductors said in a media statement. The pact will allow Cyient Semiconductors to provide companies with access to GlobalFoundries' fabrication, technical consultation, design enablement, assembly, testing, and other value-added services to drive innovation and reduce time-to-market, according to the statement. GlobalFoundries counts iPhone-maker Apple, Intel, and Qualcomm, among others, as its customers. It has semiconductor fabrication units in the US, Europe and Asia, including China. 'It positions us to serve the fast-growing ecosystem of fabless companies with access to world-class foundry capabilities and advanced technologies from GlobalFoundries. By combining this with Cyient Semiconductors' turnkey ASIC capabilities, we are excited to play a catalyst role in accelerating semiconductor innovation across automotive, industrial, medical, and communication sectors,' Cyient Semiconductors CEO Suman Narayan said. GlobalFoundries does not have a manufacturing unit, or a fab, in India. However, it has an employee base of over 1,000 in the country, according to a recent post on LinkedIn. 'Cyient Semiconductors brings strong domain expertise, customer-centricity, and complementary design capabilities that align perfectly with GF's mission to expand our strategic alliances across the semiconductor industry,' GlobalFoundries Chief Customer Officer Samuel Vicari said.
Entrepreneur
4 days ago
- Business
- Entrepreneur
Cyient Semiconductors Signs Channel Partnership Agreement with GlobalFoundries
You're reading Entrepreneur India, an international franchise of Entrepreneur Media. Cyient Semiconductors has entered into a channel partner agreement with GlobalFoundries (GF), one of the world's largest pure-play semiconductor foundries. The partnership enables Cyient Semiconductors to act as an authorised reseller of GF's semiconductor manufacturing services and technologies. As part of the agreement, Cyient Semiconductors will facilitate access to GF's advanced manufacturing processes for clients, particularly fabless companies. The company will also offer services such as design enablement, technical consultation, assembly, and testing, with the aim of streamlining the production cycle and helping clients bring products to market faster. Cyient Semiconductors CEO Suman Narayan said the partnership aligns with the company's broader growth strategy, particularly in sectors such as automotive, industrial, medical, and communications. "This agreement allows us to extend world-class foundry capabilities to emerging semiconductor firms and contribute to accelerating innovation in key industries," he said. GlobalFoundries, which has been expanding its strategic alliances to serve a wider customer base, views this partnership as an opportunity to reach high-potential yet underserved market segments. "Cyient Semiconductors brings technical depth and customer focus that complement GF's mission," said Samuel Vicari, Chief Customer Officer at GlobalFoundries. A dedicated team will be set up under the partnership to support clients from early-stage design to production, focusing on ensuring seamless coordination and support throughout the chip development lifecycle. The collaboration also marks a strategic move for both companies to deepen their footprint across the global semiconductor value chain at a time when demand for customized, energy-efficient silicon solutions is growing.
United News of India
13-06-2025
- Automotive
- United News of India
Hyd: Cyient partners with MIPS to develop ASIC and ASSP solutions
Hyderabad, June 12 (UNI) Cyient Semiconductors Private Limited, a fast-growing custom silicon company based in Hyderabad, and MIPS, a global leader in RISC-V processor IP, on Thursday announced a strategic collaboration to develop domain-optimized ASIC (application-specific integrated circuit) and ASSP (application-specific standard product) solutions that leverage the MIPS Atlas portfolio of advanced, efficient processor IP. The partnership will focus on enabling real-time, safety-critical applications, power delivery, and compute efficiency in demanding platforms for automotive, industrial, and data center markets, the company said in a release here. Motor Control & Data Center Power Delivery are focal platforms to leverage Cyient's Analog Mixed Signal capabilities and MIPS Atlas CPU IP. Suman Narayan, CEO of Cyient Semiconductors, said, 'Our collaboration with MIPS allows us to bring together embedded intelligence and advanced power architectures in custom silicon platforms built on a scalable, open foundation. Together, we are designing tomorrow's semiconductors — purpose-built for a more connected and power-efficient world.' 'The problem of power efficiency and motor control is both real-time compute workloads for which MIPS M8500 microcontrollers are the optimal choice,' said Sameer Wasson, CEO of MIPS. 'Building around our best-in-class real-time and control-loop performance and efficiency, Cyient can bring their unique capability in intelligent power delivery into custom ASIC and ASSP designs to build differentiated solutions that meet our customers' unique needs in their target markets,' Sameer added. Demand for software-defined vehicles, data center infrastructure, and industrial automation is driving growth for custom silicon. Customers can build advanced, differentiated solutions that are easy to program using MIPS advanced processor IP, based on the open RISC-V instruction set architecture, combined with Cyient's intelligent power and mixed-signal design expertise. Targeted applications include motor drive control, intelligent power management, power delivery management, and safety-critical applications, offered as ASSP or ASIC platforms. OEMs and system integrators will benefit from faster time-to-market, avoiding proprietary lock-ins, and optimized platform cost. UNI KNR BD
Cision Canada
12-06-2025
- Automotive
- Cision Canada
MIPS and Cyient Semiconductor collaborate to bring Custom RISC-V-based intelligent power solutions to AI Power Delivery, Industrial Robotics, and Automotive
SAN JOSE, Calif. and HYDERABAD, India, June 12, 2025 /CNW/ -- Cyient Semiconductors Private Limited, a fast-growing custom silicon company based in Hyderabad, and MIPS, a global leader in RISC-V processor IP, today announced a strategic collaboration to develop domain-optimized ASIC (application-specific integrated circuit) and ASSP (application-specific standard product) solutions that leverage the MIPS Atlas portfolio of advanced, efficient processor IP. The partnership will focus on enabling real-time, safety-critical applications, power delivery, and compute efficiency in demanding platforms for automotive, industrial, and data center markets. Motor Control & Data Center Power Delivery are focal platforms to leverage Cyient's Analog Mixed Signal capabilities and MIPS Atlas CPU IP. "As compute systems scale from cloud to the edge, intelligent power delivery is emerging as a key enabler of performance and efficiency," said Suman Narayan, CEO of Cyient Semiconductors."Our collaboration with MIPS allows us to bring together embedded intelligence and advanced power architectures in custom silicon platforms built on a scalable, open foundation. Together, we are designing tomorrow's semiconductors — purpose-built for a more connected and power-efficient world." "The problem of power efficiency and motor control are both real-time compute workloads for which MIPS M8500 microcontrollers are the optimal choice," said Sameer Wasson, CEO of MIPS. "Building around our best-in-class real-time and control-loop performance and efficiency, Cyient can bring their unique capability in intelligent power delivery into custom ASIC and ASSP designs to build differentiated solutions that meet our customers unique needs in their target markets." Demand for software defined vehicles, data center infrastructure, and industrial automation is driving growth for custom silicon. Customers can build advanced, differentiated solutions that are easy to program using MIPS advanced processor IP, based on the open RISC-V instruction set architecture, combined with Cyient intelligent power and mixed-signal design expertise. Targeted applications include motor drive control, intelligent power management, power delivery management, and safety-critical applications, offered as ASSP or ASIC platforms. OEMs and system integrators will benefit from faster time-to-market, avoiding proprietary lock-ins, and optimized platform cost. About MIPS MIPS is the leading provider of compute subsystems for autonomous platforms in automotive, industrial, and embedded markets. With a 40-year heritage in RISC computing innovation and safety capable processing, MIPS is uniquely positioned to simplify the adoption of Physical AI in industrial robotics and automotive applications. MIPS pioneering patented technology is based on the open specification RISC-V instruction set architecture, enabling customers to move beyond proprietary legacy architecture lock-ins. For more information, please visit Cyient Semiconductors, a Cyient Group company, delivers high-performance, power-efficient silicon solutions across analog, mixed-signal, RF, and digital domains. Serving HPC, data centres, industrial automation, communications, automotive, and healthcare sectors, it supports the full chip lifecycle—from architecture to production—through both turnkey and design service models. The company works closely with leading semiconductor firms, OEMs, Tier-1s, and global partners across fabrication, OSAT, and IP to enable scalable, future-ready silicon innovation.
Business Standard
12-06-2025
- Automotive
- Business Standard
Cyient Semiconductors announces strategic collaboration with MIPS
To leverage Cyient's Analog Mixed Signal capabilities and MIPS Atlas CPU IP for motor control and data center power delivery Cyient Semiconductors, a fast-growing custom silicon company based in Hyderabad, and MIPS, a global leader in RISC-V processor IP, today announced a strategic collaboration to develop domain-optimized ASIC (application-specific integrated circuit) and ASSP (application-specific standard product) solutions that leverage the MIPS Atlas portfolio of advanced, efficient processor IP. The partnership will focus on enabling real-time, safety-critical applications, power delivery, and compute efficiency in demanding platforms for automotive, industrial, and data center markets. Motor Control & Data Center Power Delivery are focal platforms to leverage Cyient's Analog Mixed Signal capabilities and MIPS Atlas CPU IP. As compute systems scale from cloud to the edge, intelligent power delivery is emerging as a key enabler of performance and efficiency, said Suman Narayan, CEO of Cyient Semiconductors. Our collaboration with MIPS allows us to bring together embedded intelligence and advanced power architectures in custom silicon platforms built on a scalable, open foundation. Together, we are designing tomorrow's semiconductors purpose-built for a more connected and power-efficient world. Demand for software defined vehicles, data center infrastructure, and industrial automation is driving growth for custom silicon. Customers can build advanced, differentiated solutions that are easy to program using MIPS advanced processor IP, based on the open RISC-V instruction set architecture, combined with Cyient intelligent power and mixed-signal design expertise. Targeted applications include motor drive control, intelligent power management, power delivery management, and safety-critical applications, offered as ASSP or ASIC platforms. OEMs and system integrators will benefit from faster time-to-market, avoiding proprietary lock-ins, and optimized platform cost.
