logo
Tadaweb raises $20 million to scale Small Data PAI and OSINT Operating System

Tadaweb raises $20 million to scale Small Data PAI and OSINT Operating System

Business Wire5 hours ago

LUXEMBOURG--(BUSINESS WIRE)-- Tadaweb has secured $20 million to scale its Small Data Operating System for publicly available information (PAI) and open-source intelligence (OSINT). The software-as-a-service (SaaS) platform is used by defence, national security, public safety, cyber threat intelligence and corporate security organisations across Europe and the U.S to boost the efficiency of analysts and investigators by reducing time to insight from days to minutes.
Accelerating PAI and OSINT analysis productivity
PAI is information found in public sources, whether in print media, online platforms, social media, public records, websites, blogs, forums, imagery, and videos. OSINT refers to the process of collecting, analysing, and disseminating publicly available data points to support decision-making. OSINT is estimated to account for between 80 and 90% of information-gathering activities carried out by law enforcement agencies and other government entities. 1
Being able to rapidly analyse PAI offers public and private sector organisations access to accurate and actionable information in markets frequently disrupted by political turmoil and economic instability. However, information overload can overwhelm even the most well-resourced organisations, making it increasingly difficult for analysts and end users to quickly surface the most valuable insights and make critical decisions.
Putting humans' tradecraft first with a Small Data approach
Small Data refers to the amount of information that a human can process, combining precision data points to get the right answer. Tadaweb augments human analysts' Small Data skills with an Operating System enhanced by AI that brings together a suite of products to integrate seamlessly with third-party web tools and APIs, ingesting data from PAI, commercially available information, and emerging sources.
While most solutions focus solely on automation and Big Data, Tadaweb flips the model, with a solution that reduces investigation time to insight from days to minutes. This problem is widely understood in the market, and thus Tadaweb is trusted and adopted by analysts of varying levels of expertise.
As a result, Tadaweb users are better equipped to meet mission-critical priorities, from reducing fraud and identifying potential threats, to minimising supply chain disruptions and mitigating financial losses. The company's customers include government agencies in defence, national security and public safety across Europe and the US, as well as private sector cyber threat intelligence and corporate security organisations.
Francois Gaspard, Chief Executive Officer and co-founder of Tadaweb, said: 'Our mission is to make the world safer by empowering the human mind with the right information at the right time. Almost everyone is looking to AI for a solution. Our focus is on transparency, not delivering another black box. We embrace AI, while ensuring our solution keeps the human in control. True impact comes from putting humans in the centre. By augmenting analysts with our Small Data Operating System, we're doing just that.'
Leading sector-focused investors join the team
Arsenal Growth and Forgepoint Capital International led the investment, with participation from existing investor Wendel. Both Jason Rottenberg, General Partner at Arsenal Growth, and Damien Henault, Managing Director at Forgepoint Capital International, will join the Tadaweb board. The capital will advance the company's momentum, supporting product development and recruiting top talent as Tadaweb continues its worldwide expansion and go-to-market across public and private sectors.
Jason Rottenberg, co-founder and General Partner at Arsenal Growth, said: 'Tadaweb has built a genuinely human-centric Operating System that is solely focused on making analysts dramatically more productive. The company is uniquely positioned to accelerate its customers' ability to harness the vast opportunities of OSINT, irrespective of their sector focus, with an ambitious team that is building an extraordinary company.'
Damien Henault, Managing Director at Forgepoint Capital International, said: 'Many players claim to help organisations with OSINT, but they offer a set of features, not a fully integrated end-to-end platform. Three things attracted us to Tadaweb and how its Operating System helps analysts be more productive: its Small Data approach combined with a unique low/no-code visual query engine, the way it prioritises the human analyst, not the data, and its hyper-focused management team committed to delivering value for its customers.'
This funding brings the total investment in Tadaweb to $40 million, following Wendel's initial backing of $18 million in 2023 and $2 million from angel investors in 2015.
Notes to editors
Sources
1 https://pmc.ncbi.nlm.nih.gov/articles/PMC9883130/
About Tadaweb
Tadaweb delivers an Operating System for PAI and OSINT that augments analysts with a Small Data approach, enabling them to reach new levels of hyper-efficiency and reducing time to insight from days to minutes. Tadaweb's platform combines technology with human intuition and expertise, focusing on transparency and ethics to reshape how organisations navigate and utilise the digital world. Founded in 2011, the company is headquartered in Luxembourg with offices in Paris and London. For more information, follow Tadaweb on LinkedIn.
About Arsenal Growth
Arsenal Growth Equity invests in growth-stage software and tech-enabled services companies. Arsenal targets businesses with $5 to $20 million in recurring revenues that serve large markets, offer innovative solutions and are led by exceptional teams committed to building enduring value. Arsenal invests in a broad range of sectors serving mission critical functions such as AI-driven platforms, vertical SaaS, supply chain/logistics, healthcare IT, cybersecurity, edtech, national security, and regtech, amongst others. For more information, follow Arsenal Growth on LinkedIn.
About Forgepoint Capital
Forgepoint Capital is a leading venture capital firm that partners with transformative cybersecurity, artificial intelligence, and infrastructure software companies protecting the digital future. With the largest sector-focused investment team, over $1 billion in AUM, and an active portfolio of 40 companies, the firm brings over 100 years of collective company-building expertise and its global Advisory Council of more than 100 industry leaders to support exceptional entrepreneurs advancing innovation globally. Founded in 2015 and headquartered in the San Francisco Bay Area and London with a presence in Madrid and Paris, Forgepoint is proud to help category-defining companies reach their market potential. For more information, follow Forgepoint on LinkedIn.
About Wendel
Wendel is one of Europe's leading listed investment firms. Regarding its principal investment strategy, the Group invests in companies which are leaders in their field, such as ACAMS, Bureau Veritas, Crisis Prevention Institute, Globeducate, IHS Towers, Scalian, Stahl and Tarkett. In 2023, Wendel initiated a strategic shift into third-party asset management of private assets, alongside its historical principal investment activities. In May 2024, Wendel completed the acquisition of a 51% stake in IK Partners, a major step in the deployment of its strategic expansion in third-party private asset management and also completed in March 2025 the acquisition of 72% of Monroe Capital. As of March 31, 2025, Wendel manages 34 billion euros on behalf of third-party investors, and c.6.3 billion euros invested in its principal investments activity.
Wendel is listed on Eurolist by Euronext Paris.
Standard & Poor's ratings: Long-term: BBB, stable outlook – Short-term: A-2
Wendel is the Founding Sponsor of Centre Pompidou-Metz. In recognition of its long-term patronage of the arts, Wendel received the distinction of 'Grand Mécène de la Culture' in 2012.
For more information:

Orange background

Try Our AI Features

Explore what Daily8 AI can do for you:

Comments

No comments yet...

Related Articles

Memory and Storage Technology Research Report 2025: AI-Driven Demand Propels Global Memory and Storage Market Toward $400 Billion by 2036
Memory and Storage Technology Research Report 2025: AI-Driven Demand Propels Global Memory and Storage Market Toward $400 Billion by 2036

Associated Press

time26 minutes ago

  • Associated Press

Memory and Storage Technology Research Report 2025: AI-Driven Demand Propels Global Memory and Storage Market Toward $400 Billion by 2036

DUBLIN--(BUSINESS WIRE)--Jun 19, 2025-- The 'The Global Memory and Storage Technology Market 2026-2036" report has been added to offering. The Global Memory and Storage Technology Market 2026-2036 provides insights into the rapidly evolving memory and storage landscape, delivering critical analysis for technology leaders, investors, and strategic decision-makers navigating the industry's transformation through 2036. The global memory and storage technology market is poised for significant expansion, projected to exceed $400 billion by 2036, driven by explosive demand from artificial intelligence, high-performance computing, and next-generation data infrastructure. After recovering from the severe cyclical downturn of 2022-2023, the industry achieved record revenues surpassing $200 billion in 2025, marking the beginning of a sustained growth trajectory fundamentally reshaped by AI workloads. High Bandwidth Memory (HBM) emerges as the market's most dynamic segment. HBM's share of the total DRAM market is expected to reach 50% by decade's end, as AI training and inference applications demand unprecedented memory bandwidth. Leading manufacturers including Samsung, SK hynix, and Micron are aggressively scaling HBM3E production, with next-generation HBM4 technology promising even greater performance gains. NAND flash technology continues evolving through 3D scaling innovations, with manufacturers pushing beyond 300 layers using advanced CMOS Bonded Array (CBA) architectures. YMTC's Xtacking 4.0 technology and the industry's transition to Penta-Level Cell (PLC) storage demonstrate the sector's relentless density improvements. Meanwhile, emerging memory technologies-including Magnetoresistive RAM (MRAM), Resistive RAM (ReRAM), and Ferroelectric RAM (FeRAM) - are gaining commercial traction, particularly in embedded applications and edge computing devices. Chinese memory manufacturers are fundamentally altering competitive dynamics, with YMTC achieving 294-layer 3D NAND production and CXMT successfully launching domestic DDR5 modules. China's memory market share continues expanding across consumer and enterprise segments, forcing global leaders to accelerate premium product development and advanced technology adoption. Despite ongoing U.S. export restrictions, Chinese companies demonstrate remarkable technological progress, with JHICC ramping capacity and new entrants like SwaySure Technology strengthening domestic supply chains. Data centers and cloud infrastructure represent the largest growth driver, consuming increasingly sophisticated storage solutions optimized for AI/ML workloads. The economic advantages of QLC SSDs over traditional HDDs in hyperscale environments are reshaping storage hierarchies, with 10PB QLC deployments delivering $30 million cost savings over traditional tiered storage architectures. Edge computing and automotive applications create additional demand vectors, as autonomous vehicles and IoT devices require high-performance, reliable memory solutions. The industry faces mounting scaling challenges as conventional planar technologies approach physical limits. 3D DRAM architectures, vertical transistor designs, and novel cell structures represent critical technological pathways beyond 2030. Advanced packaging innovations, including wafer-to-wafer bonding and chiplet integration, enable continued performance improvements while managing manufacturing complexity. Environmental sustainability increasingly influences technology development, with manufacturers investing in energy-efficient designs and circular economy initiatives. Geopolitical tensions continue reshaping global supply chains, driving regionalization trends and technology transfer restrictions that impact long-term market dynamics. The memory and storage technology market to 2036 represents a fundamental transformation driven by AI proliferation, technological breakthrough achievements, and evolving competitive landscapes. Success requires navigating complex scaling challenges while capitalizing on explosive demand from next-generation computing applications across all market segments. Report Highlights Market Forecasting and Technology Segmentation: Advanced Technology Analysis and Roadmaps: Supply Chain and Manufacturing Intelligence: Application-Specific Market Analysis: Strategic Business Intelligence: Company Intelligence and Market Positioning: Key Topics Covered: 1 EXECUTIVE SUMMARY 1.1 Report Overview and Key Findings 1.2 Market Size and Growth Projections 2026-2036 1.3 Technology Roadmap and Innovation Trends 1.4 Market Dynamics and Trade Implications 1.5 Investment and Market Outlook 2 INTRODUCTION 2.1 Global Memory and Storage Technology Landscape 2.2 Computing Architecture Evolution 2.3 End-Market Analysis 3 MARKET FORECASTS (2026-2036) 3.1 Market Projections 3.2 DRAM Market Forecast 3.3 NAND Flash and SSD Market Forecast 3.4 Hard Disk Drive (HDD) Market Forecast 3.5 Cloud and Data Center Storage Forecast 3.6 Edge Computing Storage Forecast 3.7 AI and HPC Memory/Storage Forecast 3.8 Emerging Memory Technologies Forecast 4 DRAM TECHNOLOGY ANALYSIS AND ROADMAPS 4.1 Conventional DRAM Scaling and Challenges 4.2 3D DRAM Architecture Development 4.3 CMOS Bonding and Advanced Integration 4.4 High Bandwidth Memory (HBM) Technology 5 NAND FLASH TECHNOLOGY ANALYSIS AND ROADMAPS 5.1 3D NAND Scaling and Layer Count Evolution 5.2 CMOS Bonded Array (CBA) and Xtacking Technologies 5.3 Multi-Level Cell Technology Evolution 5.4 NAND Interface and Form Factor Evolution 5.5 Advanced NAND Technologies 6 EMERGING MEMORY TECHNOLOGIES 6.1 Magnetoresistive RAM (MRAM) Technology 6.2 MRAM Applications and Market Development 6.3 Resistive RAM (ReRAM/RRAM) Technology 6.4 ReRAM Development and Applications 6.5 Ferroelectric RAM (FeRAM) Technology 6.6 Phase Change Memory (PCM) Technology 6.7 Next-Generation Memory Architectures 6.8 Emerging Memory Technology Comparison 7 SUPPLY CHAIN AND MANUFACTURING ANALYSIS 7.1 Global Supply Chain Mapping 7.2 Manufacturing Capacity and Investment 7.3 Technology Node Migration and Yield 8 REGIONAL MARKET ANALYSIS 8.1 China Memory Industry Development 8.2 Trade Restrictions and Geopolitical Impact 8.3 Regional Market Dynamics 9 APPLICATIONS 9.1 AI and Machine Learning Memory Solutions 9.2 Data Center and Cloud Storage Evolution 9.3 Automotive Memory and Storage Systems 9.4 Edge Computing and IoT Memory 9.5 Embedded Memory for Advanced Applications 10 ADVANCED PACKAGING AND INTEGRATION TECHNOLOGIES 10.1 3D Integration and Packaging Innovation 10.2 Hybrid Bonding and Advanced Assembly 10.3 Processing-in-Memory and Near-Memory Computing 11 SUSTAINABILITY AND ENVIRONMENTAL IMPACT 11.1 Memory Technology Environmental Footprint 11.2 Circular Economy and End-of-Life Management 12 PRICING ANALYSIS AND ECONOMIC MODELS 12.1 Historical and Current Pricing Trends 12.2 Cost Structure and Economics 12.3 Future Pricing Projections and Models 13 TECHNOLOGY ROADMAPS AND FUTURE DEVELOPMENTS 13.1 Long-Term Memory Technology Vision 13.2 Breakthrough Technologies and Research 13.3 System-Level Integration Evolution 14 COMPANY PROFILES (154 Company Profiles) For more information about this report visit About is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends. View source version on CONTACT: Laura Wood, Senior Press Manager [email protected] For E.S.T Office Hours Call 1-917-300-0470 For U.S./ CAN Toll Free Call 1-800-526-8630 For GMT Office Hours Call +353-1-416-8900 KEYWORD: INDUSTRY KEYWORD: TECHNOLOGY DATA MANAGEMENT OTHER TECHNOLOGY SOURCE: Research and Markets Copyright Business Wire 2025. PUB: 06/19/2025 07:43 AM/DISC: 06/19/2025 07:42 AM

Hammerspace Now Available on Oracle Cloud Marketplace
Hammerspace Now Available on Oracle Cloud Marketplace

Business Wire

time26 minutes ago

  • Business Wire

Hammerspace Now Available on Oracle Cloud Marketplace

SAN MATEO, Calif.--(BUSINESS WIRE)--Hammerspace, the standards-based data platform that simplifies AI infrastructure and an Oracle partner, today announced its solution is available on the Oracle Cloud Marketplace and can be deployed on Oracle Cloud Infrastructure (OCI). Oracle Cloud Marketplace is a centralized repository of enterprise applications offered by Oracle and Oracle partners. With the Hammerspace Tier 0 solution, enterprises can transform existing local NVMe storage into ultra-fast, persistent shared storage inside OCI GPU virtual machines (VMs), eliminating the need for replication and avoiding delays or compromises. Hammerspace helps enable enterprises to leverage the full potential of existing GPU server capacity in hybrid cloud, multi-cloud and geographically distributed environments by providing a high-performance global namespace that spans sites, clouds and storage systems. It allows data to be sourced from on-premises storage and delivered directly to GPU resources in OCI at maximum speeds. With the Hammerspace Tier 0 solution, enterprises can transform existing local NVMe storage into ultra-fast, persistent shared storage inside OCI GPU virtual machines (VMs), eliminating the need for replication and avoiding delays or compromises. The Tier 0 solution enables enterprises to feed thousands of GPUs in parallel, reducing idle cycles and supporting low-latency data access for both reads and writes. This capability accommodates a wide variety of workloads, including training, inference and high-performance computing. In recent OCI performance benchmarks, the Hammerspace Tier 0 solution delivered 2.5X faster read bandwidth, 2X higher write throughput, and 51 percent lower latency when compared to the same client servers connected to external networked storage running on OCI. These results were achieved using OCI bare metal shapes, with zero custom software or hardware, leveraging the Hammerspace Tier 0 solution, which utilizes low-latency NVMe storage local to OCI GPU VM shapes. 'We are excited about adding Hammerspace's high-performance Data Platform to the Oracle Cloud Marketplace,' said Cameron Bahar, SVP and GM, OCI. 'The Hammerspace Tier 0 solution will help OCI joint customers to optimize file system performance for their GPU-based HPC and AI workloads.' 'OCI's leadership in performance, price, and GPU availability makes this a critical partnership for us,' said David Flynn, founder and CEO of Hammerspace. 'Enterprise AI needs more than raw compute — it needs data delivered with zero friction. Hammerspace Tier 0 transforms local NVMe storage into a shared, global, high-performance data plane that our customers are using right now to power the next generation of AI in OCI. Hammerspace's participation in Oracle Cloud Marketplace further extends our commitment to the Oracle community and enables customers to easily reap the benefits of reduced storage costs, lower power consumption and increased GPU utilization.' Oracle Cloud Marketplace is a one-stop shop for Oracle customers seeking trusted business applications and services that offer unique solutions. Designed to run any application faster and more securely for less, OCI can help address a variety of data privacy, sovereign AI, and low latency requirements. It is the only hyperscaler capable of delivering 200+ AI and cloud services at the edge, in a customer's data center, across clouds, or in the public cloud. Oracle's distributed cloud delivers the benefits of the cloud with greater control and flexibility while also providing the consistent performance, Service Level Agreements (SLAs) and global pricing, for which OCI has become known. About Hammerspace Hammerspace is a high-performance data platform built to simplify AI infrastructure at scale. It makes all your data immediately accessible, anywhere — across on-prem and cloud environments — without copying or migrating data. Hammerspace integrates with your existing storage, networking, and applications to create a unified, high-speed data backbone for AI, accelerating every stage of the AI pipeline while eliminating data silos. Learn more at About Oracle's Partner Program Oracle's partner program helps Oracle and its partners drive joint customer success and business momentum. The newly enhanced program provides partners with choice and flexibility, offering several program pathways and a robust range of foundational benefits spanning training and enablement, go-to-market collaboration, technical accelerators, and success support. To learn more, visit Trademark Oracle, Java, MySQL and NetSuite are registered trademarks of Oracle Corporation. NetSuite was the first cloud company — ushering in the new era of cloud computing.

Advanced Semiconductor Packaging Market Research Report 2025-2035: Technological Innovations are Reshaping the Semiconductor Landscape Beyond Traditional Moore's Law Scaling
Advanced Semiconductor Packaging Market Research Report 2025-2035: Technological Innovations are Reshaping the Semiconductor Landscape Beyond Traditional Moore's Law Scaling

Associated Press

time26 minutes ago

  • Associated Press

Advanced Semiconductor Packaging Market Research Report 2025-2035: Technological Innovations are Reshaping the Semiconductor Landscape Beyond Traditional Moore's Law Scaling

DUBLIN--(BUSINESS WIRE)--Jun 19, 2025-- The 'The Global Advanced Semiconductor Packaging Market 2025-2035" report has been added to offering. The Global Advanced Semiconductor Packaging Market 2025-2035 provides a comprehensive analysis of the rapidly evolving advanced semiconductor packaging industry, examining how technological innovations are reshaping the semiconductor landscape beyond traditional Moore's Law scaling. The report provides essential strategic intelligence for semiconductor manufacturers, packaging providers, equipment suppliers, materials companies, electronics OEMs, and investors to navigate the complex advanced packaging landscape. It identifies key innovation vectors, potential market disruptions, and strategic partnership opportunities that will shape competitive positioning through 2035. With semiconductor packaging increasingly becoming the critical enabler for next-generation electronic systems-from AI accelerators to autonomous vehicles-this report delivers the actionable insights needed to capitalize on the industry's shift from traditional monolithic approaches to heterogeneous integration and advanced packaging solutions. The advanced semiconductor packaging market is experiencing rapid growth, driven by technological demands that are pushing the industry beyond traditional Moore's Law scaling. The market's growth is underpinned by the increasing importance of packaging technologies in addressing computing demands. The telecom and infrastructure sector currently dominates the market, and the mobile and consumer segment is emerging as the fastest-growing market. 3D stack memory technologies-including HBM, 3DS, 3D NAND, and CBA DRAM-are key growth drivers. The fastest-growing platforms include CBA DRAM, 3D SoC, active silicon interposers, 3D NAND stacks, and embedded silicon bridges. These technologies are critical for meeting the increasing performance, power, and miniaturization demands of modern electronics. Heterogeneous integration and chiplet-based designs are revolutionizing semiconductor architecture. Major industry players like TSMC, Intel, AMD, and Nvidia are heavily investing in advanced packaging solutions to overcome the limitations of traditional monolithic chip designs. The adoption of hybrid bonding technologies is particularly transformative, enabling finer interconnect pitches and higher integration densities. The competitive landscape is evolving as foundries, IDMs, and OSATs vie for market share. In 2024, memory players including YMTC, Samsung, SK Hynix, and Micron. Top OSATs like ASE, SPIL, JCET, Amkor, and TF continue to provide assembly and test services while developing their high-end packaging capabilities through UHD FO and mold interposer technologies. Looking toward 2035, several trends will shape the market. The integration of chiplets using 3D SoC, 2.5D interposers, embedded silicon bridges, and co-packaged optics will create increasingly complex '3.5D' packages. Panel-level packaging is gaining traction for larger packages, offering cost advantages over wafer-level processes. Simultaneously, the industry is transitioning from micro-bump technology to bumpless hybrid bonding, enabling finer interconnect pitches necessary for advanced nodes. By application, high-performance computing, AI accelerators, data centers, and autonomous vehicles represent the fastest-growing segments. The rise of AI and cloud computing is driving demand for advanced memory packaging solutions like HBM and specialized processors requiring sophisticated heterogeneous integration. Further consolidation among suppliers is likely, with foundries and IDMs strengthening their packaging capabilities. The emergence of new players from regions like China will intensify competition, while the importance of equipment suppliers like BESI, Applied Materials, and EVG will grow with the adoption of cutting-edge bonding technologies. Report Contents include Company Profiles For more information about this report visit About is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends. View source version on CONTACT: Laura Wood, Senior Press Manager [email protected] E.S.T Office Hours Call 1-917-300-0470 For U.S./ CAN Toll Free Call 1-800-526-8630 For GMT Office Hours Call +353-1-416-8900 KEYWORD: INDUSTRY KEYWORD: TECHNOLOGY PACKAGING SEMICONDUCTOR MANUFACTURING SOURCE: Research and Markets Copyright Business Wire 2025. PUB: 06/19/2025 07:51 AM/DISC: 06/19/2025 07:51 AM

DOWNLOAD THE APP

Get Started Now: Download the App

Ready to dive into a world of global content with local flavor? Download Daily8 app today from your preferred app store and start exploring.
app-storeplay-store