TSMC affiliate VIS may expedite production at US$8b Singapore fab
VIS may be able to push production at the new plant, which makes mature chips, to as soon as late 2026 versus the originally announced schedule of the first half of 2027, VIS Chairman Fang Leuh told reporters at a company event on Saturday in Taoyuan, Taiwan. VIS broke ground for the facility in the fourth quarter of 2024.
'Over the past few months many customers have shown greater interest in our new 300-millimeter Singapore plant due to geopolitical uncertainties,' said Fang.
VIS's new plant is a joint venture with Dutch firm NXP Semiconductors NV. While the Taiwanese company does not make the most cutting-edge AI chips, it is a key supplier in making chips for automotive and industrial use.
Both TSMC and VIS are adding capacity outside of their home turf partly due to growing concerns from global chip users over China's persistent threats to unite with self-governing, democratic Taiwan, by force if necessary. But overseas expansion has not always been smooth. TSMC recently said it is pushing back the construction of its second fab in Japan due to worsening traffic conditions in the area.
An NXP executive said last December that the two companies are working on a phase-two expansion of the facility though the plan still needs formal approval. Fang said that VIS is currently focusing on getting the first plant ready and it is not currently considering a second phase yet. The trade war and tariffs have created additional challenges, Fang added, but he still expects VIS to see business grow mildly in US dollar terms year-over-year in the second half. –BLOOMBERG
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