iPhone 18 Pro, Pro Max, and Fold likely to be powered by Apple A20 using breakthrough 2nm tech

India Today

5 days ago

Apple is planning a major change in the way it builds chips for its iPhones, and the impact could be huge. In a research note with equity research firm GF Securities this week, Apple analyst Jeff Pu claimed that the iPhone 18 Pro, iPhone 18 Pro Max and Apple's first foldable phone — possibly called the iPhone 18 Fold — will all be powered by a brand-new A20 chip. What makes this chip special is that it is expected to be made using TSMC's second-generation 2nm technology, which will be the most advanced in the smartphone world when it arrives in 2026.advertisementRight now, Apple's latest iPhones use chips built on the 3nm process, like the A18 Pro in the iPhone 16 Pro. Moving to 2nm means the chip will be even smaller and more power-efficient, which could lead to better battery life and smoother performance. But the real game-changer lies in how this chip will be assembled.Apple to use new chip packaging tech for first time on iPhoneThe A20 chip won't just be powerful because of the 2nm process. Apple is also said to use a new chip packaging technique called WMCM, or Wafer-Level Multi-Chip Module. While that might sound too technical, here's a simple way to understand it:
Think of a chip as a tiny brain, and memory (RAM) as its workspace. In most phones today, these parts are connected using a small "bridge" — like a tiny road. But in this new packaging method, Apple will place the chip and memory closer together, right at the wafer level, without using that road or bridge at all.advertisementThis closer connection can help the chip work faster and use less power, especially for tasks that need quick memory access — like AI, image processing, and high-end games. It is similar to how in a kitchen, if everything you need is within reach, you work faster and more efficiently.TSMC already preparing for large-scale productionBehind the scenes, Apple's chip partner TSMC is getting ready to build these new A20 chips using WMCM, according to Pu. The company is setting up a dedicated production line and expects to start producing up to 50,000 wafers per month by late 2026. That number could more than double in 2027 as more devices adopt this tech. For your reference, a wafer is a thin, round slice of semiconductor material (usually silicon) on which thousands of tiny chips are made. Apple's move to this new packaging also shows how quickly smartphone chips are catching up with high-end computer chips used in data centres and AI servers.Foldable iPhone could become a hardware testbedInterestingly, Apple is not just limiting this new chip to the Pro models. The iPhone 18 Fold, which will be Apple's first foldable iPhone, is also expected to come with the A20 chip. This suggests Apple sees its foldable not just as a fancy new design, but also as a serious performer with cutting-edge hardware inside.advertisementOverall, this change in chip design could bring major improvements to speed, efficiency, and even heat management. For everyday users, that could mean longer battery life, faster app launches, and better handling of AI features — all without needing a bigger battery or thicker phone.However, Apple hasn't confirmed any of this officially. But, with the iPhone 18 lineup still more than a year away, these early reports already give us a hint at how Apple is planning to stay ahead in the smartphone race.