Latest news with #Xeon
Yahoo
04-07-2025
- Business
- Yahoo
Super Micro Computer's BigTwin Server Achieves Industry-First Intel Immersion Cooling Certification
Super Micro Computer Inc. (NASDAQ:SMCI) is one of the best NASDAQ growth stocks to buy for the next 3 years. On July 1, Super Micro Computer announced an industry-first: its BigTwin Multi-Node Server, which is equipped with 4th and 5th Gen Intel Xeon Scalable Processors, has been certified by Intel for immersion cooling. This certification follows quality and performance testing of the Supermicro server in combination with a specified liquid and immersion tank. Additionally, the Supermicro BigTwin system successfully passed thorough testing aligned with the Open Compute Project/OCP specification for material compatibility in immersion cooling. Supermicro's immersion-certified servers aim to lower Power Usage Effectiveness/PUE by eliminating the need for traditional air-based cooling. By submerging high-density and fanless servers directly in dielectric fluid, heat dissipates more efficiently than with air, which reduces the energy required for cooling units like CRAC and CRAH. A team of technicians in a server room, testing and managing the newest server solutions. This approach allows for denser compute configurations without increasing thermal load and reduces overall IT equipment power consumption by removing internal server fans. Data centers using Supermicro immersion servers are capable of achieving PUE values near 1.05 or lower. The certified system specifically tested was the BigTwin SuperServer SYS-221BT-HNTR. Super Micro Computer Inc. (NASDAQ:SMCI) develops and sells high-performance server and storage solutions based on modular and open architecture in the US, Europe, Asia, and internationally. While we acknowledge the potential of SMCI as an investment, we believe certain AI stocks offer greater upside potential and carry less downside risk. If you're looking for an extremely undervalued AI stock that also stands to benefit significantly from Trump-era tariffs and the onshoring trend, see our free report on the . READ NEXT: and . Disclosure: None. This article is originally published at Insider Monkey.
Yahoo
01-07-2025
- Yahoo
Intel's next-gen Nova Lake CPUs rumoured to take on AMD's X3D CPUs at last thanks to gaming-friendly cache memory tile
When you buy through links on our articles, Future and its syndication partners may earn a commission. AMD launched its first X3D CPU with 3D V-Cache back in April 2022 in the Ryzen 7 5800X3D. Since then, AMD's X3D chips have pretty much been the weapon of choice for well-funded gamers. Where, you might ask, for art thou, Intel? According to the latest rumour, it might finally have an answer to X3D when it launches its next-gen Nova Lake CPUs in 2026, or perhaps early 2027. X user Haze2K1 has posted some specifications of purported Nova Lake CPU models and one detail stands out (via Club386). Along with listing core counts and TDP, both CPU models allegedly get something called "bLLC". That, supposedly, refers to something known as big Last Line Cache. And it's very much analogous to AMD's 3D V-Cache. Indeed, we know for sure Intel has such a technology, because it's incorporated in the new Clearwater Forest generation of Xeon server CPUs. But Intel has previously said it has no immediate plans to bring that technology to the desktop. The specifics of bLLC, at least as it pertains to that Xeon chip, entails what Intel calls Local Cache integrated into the base tile. The base tile is a chiplet in a modern Intel CPU package that sits beneath the active tiles, largely serving as an interconnect. At least, that's it's job in multi-die CPUs available today from Intel such as Lunar Lake and Arrow Lake. By adding cache to the base tile, Intel would end up with a similar broad approach to AMD's latest X3D CPUs. AMD's first two generations of X3D chips had the V-Cache attached to the top of the CPU dies, which was not optimal for thermal performance and therefore clock speed. However, for its third generation X3D CPUs, including the Ryzen 7 9800X3D, the V-Cache was moved below the CPU chiplets, essentially banishing the clock speed disadvantage of previous X3D CPU models and turning the latest generation into absolute gaming beasts. But before we all assume Intel's Nova Lake CPUs will therefore be killer for gaming, simply adding cache memory isn't a guarantee of better frame rates. The whole point of cache memory is to improve memory latency by reducing the need to go out over the main memory bus to the system RAM. And that, in turn, improves performance, especially in games. But for that cache to be really effective, it has to offer very low latency itself, which isn't a given. AMD's memory bus and cache architecture is highly optimised for low latency, but it's yet to be seen if Nova Lake will match AMD by that measure. AMD's has a super fast point-to-point internal interconnect for its CPUs, while Intel currently uses a ring bus to connect cores, graphics and higer-level cache memory. That ring interconnect is generally slower and suffers higher latency. By some measures, that gives Intel's Arrow Lake 512 GB/s of internal bandwidth to the 2.5 TB/s of AMD's equivalent technology. Anyway, the point is that Intel will need to do more than merely stuff some cache into the base tile to match the impact of AMD's 3D V-Cache in games. In other words, watch this space.
Yahoo
17-06-2025
- Business
- Yahoo
AMD Transforms Into Fierce Competition for Intel in Data Centers
AMD is heavily pressuring Intel in the server CPU market, thanks to the guidance of AMD Chair and CEO Dr. Lisa Su. As Wccftech notes, the company has gone from having no server CPU market share in 2017 to approaching 40% this year. AMD could be on track to hit 50% market share in fewer than 10 years from entering the space. That's a shocking success on AMD's part, and although there are many reasons for its success, a few stand out. The most obvious source of AMD's success in challenging Intel for data center CPU share is Su. As the company's chair and CEO, Su oversaw multiple successes for AMD, including the rise of its Epyc CPUs, which challenged Intel's Xeon processors. Writing for ExtremeTech in 2019, Joel Hruska noted that Epyc processors were better-positioned to gain market share than AMD's previous major challenge to Intel in this segment. Credit: AMD 'In 2005, AMD's dual cores matched Intel on core count, outperformed Intel clock-for-clock and core-for-core, and were quite expensive,' Hruska wrote. In 2019, AMD went for the trifecta, with higher performance, more cores, and lower per-core pricing. It's the most serious assault on Intel's high-end Xeon market that the company has ever launched.' As AMD continued to produce successful Epyc processors and related products (such as its Instinct GPUs), its market share surged. According to DigiTimes Asia, AMD snagged 25% of the server processor segment by 2023. Now, with its segment market share at 39.4%, the chance to break even with Intel—and possibly overtake it—is in sight. Obviously, AMD's success in the server CPU segment is resulting in massive revenue. In the first quarter of 2025 alone, AMD's data center segment brought in $3.7 billion, which marked a 57% year-over-year increase. In its quarterly report, AMD attributed that growth to its Epyc and Instinct sales. Credit: Intel Intel has struggled during this time. Its former CEO, Pat Gelsinger, focused heavily on rebuilding the company's chip manufacturing capabilities, but his tenure came to an end in late 2024. Still, Intel is addressing AMD's gains. Early this year, it dropped the prices on its Xeon 6 CPUs by as much as 30%. The move kept many Xeons priced above AMD's CPUs, but made them more competitive. And the arrival of Intel's new CEO, Lip-Bu Tan, could mark a turning point for the chipmaker. But with AMD's sustained momentum in the CPU server segment, Intel will need to move quickly.
Yahoo
31-05-2025
- Business
- Yahoo
Intel experimenting with direct liquid cooling for up to 1000W CPUs
When you buy through links on our articles, Future and its syndication partners may earn a commission. Intel is testing a new way to tackle the growing heat output of its power hungry chips. At its recent Foundry Direct Connect event, the company showcased an experimental package-level water cooling solution designed to more efficiently cool CPUs . Intel has working prototypes for both LGA (Land Grid Array) and BGA (Ball Grid Array) CPUs, with demos using Intel's Core Ultra as well as Xeon server processors. The cooling solution doesn't apply coolant directly to the silicon die. Instead, a specially designed compact cooling block sits atop the package, featuring microchannels made of copper that precisely guide the coolant flow. These channels can be optimized to target specific hotspots on the die, potentially improving heat removal where it matters the most. Intel claims the system can dissipate up to 1,000 watts of heat using standard liquid cooling fluid. That kind of thermal load isn't typical for consumer CPUs, but it could be relevant for high-end AI (Artificial Intelligence) workloads, HPC (High Performance Computing), and workstation applications. Image 1 of 9 Image 2 of 9 Image 3 of 9 Image 4 of 9 Image 5 of 9 Image 6 of 9 Image 7 of 9 Image 8 of 9 Image 9 of 9 The cooling assembly is also said to make use of solder or liquid metal TIM (Thermal Interface Material), which is said to offer better contact than polymer based TIM. Compared to a traditional liquid cooler mounted to a delidded bare die, Intel says this solution can deliver 15–20% better thermal performance. Notably, Intel's approach isn't just a lab experiment. The company has reportedly been working on this technology for years. With rising thermal demands from modern chip designs, Intel is now exploring how to produce this system for real-world deployment. While Intel refines its prototype, the enthusiast community is already experimenting with similar concepts. YouTuber octppus recently modified the heatspreader of an Intel Core i9-14900KS, machining it into a functioning miniature water block. With internal channels carved into the IHS (Integrated Heat Spreader) and sealed under acrylic, the mod somewhat mirrors Intel's concept in DIY fashion. Intel hasn't confirmed when or if this cooling approach will hit mainstream products, but the demonstration is critical for CPU thermal design. As power consumption and package density increase, direct cooling may become a necessity for both professional and enthusiast hardware in the coming future. Follow Tom's Hardware on Google News to get our up-to-date news, analysis, and reviews in your feeds. Make sure to click the Follow button.
Yahoo
29-05-2025
- Business
- Yahoo
Intel LGA9324 leak reveals colossal CPU socket with 9,324 pins for up to 700W Diamond Rapids Xeons
When you buy through links on our articles, Future and its syndication partners may earn a commission. An alleged picture of the socket that is expected to host Intel's next-generation Diamond Rapids (Xeon seventhgeneration) family of server CPUs has emerged, as spotted by HXL on X. The LGA9324 socket reportedly carries over 10,000 pins, once you consider debug pins and the like. This will likely be the largest LGA CPU socket yet, unless future Venice offerings from AMD exceed this amount. Last August, test tool listings for partners indicated that Intel's future Diamond Rapids processors will reportedly require a new Oak Stream platform with its LGA9324 socket. Under the Xeon 7 family, these CPUs are expected to supersede existing Granite Rapids offerings, across AP (Advanced Performance) Xeon 6900P and SP (Scalable Performance) Xeon 6700P/6500P offerings. Prototype cooler designs from Dynatron suggest Intel will fragment Diamond Rapids into AP and SP flavors, and so we might see a toned-down socket under the Oak Stream family for Diamond Rapids-SP. Currently, Intel's largest socket, LGA7529, features at least 7,529 contacts, while AMD's SP5 offers 6,096. Xeon 6900P CPUs, utilizing the LGA7529 socket, offer up to 128 P-cores, support 12 DDR5 memory channels, and can reach a TDP of 500W. With a nearly 30% increase in pin-counts, expect more I/O, memory channels, increased TDPs, and even core counts. While we don't have a banana for scale, visually, this is a massive socket, dwarfing LGA1851 (used by Arrow Lake) by almost five times. The Goofish listing mentions that the model in the shared image was apparently acquired from a scrap yard and was initially part of a thermal test board. What this means is that Intel is probably validating Diamond Rapids as we speak with their partners, and who knows if benchmarks or even an actual CPU sample surfaces soon? Diamond Rapids is expected to leverage the Panther Cove-X architecture, which is believed to serve as a server analogue to Coyote Cove on Nova Lake. Rumored to be built using 18A, the launch of Diamond Rapids hinges greatly on its High Volume Manufacturing (HVM) readiness, with Panther Lake targeting HVM by late 2025. This isn't an apples-to-apples comparison since Panther Lake's Compute Tile (Likely 18A) is expected to span between 100-150mm^2, while Compute Tiles on Intel's Xeon processors can be as large as 600mm^2. Even though Intel hasn't confirmed an exact release window for Diamond Rapids, we can expect these CPUs to arrive sometime in 2026, rivaling AMD's Venice. Follow Tom's Hardware on Google News to get our up-to-date news, analysis, and reviews in your feeds. Make sure to click the Follow button.
