Latest news with #advancedpackaging
Yahoo
06-08-2025
- Business
- Yahoo
Adeia Wins Best of Show Award at FMS: The Future of Memory and Storage Conference
SAN JOSE, Calif., Aug. 06, 2025 (GLOBE NEWSWIRE) -- Adeia Inc., a leading innovator in semiconductor 3D integration and advanced packaging technologies, is proud to announce that it has been presented with the 'Most Innovative Technology' award, which is a 'Best of Show' award – one of the highest honors recognizing outstanding achievement and innovation – at FMS: the Future of Memory and Storage. FMS is recognized as the world's foremost conference highlighting the key advancements, trends, and industry figures shaping the multi-billion-dollar high-speed memory, storage, and SSD markets. This esteemed recognition highlights Adeia's commitment to excellence and innovation in hybrid bonding and advanced interconnect solutions. The 'Most Innovative Technology' award is given to the most outstanding innovation showcased at FMS. Adeia received this honor for its groundbreaking hybrid bonding technology enabling 3D integration of electronic systems with improved interconnect density, speed, power efficiency, and reliability in NAND, DRAM and logic products. This novel, scalable interconnect technology is fueling leading semiconductor roadmaps. 'Vertical stacking has become an innovative architectural technique leading to the creation of 3D NAND and 3D DRAM technologies and has significantly increased storage capacity within the same footprint for applications such as AI workloads requiring high performance and vast amounts of data storage in a small footprint,' said Jay Kramer, Chair of the Awards Program and President of Network Storage Advisors Inc. 'We are proud to recognize Adeia's hybrid bonding technology, an enabler for greater interconnect density, speed, power efficiency and enhanced reliability in NAND, DRAM and logic products. Adeia hybrid bonding helps overcome the "memory wall" by providing faster and more efficient data transfer between the processor and memory.' 'We are honored to receive the 'Most Innovative Technology' award at FMS,' said Dana Escobar, Chief Licensing Officer and General Manager, Semiconductor at Adeia. 'This award is a testament to the incredible work of our team and Adeia's commitment to solving important integration challenges for our customers. Hybrid bonding is more than a novel technology – it's a foundation for the next era of memory and logic performance.' Adeia's die-to-wafer and wafer-to-wafer hybrid bonding technology supports submicron interconnect pitch, unlocking the full potential of chiplet architectures and heterogeneous integration. Memory and logic can now be contiguously integrated, reducing latency, increasing bandwidth, and improving power efficiency in applications including AI workloads of sorting, high performance computing, and edge compute for datacenter, mobile, and automotive. Held annually in August in the heart of Silicon Valley, FMS: the Future of Memory and Storage is the premier memory and storage event attracting top professionals, innovators, and companies from around the world. For more information about FMS, please visit For more information about Adeia and its award-winning hybrid bonding technology, please visit About Adeia Adeia is a leading R&D and intellectual property (IP) licensing company that accelerates the adoption of innovative technologies in the media and semiconductor industries. Adeia's fundamental innovations underpin technology solutions that are shaping and elevating the future of digital entertainment and electronics. Adeia's IP portfolios power the connected devices that touch the lives of millions of people around the world every day as they live, work and play. For more, please visit About FMS: the Future of Memory and StorageFMS: the Future of Memory and Storage, produced by Conference ConCepts, is the premier global event showcasing cutting-edge developments in multi-billion-dollar high-speed memory and storage technologies. As the world's largest conference and exhibition in this sector, FMS highlights mainstream applications, breakthrough innovations, key enabling technologies, and the full spectrum of players—from leading vendors to disruptive startups. This event spans critical application areas including AI, enterprise data centers, high-performance computing, mobile devices at the edge, and embedded systems. FMS serves as a dynamic hub where technology professionals, executive leaders, customers, cloud providers, hyperscaler companies, and industry analysts converge to explore the evolving landscape of memory and storage. With a renewed commitment to inclusivity and innovation, FMS is shaping the future of storage—especially at its intersection with artificial intelligence. Adeia Investor Contact:Chris ChaneyVice President, Investor RelationsIR@ FMS Contact:Michelle Suzuki, Public Relations & Analysts for FMSmichelle@ +1 310.444.7115Sign in to access your portfolio
Globe and Mail
16-07-2025
- Business
- Globe and Mail
Advanced AI Chip Demand Likely to Aid Taiwan Semiconductor's Q2 Sales
Taiwan Semiconductor Manufacturing Company Ltd. TSM is scheduled to release its second-quarter 2025 earnings on July 17. The company's sustained focus on advanced semiconductor technologies and the growing demand for artificial intelligence (AI) chips across multiple industries positions it for robust financial results. Click here to know how TSM's overall second-quarter results are likely to be. Advanced Node Demand Powers TSM's Revenue Growth For the second quarter, Taiwan Semiconductor has projected revenues between $28.4 billion and $29.2 billion, implying a year-over-year increase of 38.3% at the midpoint. The Zacks Consensus Estimate for the top line is pegged at $30.04 billion, indicating year-over-year growth of 44.3%. The increasing use of AI in cloud services, personal electronics and data centers has led to a sharp rise in demand for high-performance chips. Taiwan Semiconductor, the world's largest contract chipmaker, is benefiting directly from this shift. Its lead in advanced chipmaking technologies, especially the 3-nanometer (nm) and 5-nm nodes, is likely to have played a big role in boosting revenues during the to-be-reported quarter. Taiwan Semiconductor has been witnessing strong demand for its AI-focused products, including Chip-on-Wafer-on-Substrate advanced packaging solutions. This segment has seen consistent demand exceeding supply, reflecting the company's critical role in powering AI and high-performance computing applications. Global Expansion and Energy Costs to Pressure TSM's Margins Rising operational costs, especially from its overseas expansion into Arizona, Japan and Germany, are likely to have hurt Taiwan Semiconductor's gross margin in the to-be-reported quarter. These new facilities, which are strategically important for diversification, are expected to reduce gross margins by 2-3% annually over the next three to five years due to higher labor and utility costs, coupled with lower initial utilization rates. Higher energy prices in Taiwan, following a 25% electricity hike in 2024, pose additional challenges, especially as advanced nodes demand greater power. Despite the prevailing challenges, analysts remain optimistic about TSM's bottom-line growth in the to-be-reported quarter. The Zacks Consensus Estimate for Taiwan Semiconductor's second-quarter earnings has been revised upward by 5 cents to $2.37 per share, indicating year-over-year growth of 60.1%. (Find the latest EPS estimates and surprises on Zacks Earnings Calendar.) TSM's Zacks Rank & Other Stocks to Consider Currently, Taiwan Semiconductor carries a Zacks Rank #2 (Buy). Some other top-ranked stocks worth considering in the broader Zacks Computer and Technology sector are Micron Technology MU, Intel INTC and STMicroelectronics STM, each carrying a Zacks Rank #2 at present. You can see the complete list of today's Zacks #1 Rank (Strong Buy) stocks here. The Zacks Consensus Estimate for Micron Technology's fiscal 2025 earnings has been revised upward by 12.1% to $7.77 per share in the past 30 days, suggesting an increase of 497.7% from fiscal 2024's reported figure. Micron Technology shares have rallied 42.7% year to date (YTD). The Zacks Consensus Estimate for Intel's 2025 earnings has moved downward by a penny to 28 cents per share in the past 30 days, implying a robust improvement from 2024's loss of 13 cents per share. Intel shares have risen 14.3% YTD. The Zacks Consensus Estimate for STMicroelectronics' full-year 2025 earnings has been revised upward by a penny to 81 cents per share over the past seven days and suggests a year-over-year decline of 51.2%. STMicroelectronics shares have soared 26.2% YTD. Only $1 to See All Zacks' Buys and Sells We're not kidding. Several years ago, we shocked our members by offering them 30-day access to all our picks for the total sum of only $1. No obligation to spend another cent. Thousands have taken advantage of this opportunity. Thousands did not - they thought there must be a catch. Yes, we do have a reason. We want you to get acquainted with our portfolio services like Surprise Trader, Stocks Under $10, Technology Innovators, and more, that closed 256 positions with double- and triple-digit gains in 2024 alone. See Stocks Now >> Want the latest recommendations from Zacks Investment Research? Today, you can download 7 Best Stocks for the Next 30 Days. Click to get this free report Intel Corporation (INTC): Free Stock Analysis Report STMicroelectronics N.V. (STM): Free Stock Analysis Report Micron Technology, Inc. (MU): Free Stock Analysis Report Taiwan Semiconductor Manufacturing Company Ltd. (TSM): Free Stock Analysis Report This article originally published on Zacks Investment Research (
CNA
12-06-2025
- Business
- CNA
Besi lifts its forecast, expects higher demand for its advanced solutions
Dutch semiconductor company Besi raised its 2025 financial targets amid its investor day as it expects higher demand for its advanced packaging solutions. Besi now expects revenue between 1.5 billion euros and 1.9 billion euros ($2.19 billion), a gross margin of 64 per cent to 66 per cent, and an operating margin between 40 per cent and 55 per cent. ($1 = 0.8685 euros)
Globe and Mail
03-06-2025
- Business
- Globe and Mail
Fabrinet to Present at Rosenblatt Securities 5th Annual Technology Summit
BANGKOK, June 03, 2025 (GLOBE NEWSWIRE) -- Fabrinet (NYSE: FN), a leading provider of advanced optical packaging and precision optical, electro-mechanical and electronic manufacturing services to original equipment manufacturers of complex products, today announced that its management will present virtually at the Rosenblatt Securities 5 th Annual Technology Summit. The Fabrinet presentation is scheduled for Tuesday, June 10, 2025 at 11:00 a.m. EDT (8:00 a.m. PDT). A live webcast, as well as a replay, will be accessible at About Fabrinet Fabrinet is a leading provider of advanced optical packaging and precision optical, electro-mechanical, and electronic manufacturing services to original equipment manufacturers of complex products, such as optical communication components, modules and subsystems, automotive components, medical devices, industrial lasers and sensors. Fabrinet offers a broad range of advanced optical and electro-mechanical capabilities across the entire manufacturing process, including process design and engineering, supply chain management, manufacturing, advanced packaging, integration, final assembly and testing. Fabrinet focuses on production of high complexity products in any mix and any volume. Fabrinet maintains engineering and manufacturing resources and facilities in Thailand, the United States of America, the People's Republic of China and Israel. For more information visit:
Yahoo
20-05-2025
- Business
- Yahoo
Deca Announces Agreement with IBM to Bring High-Density Fan-Out Interposer Production to North America
IBM Bromont TEMPE, Ariz., May 20, 2025 (GLOBE NEWSWIRE) -- Deca Technologies today announced the signing of an agreement with IBM to implement Deca's M-Series™ and Adaptive Patterning® technologies in IBM's advanced packaging facility in Bromont, Quebec. Through the agreement, IBM will implement a high-volume manufacturing line with a focus on Deca's M-Series Fan-out Interposer Technology (MFIT™). This collaboration builds on IBM's strategy to develop its advanced packaging capabilities. IBM Canada's plant in Bromont is one of North America's largest semiconductor assembly and test sites and has been at the forefront of packaging innovation for over five decades. Recent investments to expand the site's capabilities have positioned it as a critical hub for high-performance packaging and chiplet integration, supporting technologies like MFIT that are essential for AI, HPC, and data center applications. Deca's M-Series platform is the highest-volume fan-out packaging technology in the world, with over seven billion M-Series units shipped. MFIT builds on this proven foundation by integrating embedded bridge die for chips' last processor and memory integration delivering high-density, low-latency connections between chiplets. MFIT provides a cost-effective alternative to full silicon interposers, offering improved signal integrity, greater design flexibility, and the scalable format needed for ever-larger AI, HPC, and data center devices. This cooperation reflects the shared commitment of IBM and Deca to advance the next generation of semiconductor packaging. By combining IBM's advanced packaging capabilities with Deca's proven technology, the two companies are expanding the global supply chain for the future of high-performance chiplet integration and advanced computing systems. 'Advanced packaging and chiplet technology are critical for faster, more efficient computing solutions in the age of AI. Deca will help ensure IBM's Bromont facility remains at the forefront of these innovations, strengthening our commitment to helping our clients bring products to market faster and deliver better performance for AI and data-heavy applications,' said Scott Sikorski, Head of Business Development for Chiplets & Advanced Packaging at IBM. 'IBM's rich history in semiconductor innovation and advanced packaging makes them an ideal partner to bring MFIT to high-volume production,' said Tim Olson, Founder and CEO of Deca. 'We are thrilled to be working together to bring this advanced interposer technology to the North American ecosystem.' About Deca Technologies Deca is a leading provider of advanced-packaging technology to the semiconductor industry with M-Series™ fan-out technology and Adaptive Patterning®. Deca's first generation technologies delivered exceptional quality and reliability, leading it to become the highest volume fan-out in the industry with over seven billion devices shipped to leading smartphones around the world. With the growth of Gen 2 aimed at chiplets and heterogeneous integration, Deca's technologies are emerging as key industry standards for the future. For more information, visit Deca Media Contact: Stephanie Quinn | 480.316.8370 | squinn@ A photo accompanying this announcement is available at
