Latest news with #industrialPC
Yahoo
05-08-2025
- Automotive
- Yahoo
DFI Teams Up with Technology Partners to Deliver ESG-Driven AI Solutions and Rugged Edge Systems for Mission-Critical Applications at Automation Expo 2025
TAIPEI, Aug. 5, 2025 /PRNewswire/ -- DFI, a global leader in embedded motherboards and industrial computers, will present its latest AI-powered and application-driven embedded platforms at Automation Expo 2025 from August 11–14 at Booth E16-E17, Hall 6, Bombay Exhibition Centre, Mumbai. Engineered for mission-critical tasks and extreme environments, these innovations are tailored to the evolving needs of automation, transportation, medical, and defense industries. According to a research report, India's industrial PC market is projected to grow at a 10.1% CAGR (2020–2026), driven by automation, robotics, medical, transportation, and other Industry 4.0 applications. Aligned with India's growing automation market, DFI offers Bureau of Indian Standards (BIS)-approved industrial systems built to meet strict requirements for quality, reliability, and safety. For harsh environments, the ECX700-ADP meets IP67/69K and MIL-STD-810G standards, offering advanced connectivity and low-latency 5G—ideal for AMR deployments in Industry 4.0 environments. DFI's collaboration with industrial AI partner LivNSense takes center stage with ESG-ready, AI-powered solutions. These solutions integrate DFI's EC600-series, EC700-ASL, in-vehicle systems, and the newly launched Edge AI server with LivNSense's VICAS AI engine for real-time safety detection at the edge. Coupled with the GreenOps platform, the solutions enable smarter, safer, more sustainable operations in mining, factory safety, and beyond. DFI will also deliver high-performance platforms for tightly regulated sectors such as transportation, defense and medical. For transportation, DFI will showcase the EN50155-compliant UPS-IP300 for efficient and reliable railway operations, alongside rugged in-vehicle systems like the VC700-ASL—built to meet E-mark and ITxPT standards, and tested to MIL-STD-810G for vibration and shock resilience. Within the defense sector, DFI highlights the ultra-compact QRB812 OSM with a live scouting drone demo for commercial UAVs applications, along with the COM-HPC RPS9HC, designed for extreme field use. Across medical applications, DFI introduces IEC 60601-compliant AI servers and medical-grade panel PCs for diagnostics, monitoring, and edge-based imaging. To support diverse AI workloads, DFI will also present the EC700-ADN with DEEPX NPU for low-latency inference and hybrid x86- and ARM-based platforms X6-MTH-ORN / X6-ORN—also featured at the Taiwan Excellence Pavilion (Hall 6, I2-J2). For press release materials, photos, and videos, please download them from the cloud: About DFI Founded in 1981, DFI is a global leading provider of high-performance computing technology across multiple embedded industries. With its innovative design and premium quality management system, DFI's industrial-grade solutions enable customers to optimize their equipment and ensure high reliability, long-term life cycle, and 24/7 durability in a breadth of markets including Industrial Automation, Medical, Gaming, Transportation, Energy, Mission-Critical, and Intelligent Retail. View original content: SOURCE DFI Inc.
Yahoo
08-07-2025
- Business
- Yahoo
Advantech Unveils Next-Generation Edge AI Compute Solutions Powered by Qualcomm Snapdragon X Elite
TAIPEI, July 7, 2025 /PRNewswire/ -- Advantech is proud to introduce its latest suite of high-performance edge AI compute solutions powered by the Snapdragon® X Elite platform – the AOM-6731, AIMB-293, and SOM-6820. Built on this groundbreaking platform, these innovative products are engineered to meet the demanding requirements of modern industrial applications by delivering exceptional processing power, integrated AI acceleration with up to 45 TOPS of AI performance, and robust and lightning-fast 5G and Wi-Fi 7 connectivity into an industrial PC. The solutions powered by the Snapdragon X Elite 12-core and Snapdragon® X Plus 10-core with a leading Qualcomm Oryoton™ CPUs, reaching speeds of up to 3.4GHz. This high-performance processing not only ensures enables rapid data handling and seamless multitasking but also outperforms traditional x86 solutions—using 28% less power on average for everyday tasks, including Teams video calls, local video playback, web browsing, and Microsoft 365. Enhancing AI capabilities, these devices are integrated with Qualcomm® Hexagon™ NPU, providing up to 45 TOPS. The solutions, which contain Snapdragon X Elite platforms, are equipped with LPDDR5X memory, offering a 1.3× speed boost—from 6400MT/s to 8533MT/s—while cutting power consumption by 20% compared to standard LPDDR5. In addition, the integration of UFS 3.1 Gear 4 storage dramatically increases data transfer speeds from 1,000Mbps (PCIe Gen3 NVMe) to an impressive 16,000Mbps. For even greater durability and shock resistance, UFS 4.0 storage solutions are available, ensuring optimal performance in harsh industrial environments. For multimedia-intensive applications, the integrated Snapdragon Adreno 5th Generation VPU supports 4K60p full-duplex H.264 video encoding/decoding. Additionally, the Adreno GPU—equipped with OpenCL, OpenGL, and Microsoft DirectX 12 support—ensures superior graphics performance for vision-centric tasks. Advantech's products take connectivity to the next level with integrated Wi-Fi 7 and 5G technologies, delivering ultra-fast, low-latency network performance, ensuring uninterrupted data streaming and real-time communication even in the most demanding industrial settings. With Wi-Fi 7's multi-gigabit speeds and enhanced network reliability combined with the expansive coverage and high-speed capabilities of 5G, these solutions support data-intensive AI applications and robust remote operations. The result is a truly agile and future-ready infrastructure that optimizes real-time processing and connectivity, empowering industries to harness the full potential of edge AI in today's fast-paced digital landscape. The AI module AOM-6731, the Mini-ITX motherboard AIMB-293, and the COM Express Type 6 module SOM-6820—will be available for engineering evaluations starting in March 2025. For further details on these models, please visit Advantech website. View original content to download multimedia: SOURCE Advantech Error in retrieving data Sign in to access your portfolio Error in retrieving data Error in retrieving data Error in retrieving data Error in retrieving data
