Latest news with #WiZhejia
Yahoo
08-05-2025
- Business
- Yahoo
Customers Are Lining Up for 2nm TSMC N2 Chips
A battle for customers is brewing between Intel and TSMC as the silicon giants prepare for mass production of their next-gen chips. TSMC has the advantage of already being further ahead in developing its N2, 2nm-class node. It started taking orders in April, with Apple likely being its first major customer. But Intel recently hit the risk reduction milestone in its own journey to produce the sub-2nm 18A node, meaning customers have two very solid, high-density processes to choose from for the next couple of years. For its part, TSMC appears to be facing even greater demand for N2 than the company saw for its beloved N3 process, according to the China Times, which comes via Wccftech. According to the China Times, the high demand was confirmed by TSMC Chairman Wi Zhejia, who described it as 'unprecedented.' You'd expect a company to toot its own horn, but in this case, it appears very likely that both chip giants are seeing massive demand. TSMC didn't provide details of the N2 node's defect density rate but said that it's lower than comparable current devices. As Wccftech notes, the defect density rate is likely on par with those of TSMC's older 3nm and 5nm processes. That's a strong selling point for TSMC's process, which is expected to sell its wafers for about $30,000 each. TSMC research and development. Credit: TSMC TSMC has multiple fabs earmarked for its N2 process, though not all are going online at the same time. The first fab to produce the node is Fab 20, near Baoshan, Taiwan, which should be ramping up heavily by the last quarter of this year. Kaohsiung is next, with production expected in early 2026. TSMC also appears to have plans for N2 production in Arizona at Fab 21, but that will come later. Prices will likely be higher for the wafers produced in the US, considering that TSMC charges more for its current US 4nm node, but with US tariffs possible, TSMC's Arizona facility could end up helping US customers. Intel, meanwhile, has a new CEO, a refreshed brand, and a sub-2nm-class node. Broadcom and Nvidia are among those believed to have an interest in chips from the new process. Foundries rarely share specific information about customers, but it seems likely that many big names will take a look at Intel's new node, even as TSMC gobbles up customer orders. For one thing, customers who don't make it to the front of the line for TSMC may eyeball Intel as it ramps up. For another, Intel's 18A includes PowerVia, its backside power delivery network (BPDN). Both TSMC and Intel's latest-gen CPUs have gate-all-around (GAA) transistors for better performance and efficiency, but TSMC didn't put its upcoming BPDN on its N2. That gives Intel an accomplishment to point to, at least until the next generation nodes ramp up.
Yahoo
24-03-2025
- Business
- Yahoo
TSMC Readies for Flood of 2nm Orders in April
With both Intel and TSMC bringing their 2nm/sub-2nm nodes toward mass production, 2025 is set to be a year of fierce competition. Intel appears to be on pace with its plans to ramp up production of its sub-2nm 18A process later this year. TSMC, which has been firing on all cylinders while Intel struggled in recent years, starts taking orders April 1, according to a report in the China Times (via Wccftech). Apple, which has already worked with TSMC for iPhone chips, is apparently first in line for TSMC's new process, which isn't surprising. TSMC is reportedly shooting for 50,000 wafers per month (on the 2nm process) by the end of 2025. That puts it well ahead of Intel as far as 2nm production goes and likely gives TSMC a significant advantage in attracting customers. Although Apple appears to be the first customer, other major buyers are lining up. China Times points to AMD, Broadcom, AWS, and even Intel as potential customers for TSMC's 2nm process. The report also pointed out that TSMC chairman Wi Zhejia has indicated that demand for TSMC's 2nm process is outpacing TSMC's wildly popular 3nm process. Apple iPhone 16. Credit: Apple One issue that could play a role in the competition between Intel and TSMC is tariffs. Although the current administration hasn't employed semiconductor tariffs yet, it seems to have plans for tariffs in the future. Intel's fabs are in the US, while TSMC has a fledgling fab in Arizona and produces the bulk of its chips in Taiwan. It's not clear yet how (or even whether) tariffs will come into play, but it's likely something that TSMC is monitoring. The company also recently got the green light from Taiwan to produce its newest-generation tech abroad, which may prove crucial if tariffs come down on TSMC. Apple will likely use TSMC's 3nm technology for the upcoming iPhone 17. We hope to see that line arrive this fall with chips built using TSMC's N3P process, though official details haven't come out yet. That means you'll have to wait through one more iteration of the iPhone before getting your hands on one with Apple's A20 chips. The iPhone 18 is likely to have technology based on the 3nm process; the iPhone 18 Pro seems the most likely candidate to see the 2nm tech first.
