
Bain Capital-backed Heartflow valued at $2.27 billion in solid Nasdaq debut
Nasdaq debut
, as the IPO market gathers momentum and outrides tariff worries.
The shares opened at $28 and went as high as $31.5, signaling robust investor appetite for companies leveraging artificial intelligence for healthcare.
Heartflow sold about 16.67 million shares at $19 each in its IPO on Thursday, raising $316.7 million.
The Bain Capital-backed company's debut comes as expectations of a softer trade policy and lower interest rates boost
investor sentiment
, which had nosedived after U.S. tariffs in April stoked recession fears.
The market sentiment reflects "nervous excitement", said Matt Kennedy, senior strategist at IPO-focused research and ETFs provider Renaissance Capital.
"We saw a spike in volatility last week, but at the same time stocks (are) flying up on AI-driven earnings blowouts."
Space tech startup Firefly Aerospace and design software firm Figma saw stellar first-day reactions in recent days, strengthening prospects for tech-focused companies to go public.
Heartflow's first-day pop could help boost market perception for other medtechs, which often rely on vast research and development expenditure, with clinical testing further pressuring the bottom line.
Beta Bionics and Kestra Medical had solid debuts earlier this year, but are now trading below their IPO price, like most medtech IPOs of the past year.
"If investors keep losing, they just won't show up and companies will struggle to raise IPO funding," Kennedy added, referring to underwhelming post-listing performance from several medtech IPOs in the past year.
Founded in 2007, Heartflow helps physicians diagnose and treat heart disease.
Its AI-enabled products can create a personalized 3D model of a patient's heart via a single specialized scan.
The company's revenue rose 39% in the quarter ended March 31 from a year ago. Its losses, however, widened 55% to $32.35 million during the same period.
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Economic Times
22 minutes ago
- Economic Times
Centre approves two semiconductor units for Odisha
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I look forward to continued partnership between the state and Central governments to further this strategic initiative for the comprehensive development of Odisha and the nation. #doubleengine," Majhi Private Limited is collaborating with Clas-SiC Wafer Fab Ltd, UK, to establish an integrated facility of Silicon Carbide (SiC) based Compound Semiconductors in Info Valley, Bhubaneshwar, project proposes to manufacture Silicon Carbide devices. This compound semiconductor fab will have an annual capacity of 60,000 wafers and packaging capacity of 96 million units. The proposed products will have applications in missiles, defence equipment, electric vehicles (EVs), railway, fast chargers, data centre racks, consumer appliances, and solar power inverters, an official statement said.3D Glass Solutions Inc (3DGS) will be setting up a vertically integrated advanced packaging and embedded glass substrate unit in Info Valley, Bhubaneshwar, Odisha. 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Time of India
22 minutes ago
- Time of India
Centre approves two semiconductor units for Odisha
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Silicon carbide is a very robust material and can sustain at high temperatures. Silicon carbide is used in our missiles, satellites, telecom towers, rockets, railway engines, etc," Vaishnaw minister said that the plant will have a capacity to produce 9.6 crore chips per Cabinet also approved US chip major Intel-backed 3D Glass semiconductor manufacturing unit in Odisha with an investment of Rs 1,943 crore. The plant will be set up by Heterogenous Integration Packaging Solutions Pvt Ltd with an annual production capacity of 5 crore units."I sincerely express my gratitude to Hon'ble Prime Minister Shri @narendramodi ji and Hon'ble Union Minister Shri @AshwiniVaishnaw ji for the Central Cabinet's approval of the establishment of two semiconductor manufacturing units in Odisha," Majhi said in a post on chief minister said the recent amendment of the Odisha Semiconductor Manufacturing and Fabless Policy, aimed at enhancing investment viability, competitiveness, and sustainability, together with this significant Cabinet approval, marks a major milestone in the state's industrial and technological advancement."This collaborative effort will accelerate innovation, generate employment, and strengthen Odisha's position as a vital contributor towards the vision of #AtmanirbharBharat. 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This unit will bring the world's most advanced packaging technology to India. Advanced packaging brings the next generation of efficiency to semiconductor industry, the statement facility will have a large variety of advanced technologies, including glass interposers with passives and silicon bridges, and 3D Heterogeneous Integration (3DHI) capacity of this unit will be approximately 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules per annum. The proposed products will have significant applications in defence, high-performance computing, artificial intelligence, RF and automotive, photonics and co-packaged optics and leader Mishra said the process of setting up semiconductor units in Odisha was initiated under the leadership of former Chief Minister Naveen Patnaik during the BJD government. "The recent decision by the Union Cabinet to establish two semiconductor units in Odisha is rooted in the initiatives undertaken during the BJD regime," he said that investors interested in establishing a semiconductor industry in the state was cultivated during the 2nd edition of the Make in Odisha conclave held in December 2022, where several proposals were received. Accordingly, a dedicated policy for the semiconductor sector and its supporting ecosystem was formulated in 2023, he BJD leader said that discussions were held with multiple international investors to attract investment in this sector, and efforts began to establish the necessary ecosystem to develop Odisha as a cutting-edge electronics manufacturing hub.


News18
32 minutes ago
- News18
Xi Leveraging Tehran-Beijing Ties? Chinese Automakers Still Take Red Sea Despite Houthi Menace
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