Watch: Canadian Man Fined Rs 18 Lakh For Venturing Into Forest
"Nova Scotia just handed me a fine for $28,872.50 for walking into the woods," Mr Evely captioned the video on X (formerly Twitter).
At the start of the clip, Mr Evely can be seen standing on Mountain Road. He points to one side of the road, saying, "Hey everybody, Jess Evely here out in Nova Scotia on Mountain Road in Coxheath. And as you can see behind me, this is the woods."
"But over here, this is not the woods. This is the Department of Natural Resources where conservation officers work, who issued $25,000 fine for going into the woods," he added.
Afterwards, he approaches one of the officers and politely asks: "I understand that you guys issue $25,000 fines right now to anybody who goes in. I am going to go into the woods over here. I don't want to make any trouble for you guys, okay?"
The Air Force veteran, who retired as a Master Warrant Officer after 20 years of service, then ventured into the forest before returning to the officers who instantly imposed a fine on him.
Watch the viral video here:
Nova Scotia just handed me a fine for $28,872.50 for walking into the woods. pic.twitter.com/sARyEzHAzR
— Jeff Evely (@JeffEvely) August 9, 2025
The Nova Scotia government has banned hiking, camping, fishing and use of vehicles such as ATVs in the woods due to an elevated wildfire risk. The ban came into effect earlier this week, but the decision has divided the citizens who have complained that it curtails their freedom.
As the video went viral, social media users questioned the government's diktat and sided with Mr Evely for his quiet defiance.
"Hats off to the sargeant major, He's going to win his case and will set a precedent," said one user while another said: "Let me get this straight- in Canada you can't walk in the woods? Wtf is that? Huuuuuuuh? I'm confused."
A third commented: "The government will continue to abuse us as long as we let them. It's all a part of the 15 city/climate lockdown plan."
Notably, the rule banning entry into the woods is in place for provincial Crown land until October 15 or until weather conditions allow them to be lifted.
Try Our AI Features
Explore what Daily8 AI can do for you:
Comments
No comments yet...
Related Articles
Hans India
12 minutes ago
- Hans India
Naidu, Lokesh thank Modi
Amaravati: Chief Minister N Chandrababu Naidu expressed his satisfaction with the Union Cabinet's decision to allocate a semiconductor unit to Andhra Pradesh. He extended his gratitude to Prime Minister Narendra Modi and the Central government for the decision. The Chief Minister conveyed his appreciation during a phone call with Union Minister Ashwini Vaishnaw. The semiconductor unit will be set up by Advanced System in Package (ASIP) Technologies in AP in collaboration with APACT Co Ltd, South Korea. The company will produce semiconductors for a wide range of products, including mobile phones, set-top boxes, automotive ECUs, and home electronic appliances. Meanwhile, Minister of HR and IT Nara Lokesh also thanked PM Modi for sanctioning a semiconductor manufacturing unit. 'Semiconductor manufacturing comes to AP, driven by a double engine sarkar! I am grateful to the Prime Minister for sanctioning a semiconductor manufacturing facility to AP as part of a Rs 4,600 crore budgetary allocation,' said Lokesh in a post on X.
Hans India
12 minutes ago
- Hans India
Big Push For ‘Make In India': Cabinet clears 4 new chip plants
New Delhi: The Union Cabinet on Tuesday approved four semiconductor manufacturing projects worth Rs 4,600 crore in Andhra Pradesh, Odisha and Punjab under the India Semiconductor Mission. The India Semiconductor Mission (ISM) aims to build a strong semiconductor and display ecosystem, positioning India as a global hub for electronics manufacturing and design. The four approved proposals are from SiCSem, Continental Device India Private Limited (CDIL), 3D Glass Solutions Inc, and Advanced Systems in Package (ASIP) Technologies. SiCSem and 3D Glass Solutions Inc will set up their manufacturing facilities in Odisha. Continental Device India Private Limited (CDIL) is already based in Punjab, and it will expand its discrete manufacturing facility, and ASIP Technologies will start its manufacturing plant in Andhra Pradesh. These proposals are worth Rs 4600 crore and are expected to generate employment opportunities for about 2034 skilled professionals, which will drive up the major creation of indirect jobs. With these four approvals, the total approved projects under ISM reach 10, with cumulative investments of about Rs 1.60 lakh crore in six states. Under this proposal, SiCSem Private Limited partners with Clas-SiC Wafer Fab Ltd, UK, for establishing the integrated facility of Silicon Carbide (SiC) based Compound Semiconductors in Info Valley, Bhubaneswar, Odisha. This is the country's first compound facility producing almost 60,000 wafers and a packaging capacity of 96 million units. Moreover, the products made at this facility will have applications in Missiles, Defence Equipment, Electric Vehicles (EVs), Railway, Fast Chargers, Data Centre racks, Consumer Appliances, and Solar Power Inverters. 3D Glass Solutions Inc (3DGS) will also set up a vertically integrated advanced packaging and embedded glass substrate unit in Info Valley, Bhubneshwar, Odisha. This step will bring the world's most advanced packaging technologies to India for powering the efficiency of the Semiconductor Industry. This facility has a large variety of advanced technologies, including glass interposers and 3D heterogeneous Integration Modules with a planned production capacity of 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules per annum. Advanced System in Package (ASIP) Technologies has a tech tie-up with APACT Co., Ltd, South Korea. These companies will jointly set up a semiconductor manufacturing unit in Andhra Pradesh with an annual production capacity of 96 billion units. Continental Device (CDIL) will expand its discrete semiconductor manufacturing facility at Mohali, Punjab, and manufacture devices like MOSFETs, IGBTs, Schottky Bypass Diodes, and transistors both in Silicon and Silicon carbide. Devices manufactured at this facility will have applications in Automotive Electronics, including EVs, renewable energy systems, power conversion applications, industrial applications, and communication infrastructure. New facilities will support the growing chip design capabilities in the country. The government already supported it by providing 278 academic institutions and 72 start-ups. The decision to set up an additional four plants will drive India's momentum in both the chip and electronics markets. Setting up new plants will also cater to the growing employees. This mission achieved great success as India's semiconductor chip market is expected to reach USD 100- 110 billion by 2030, as per the report. Plus, India's electronics exports witnessed a surge of over 47 pc YoY in Quarter 1 of FY26 as per the India Cellular and Electronics Association (ICEA).
Hans India
12 minutes ago
- Hans India
AP semiconductor unit gets Centre's nod
New Delhi: In a major boost to the growing electronics manufacturing sector in Andhra Pradesh, the Union Cabinet on Tuesday approved a semiconductor project for the state with an investment of Rs 468 crore. The AP's new project is a part of four new plants approved by the Union Cabinet with a cumulative investment of nearly Rs 4,600 crore under the India Semiconductor Mission (ISM). The projects are set to create over 2,000 skilled jobs across Andhra Pradesh, Odisha and Punjab. The newly approved proposals are from SiCSem, Continental Device India Private Limited (CDIL), 3D Glass Solutions Inc., and Advanced System in Package (ASIP) Technologies. With these additions, the total number of approved projects under the ISM now stands at 10, with a combined investment of around Rs 1.60 lakh crore across six states. Advanced System in Package (ASIP) Technologies will establish a new semiconductor manufacturing unit in Andhra Pradesh. This facility will have a technology partnership with South Korea's APACT Co and will produce up to 96 million chips annually. The products will be used in mobile phones, set-top boxes, automotive applications, and other electronics. Two projects will be set up in Info Valley, Bhubaneshwar. SiCSem Private Limited is collaborating with the UK's Clas-SiC Wafer Fab Ltd. to build India's first commercial compound fab for Silicon Carbide (SiC)-based semiconductors. This facility will have an annual capacity of 60,000 wafers and 96 million packaged units, with applications in electric vehicles, defense, and solar power inverters. 3D Glass Solutions Inc. (3DGS) will establish a vertically integrated advanced packaging unit. This facility will bring state-of-the-art glass-based substrate technology to India, with applications in defense, high-performance computing, and automotive electronics. Continental Device (CDIL) will expand its discrete semiconductor manufacturing facility in Mohali. This expansion will produce high-power discrete devices like MOSFETs and IGBTs, with an annual capacity of 158.38 million units. The devices will be used in automotive electronics, renewable energy, and industrial applications. These new projects will significantly boost India's self-reliance in the semiconductor sector. They will also complement the country's growing chip design capabilities, which have been supported by the government's talent development programs benefiting over 60,000 students and numerous startups.
