Samsung Galaxy Z Flip 7 might cause significant disappointment to US customers
Samsung is preparing to launch its new flagship foldables in less than two months. The Galaxy Z Fold 7 and Galaxy Z Flip 7 will be Samsung's main top-tier products until next year when the South Korean company is expected to introduce its new Galaxy S26 series.
A recent report coming from the South Korean media claimed the Galaxy Z Flip 7 will use two chipsets: Qualcomm Snapdragon 8 Elite and Exynos 2500. The international version will be equipped with Samsung's Exynos 2500 chip, while the US model will get the Snapdragon 8 Elite. The report seemed very reliable considering that Samsung always does that with its flagships. All Samsung flagships launched in the United States are using Qualcomm chipsets, while the rest of the world is getting either MediaTek or Exynos chips.
Unfortunately, that might not be the case this year. According to a new report, the firmware files for the US Galaxy Z Flip 7 indicate that the phone will be powered by the Exynos 2500 chipset.
Samsung Galaxy Z Flip 6 uses a Qualcomm Snapdragon 8 Gen 3 chipset | Image credit: PhoneArena
If that proves to be accurate, then the Galaxy Z Flip 7 will be equipped with the Exynos 2500 processor in every market, including North America. It's unclear if that will be the case for the Galaxy Z Fold 7 too, but hopefully not.Apparently, Samsung is worried that Qualcomm's Snapdragon 8 Elite chipset isn't able to keep its foldable flagships cool enough because of how thin they are. We're not sure if this is the real reason or just a guess based on real-life tests, but if the report is true, it will disappoint many Samsung fans in the United States.The type of chipset Samsung uses inside its smartphones remains a sensible topic for tech-savvy customers, although that might not be the case for the general public.
What will really matter is how US carriers will decide to push Samsung's new foldables and whether or not they will recommend them over other similar products that use Qualcomm's chipsets like the Motorola Razr Ultra 2025 that has just made its debut in the country.
This is probably a matter of perspective rather than performance, especially if the report that Qualcomm's Snapdragon 8 Elite chipset can't keep a phone's battery cool enough the thinner a phone is proves to be correct.
Hashtags
Try Our AI Features
Explore what Daily8 AI can do for you:
Comments
No comments yet...
Related Articles
Phone Arena
2 hours ago
- Phone Arena
Verizon establishes dominance in data usage during big US event
Verizon seems to be one of the main carriers involved in some of the biggest sports events in the United States. The network operator signed multiple partnerships with NFL, IndyCar and other similar sports organizations in the past. Besides that, Verizon's network covers some of the most important sports events in the this regard, the 2025 Indianapolis 500 race represents a big milestone for Verizon when it comes to data usage and connection. The carrier announced that in just one day, inside the Indianapolis Motor Speedway, a total of 172 terabytes (TB) of data was used on the Verizon network. Why is this important? Because it's more than it's been seen on Verizon 's network at this race and one of the highest data usage events the carrier has ever recorded. To support the claim, Verizon released some data for everyone to see, so here we go: Explosive 5G Growth : A staggering 74.6% leap in 5G UW volume of 61 TB inside the track over last year's race (43 TB), revealing how fans are embracing the speed and capacity of 5G. : A staggering 74.6% leap in 5G UW volume of 61 TB inside the track over last year's race (43 TB), revealing how fans are embracing the speed and capacity of 5G. Surging Overall Traffic : A massive 48.5% increase in total combined 4G and 5G UW data volume inside IMS, proving the network's capability to handle the intense demand. : A massive 48.5% increase in total combined 4G and 5G UW data volume inside IMS, proving the network's capability to handle the intense demand. High fan engagemen t: 15 TB of the 61 TB used inside the track was uploaded data, highlighting the high levels of fans sharing in real time. t: 15 TB of the 61 TB used inside the track was uploaded data, highlighting the high levels of fans sharing in real time. Surrounding Network Impact : Outside the track, more than 111 TB of data volume was used on the network, showing the event's broader impact. : Outside the track, more than 111 TB of data volume was used on the network, showing the event's broader impact. Combined Volume Growth : The combined data volume inside and outside the venue was nearly 172 TB – a 35% increase from last year's race day, demonstrating substantial year-over-year growth. Team Peske | Image credit: Verizon According to Verizon, the main reason behind this data explosion was this year's commercial activation of 5G Standalone at the IMS, which allowed fans to easily upload videos and share their experience in real time. – Andy Brady, President of Verizon Great Lakes, May 2025 The fact that Verizon 's network experienced a massive surge at the 2025 Indy 500, with 5G Ultrawideband (UW) right and center, and still managed to remain stable (or rather we hoped it did) is quite remarkable. For the sake of comparison, 172TB is the equivalent to more than 57 million digital photos (3 MB average). Switch to Total 5G+ Unlimited 3-Month plan or Total 5G Unlimited and get a free iPhone. We may earn a commission if you make a purchase Buy at Total Wireless
Phone Arena
2 hours ago
- Phone Arena
Everyone wants TSMC to build their 3nm chips as Samsung Foundry has trouble finding customers
Let's say you work for a major device manufacturer that is a fabless chip designer. In other words, while you design your own chips, you lack the facilities to produce them which explains the fabless label (Fab is short for a semiconductor fabrication facility). Suppose part of your job is to decide which foundry is going to build your chips. Right now, if you need advanced semiconductors, you have only two possibilities, TSMC and Samsung Foundry. But if you need your chips built using the most advanced process node of 3nm, there is no choice. TSMC is the foundry of choice. You might have to pay more and hope that there isn't a capacity issue that forces your order to be put on allocation by the foundry. However, if reliability is an issue, which it usually is, you want the foundry churning out 3nm chips with a 90% yield rather than the one with a 50% yield at that node which is Samsung Foundry. Big tech firms that count themselves as TSMC customers include Apple, MediaTek, Nvidia, and Qualcomm. The latter had decided to have Samsung Foundry produce the Snapdragon 8 Gen 1 during 2021-2022. However, the foundry reportedly had an extremely low 35% yield and Qualcomm pulled its business from Samsung Foundry. Instead, it reworked the chipset and had it built by TSMC as the Snapdragon 8 Gen 1+. Since then, Qualcomm has relied on TSMC exclusively to manufacture its flagship Snapdragon 8 SoCs. The extreme ultraviolet lithography machine helped to take chip production under 5nm. | Image credit-ASML While TSMC is clearly the most reliable in-demand foundry, Samsung Foundry is a distant second. Coming up fast behind Samsung is China's SMIC which happens to be the third-largest foundry in the world. Due to U.S. and Dutch sanctions, SMIC is not allowed to purchase an extreme ultraviolet lithography (EUV) machine used to transfer circuitry patterns onto silicon wafers using lines thinner than human hair. EUV machines allow for the placement of billions of transistors inside these semiconductors. SMIC reportedly is using older Deep Ultraviolet Lithography (DUV) machines, purchased before sanctions hit, to build Huawei's new 5nm Kirin X90 chip used to power the Mate Book Pro laptop. The foundry also uses multiple impressions in an attempt to make up for the lack of an EUV machine. However, this results in lower costs and higher prices for such chips. Still, SMIC is ready to make 5nm and 7nm chips for the Chinese automotive manufacturing sector which would be another blow to Samsung Foundry which has been doing brisk business making such chips for these Chinese-based firms. With 2nm chips coming to smartphones next year, including the iPhone 17 line, TSMC will remain on top and possibly stay there well beyond 2026.
GSM Arena
3 hours ago
- GSM Arena
vivo X200 FE and X Fold5 launch date leaks
According to a new rumor out of India, both the vivo X200 FE and the X Fold5 will launch on the same day: July 10. This strongly implies that they will both be the stars at the same launch event. The X200 FE has been rumored to sport a 6.31-inch flat OLED screen with "1.5K" resolution and 120 Hz refresh rate, an under-display fingerprint sensor, the Dimensity 9300+ or Dimensity 9400e chipset at the helm, a 50 MP main camera using Sony's IMX921 sensor, a 50 MP telephoto camera with 3x optical zoom and Sony's IMX882, and an 8 MP ultrawide. vivo X Fold3 Pro Selfies will be taken care of by a 50 MP camera, and the phone will be available in 12/256GB and 16/512GB trims. It will be IP68 and IP69 certified for dust and water resistance, and will get a 6,500 mAh battery with support for 90W wired charging. It should weigh approximately 200g. The X Fold5, on the other hand, will allegedly come with an 8.03-inch foldable AMOLED screen with "2K+" resolution and 120 Hz refresh rate, a 6.53-inch LTPO OLED cover screen with 120 Hz refresh rate, and a 6,000 mAh battery with 90W wired and 30W wireless charging support. It will be powered by Qualcomm's Snapdragon 8 Gen 3 SoC, paired with 16GB of RAM and 512GB of storage. It will have a 50 MP main camera with the same IMX921 sensor as the X200 FE, a 50 MP ultrawide with autofocus, and a 50 MP telephoto with 3x optical zoom and (you guessed it) the IMX882 sensor. For selfies the device will have two 32 MP shooters. There will also be a side-mounted fingerprint scanner, a three-stage Alert Slider-like button, there will be an IP rating too. The X Fold5 will be 4.3mm thick when unfolded and 9.33mm thick when folded. Source
