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27 minutes ago
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OKI Develops Tiling crystal film bonding (CFB) Technology for Heterogeneous Integration of Optical Semiconductors onto 300 mm Silicon Wafers
- Contributing to the advancement of photonics-electronics convergence technology and working with partners for early commercialization - TOKYO, August 14, 2025--(BUSINESS WIRE)--OKI (TOKYO: 6703) has successfully developed Tiling crystal film bonding (CFB; Note 1) technology using its proprietary CFB technology. This technology makes possible the heterogeneous integration of small-diameter optical semiconductor wafers onto 300 mm silicon wafers, heretofore not possible due to wafer size restrictions, and will contribute to the advancement of rapidly growing photonics-electronics convergence technology (Note 2). OKI aims to achieve early commercialization through collaboration with partner companies and universities. Rapid advances in artificial intelligence (AI) in recent years has fueled growing demand for data centers, making it a serious social issue to suppress increases in power consumption while expanding data processing capabilities. One solution to such a challenge currently drawing attention is technologies that achieve high-density, high-speed transmission, and low power consumption, applying photonics-electronics convergence technology that combines electronic and optical circuits. In particular, the heterogeneous integration of optical semiconductors onto silicon wafers is expected to improve performance still further by enabling the integration of silicon photonics (Note 3) with optical semiconductors. Nevertheless, heterogeneous integration presents various technical challenges. For example, while silicon photonics use large-diameter 200 mm (8-inch) or 300 mm (12-inch) silicon wafers, optical semiconductor wafers such as InP (indium phosphide) wafers are typically smaller 50 mm (2-inch) to 100 mm (4-inch) compound semiconductor wafers due to the difficulty of achieving epitaxial growth. Additionally, silicon optical waveguides require nanoscale roughness control, which in turn requires heterogeneous integration processes that avoid causing damage. The Tiling CFB technology developed by OKI overcomes this disparity in wafer sizes and allows heterogeneous integration without causing damage. The technology allows for 52 repeated tiling operations over the entire surface of a 300 mm silicon wafer using a single 2-inch InP wafer, enabling efficient use of InP-based materials. The InP wafer can be reused as is after transfer to allow material recycling and reuse, helping reduce the environmental burden. Placement accuracy is approximately ±1 μm, with an angular accuracy of ±0.005°. This high accuracy, when combined with OKI's proprietary 3D intersecting waveguide (Note 4) silicon photonics technology, realizes high-efficiency optical coupling between optical semiconductors and silicon waveguides. In a demonstration, a sacrificial layer and InP-based Crystal Films functioning as optical semiconductors were epitaxially grown on a 2-inch InP wafer, then separated into individual elements. A protective structure to prevent chemical attack when etching the sacrificial layer and a support structure for batch transfer were formed on each element. This enabled the InP-based Crystal Films to be successfully batch-transferred to an intermediate transfer substrate without erosion. Batch transfer to an intermediate transfer substrate is carried out to protect the silicon wafer from damage during the subsequent removal process, as removing the protective structure and support structure on the intermediate transfer substrate prevents damage to the silicon wafer during the removal process. The unique design of the intermediate transfer substrate ensures that the InP-based Crystal Films do not peel off, maintain adhesion during the process of removing the protective structure and support structure, and are easily transferred during the transfer process. Furthermore, by repeatedly transferring Crystal Films from the intermediate transfer substrate using a CFB stamp, OKI has established Tiling CFB technology that enables tiling over the entire surface of a 300 mm silicon wafer. The CFB stamp has a structure capable of selectively transferring only the Crystal Films required, and repeated transfer enables efficient tiling. The capacity to repeatedly transfer lower-density arrays of Crystal Films required for the device from a high-density array of Crystal Films arranged on the intermediate transfer substrate allows effective use of materials without waste. Measuring 30 mm × 30 mm, the CFB stamp used in this demonstration completed 52 transfers onto the entire surface of a 300 mm silicon wafer in approximately 10 minutes, sufficient for commercial production. This demonstration proved the feasibility of Tiling CFB technology in the transfer from 2-inch wafers to 300 mm silicon wafers. The technology can also be adapted as necessary to allow use with 3- or 4-inch InP wafers and 200 mm silicon wafers. Since it can also be applied with existing optical semiconductor products, it will help improve performance by permitting transfer to high heat-dissipation substrates and productivity by allowing use of larger wafer sizes. Tiling CFB technology will also contribute to the advancement of photonics-electronics convergence technology and reduced environmental burden. OKI plans to strengthen collaboration with device manufacturers to achieve early commercialization of the technology. [Terminology] Note 1: crystal film bonding (CFB) OKI's proprietary technology commercialized in 2006 in the printer business; allows heterogeneous integration by lifting off Crystal Films such as semiconductors and bonding them directly onto different material substrates or wafers. The absence of adhesives permits electrical, optical, and thermal conduction. Note 2: Photonics-electronics convergence technology Technology combining electronic circuits (electrical signal processing) and optical circuits (optical signal processing) to achieve optimization and sophistication through integration; enables greater data transfer speeds, reduced power consumption, and increased capacity. Note 3: Silicon photonics Photonic integrated circuit technology that uses silicon as the waveguide layer; allows the integration of optical devices such as modulators, photodetectors, and optical filters and optical waveguides on silicon chips. Note 4: 3D intersecting waveguide OKI's proprietary silicon photonics technology whereby optical semiconductors and silicon optical waveguides intersecting in three-dimensional configuration increase the positional misalignment tolerance by more than tenfold compared to conventional technology, allowing high-efficiency optical coupling even with misalignment of approximately ±3 μm. Currently under development in collaboration with the Nishiyama Laboratory at Institute of Science Tokyo, this technology was presented jointly at the 72nd JSAP Spring Meeting in March 2025 (17p-K305-6, 17p-K305-7). [Related link]• CFB explanatory website: About Oki Electric Industry (OKI)Founded in 1881, OKI is Japan's leading information and telecommunication manufacturer. Headquartered in Tokyo, Japan, OKI provides top-quality products, technologies, and solutions to customers through its Public Solutions, Enterprise Solutions, Component Products, and Electronics Manufacturing Services businesses. Its various business divisions function synergistically to bring to market exciting new products and technologies that meet a wide range of customer needs in various sectors. Visit OKI's global website at Notes:- Oki Electric Industry Co., Ltd. is referred to as "OKI" in this document.- The names of the companies and products mentioned in this document are the trademarks or registered trademarks of the respective companies and organizations. View source version on Contacts Press contact: Oki Electric Industry Co., RelationsE-mail: press@ Customer contact: CFB Business Development Department, Global Marketing CenterContact Form :
Yahoo
27 minutes ago
- Yahoo
Fluent Cargo launches Global Disruption Feed
Fluent Cargo has introduced its Global Disruption Feed in response to escalating tariff volatility and record-high US seaborne container imports. The feature includes a real-time intelligence service designed to inform companies of disruptions affecting shipping routes globally. The Global Disruption Feed is an enhancement to Fluent Cargo's online platform, which offers routing, schedules, tracking, pricing, and emissions data for cargo shipments. The new feature provides timely updates, allowing shippers and freight forwarders to make informed decisions on the best shipping routes. Fluent Cargo CEO Archival Garcia said: 'With potential new tariffs creating immediate pressure to optimise supply chains and the US-China trade relationship facing renewed uncertainty, logistics managers need real-time disruption intelligence more than ever. 'Traditional monthly planning cycles simply can't handle today's volatility, whether it's trade policy changes, severe weather, or infrastructure failures.' This launch comes at a critical time as supply chain uncertainty grows due to fluctuating tariffs and traditional planning cycles struggle to keep pace with dynamic market conditions. Furthermore, the shipping industry is facing various disruptions beyond tariffs. For instance, Sydney's ports have been suspended by a 'bomb cyclone' since 1 July, with winds reaching 125km/hr. Similarly, rail closures since 4 July have disrupted connections to Hamburg's main container facilities. "Companies that can adapt their routing strategies immediately will maintain competitive advantage while others struggle with disruption. Our platform transforms how businesses respond to the unexpected, from severe climate events to port closures,' added Garcia. Fluent Cargo's Global Disruption Feed not only notifies users of disruptions but also offers severity ratings and detailed location information. This enables logistics professionals to transition from reactive crisis management to a proactive strategy to optimise their supply chain operations. The Global Disruption Feed is now available to Fluent Cargo users across the world. Furthermore, Fluent Cargo's recent partnership with market intelligence firm Xeneta in April aims to enhance freight routing and pricing decisions. As Xeneta's first partner in Australia and New Zealand, Fluent Cargo will facilitate broader access to valuable market data for companies in the region. "Fluent Cargo launches Global Disruption Feed" was originally created and published by Ship Technology, a GlobalData owned brand. The information on this site has been included in good faith for general informational purposes only. It is not intended to amount to advice on which you should rely, and we give no representation, warranty or guarantee, whether express or implied as to its accuracy or completeness. You must obtain professional or specialist advice before taking, or refraining from, any action on the basis of the content on our site. Sign in to access your portfolio
Yahoo
27 minutes ago
- Yahoo
JD.com faces battle to gain ground in China's instant delivery market
By Deborah Mary Sophia and Sophie Yu (Reuters) -Chinese e-commerce giant is going all out to build its instant-delivery business to diversify revenue, but breaking into the competitive industry is proving difficult. The company has poured billions into JD Takeaway, the food-delivery unit it launched in February, to cut reliance on a core retail business hit by a weak economy and tough competition. Its results on Thursday showed the service has lifted its user base, traffic and revenue, with both quarterly active customer growth and shopping frequency up more than 40%. But it is struggling to take market share from long-established incumbents Meituan, the industry leader, and Alibaba's Daily active users in JD's delivery business have fallen steadily since peaking in mid-June, slipping more than 13% week-on-week by July 27 versus a 6% drop and a 1% gain in the previous two weeks, M Science data showed. The data signals "a significant loss of momentum for and likely market share loss", M Science analyst Vinci Zhang said. "Meituan and Alibaba already have considerable domain expertise in food delivery, and I don't think JD has expertise in that area yet. It will be very challenging," Zhang said. food delivery investments have also squeezed profitability. Its adjusted operating margin shrank to 0.3% in the June quarter from 4% a year ago. Meituan's daily orders across food and retail goods reached an all-time high of 120 million. The company holds nearly 70% of the delivery market, Morningstar analysts said in May. Alibaba's Taobao instant commerce business combined with reached 80 million daily orders early in July, with daily active users crossing 200 million. Company executives have warned of fierce competition, with the three companies together pledging nearly 200 billion yuan ($27.87 billion) in recent months to subsidize instant delivery, sparking an "instant retail" price war that has drawn regulatory scrutiny. "The competition started to intensify since July," CEO Sandy Xu said on Thursday, adding the company was focused on improving its platform to attract more users, merchants and riders. Meituan and Alibaba are yet to report quarterly results. ($1 = 7.1773 Chinese yuan renminbi)
