Latest news with #CMOS
Yahoo
2 days ago
- Business
- Yahoo
Teledyne Launches New Industrial Image Sensors Designed for Space Applications
Teledyne Technologies Incorporated (NYSE:TDY) has announced today the release of three industrial CMOS image sensors designed for space applications, marking a strategic expansion into the rapidly growing New Space market. Developed and tested in France and Spain, these sensors range in resolution from 1.3MP to 67MP and are tailored for high-demand applications such as Earth observation, star trackers, rover cameras, and space situational awareness. A technician in a lab coat calibrating advanced electronic components. The launch represents a key growth opportunity for TDY's Digital Imaging division, as it seeks to capture share in a segment where cost-effective but high-quality components are in high demand. The new sensors offer space-ready performance without the full cost and lead time of traditional space-grade parts, making them ideal for agile missions and constellations. The launch is expected to boost the growth pace of TDY's largest Digital Imaging segment, which accounts for more than half of total revenues but has posted just +2.2% revenue growth in the latest quarter, the slowest among all segments. These developments position TDY well to beat the modest street consensus expecting only +6.6% revenue growth for the FY2025. Teledyne Technologies Incorporated (NYSE:TDY) will present its new sensors at SmallSat Europe 2025 in Amsterdam later this week, highlighting management's intent to solidify the company's role as a key supplier in the New Space value chain. TDY stock is up +6% year-to-date, outperforming the broad market, which indirectly confirms that the strengthening moat and growth prospects are already starting to be priced in. Teledyne Technologies Incorporated (NYSE:TDY) is a leading provider of advanced imaging solutions used in instrumentation, aerospace, and defense applications. While we acknowledge the potential of TDY as an investment, our conviction lies in the belief that some AI stocks hold greater promise for delivering higher returns and have limited downside risk. If you are looking for an AI stock that is more promising than TDY and that has 100x upside potential, check out our report about this cheapest AI stock. READ NEXT: and Disclosure: None. Error in retrieving data Sign in to access your portfolio Error in retrieving data Error in retrieving data Error in retrieving data Error in retrieving data
Associated Press
3 days ago
- Business
- Associated Press
Teledyne Space Imaging Launches Industrial Image Sensors Tested for Space
GRENOBLE, FRANCE - Media OutReach Newswire - 26 May 2025 - Teledyne Technologies Incorporated (NYSE:TDY), a leading provider of advanced imaging solutions, is proud to announce the release of three variants of industrial CMOS sensors, with resolutions ranging from 1.3MP up to 67MP, following a delta space qualification methodology and radiation testing. These industrial image sensors are designed, manufactured and tested in Grenoble-France and Seville-Spain and upscreened for space in the Grenoble facilities. The Upscreened Variants (USV) are intended to be suitable for new space applications such as Earth observation and remote sensing payloads, star trackers, monitoring cameras, and cameras for space suits, rovers, moon landers, and space situational or domain awareness. These new products complement Teledyne's ongoing offerings for demanding science and defense missions by providing options for the less rigorous New Space market. Upscreened Pdt Launch PR 'Within the New Space industry, some system designers may use COTS sensors and make them fly with no upscreening, which means that they take the risk of any malfunctions or errors further down the line,' explains Céline Semécas, Product Marketing Manager, Teledyne e2v. 'Teledyne e2v's industrial upscreened image sensors are tested for space and are delivered as flight models with lot validation test certificates and radiation test reports.' The three CMOS sensors will undergo full screening, serialization and lot validation tests. Depending on the mission profile, they are delivered as flight models with two levels of screening, according to U1 (ESCC9020-like) or U3 (NASA Class 3 tailored for image sensors). Devices were sampled and have been through radiation characterization in specialized facilities, including testing for Single Event Latch-up (SEL), Single Event Effect (SEE), and Single Event Functional Interrupt (SEFI) malfunctions or errors. The image sensors feature a broad range of embedded functions, including sub-sampling, multi-region of interest (ROI), defective pixel correction, and high dynamic range capability. For satellite star trackers and monitoring cameras, the Ruby 1.3M USV is a radiation tolerant 1.3MP (1280 x 1024) global shutter sensor optimized for space systems that are subject to constraints, such as size, weight and power (SWaP) and cost. Housed in a 12.7mm x 12.7mm CLCC packaging, this 5.3µm pixel pitch sensor can fit with cost-effective 1/1.8" lenses, consumes very low (≤200mW) power, and is available in a monochrome or colour version. The Emerald Gen2 12M USV is a compact 12MP (4096 x 3072) global shutter imaging sensor for monitoring cameras with a 2.8µm pitch, and available in monochrome and colour versions. It features a very low readout noise performance of less than 3 electrons, delivering excellent image quality and the ability to work in high-contrast scenes. It has ROI features, enabling Teledyne e2v to offer an 8.9MP ROI image sensor in the same packaging, allowing space engineers to make even smaller cameras because they can use smaller optics. This sensor also features both LVDS and MIPI outputs, which ease the integration. The Emerald 67M USV is a 67MP (8192 x 8192) image sensor that features one of the smallest global shutter pixel pitches (2.5µm) on the market. This 8K high-resolution device can cover a large swath for Earth observation and is also suitable for space domain awareness applications, allowing them to cover a large field of view. Emerald 67M USV combines low noise (<3e- @ 12 bits), providing excellent image quality in low light conditions, and up to 65 fps @10 bits, providing sharp images at very high speed. The image sensor can support monochrome or colour video and can be used for multispectral imaging. Teledyne e2v provides a full range of tools to ease system integration of the CMOS sensors and accelerate time-to-market. These tools include evaluation kits, reference designs, radiation reports and space qualification reports. 'With a dedicated support team and quick response times, Teledyne e2v in Grenoble supports space engineers from design concept to system launch,' adds Céline Semécas. 'Furthermore, Teledyne e2v is used to managing long-term supplies with applications that require long product life cycles and obsolescence management.' During SmallSat Europe 2025, Europe's leading event dedicated to small satellites, which will take place on May 27 and 28 at the RAI Convention Center in Amsterdam, visitors to the Teledyne stand, at booth 737, can watch a live demo showcasing the performance characteristics of the new Emerald Gen2 12M USV upscreened image sensors. Hashtag: #Teledyne The issuer is solely responsible for the content of this announcement. Teledyne Space Imaging Teledyne Space Imaging offers innovative space imaging products, including those from sister companies. This new line of industrial image sensors upscreened for space is from Teledyne e2v in Grenoble. This facility is known for its high-performance, high-reliability semiconductors for the most demanding space applications. Teledyne Space Imaging is part of Teledyne Technologies, a leading provider of sophisticated digital imaging products and software, instrumentation, aerospace and defense electronics, and engineered systems. Teledyne's operations are primarily located in the United States, Canada, the United Kingdom, and Western and Northern Europe. For more information, visit Teledyne's websites: and
Zawya
3 days ago
- Business
- Zawya
Teledyne Space Imaging Launches Industrial Image Sensors Tested for Space
GRENOBLE, FRANCE - Media OutReach Newswire - 26 May 2025 - Teledyne Technologies Incorporated (NYSE:TDY), a leading provider of advanced imaging solutions, is proud to announce the release of three variants of industrial CMOS sensors, with resolutions ranging from 1.3MP up to 67MP, following a delta space qualification methodology and radiation testing. These industrial image sensors are designed, manufactured and tested in Grenoble-France and Seville-Spain and upscreened for space in the Grenoble facilities. The Upscreened Variants (USV) are intended to be suitable for new space applications such as Earth observation and remote sensing payloads, star trackers, monitoring cameras, and cameras for space suits, rovers, moon landers, and space situational or domain awareness. These new products complement Teledyne's ongoing offerings for demanding science and defense missions by providing options for the less rigorous New Space market. "Within the New Space industry, some system designers may use COTS sensors and make them fly with no upscreening, which means that they take the risk of any malfunctions or errors further down the line," explains Céline Semécas, Product Marketing Manager, Teledyne e2v. "Teledyne e2v's industrial upscreened image sensors are tested for space and are delivered as flight models with lot validation test certificates and radiation test reports." The three CMOS sensors will undergo full screening, serialization and lot validation tests. Depending on the mission profile, they are delivered as flight models with two levels of screening, according to U1 (ESCC9020-like) or U3 (NASA Class 3 tailored for image sensors). Devices were sampled and have been through radiation characterization in specialized facilities, including testing for Single Event Latch-up (SEL), Single Event Effect (SEE), and Single Event Functional Interrupt (SEFI) malfunctions or errors. The image sensors feature a broad range of embedded functions, including sub-sampling, multi-region of interest (ROI), defective pixel correction, and high dynamic range capability. For satellite star trackers and monitoring cameras, the Ruby 1.3M USV is a radiation tolerant 1.3MP (1280 x 1024) global shutter sensor optimized for space systems that are subject to constraints, such as size, weight and power (SWaP) and cost. Housed in a 12.7mm x 12.7mm CLCC packaging, this 5.3µm pixel pitch sensor can fit with cost-effective 1/1.8" lenses, consumes very low (≤200mW) power, and is available in a monochrome or colour version. The Emerald Gen2 12M USV is a compact 12MP (4096 x 3072) global shutter imaging sensor for monitoring cameras with a 2.8µm pitch, and available in monochrome and colour versions. It features a very low readout noise performance of less than 3 electrons, delivering excellent image quality and the ability to work in high-contrast scenes. It has ROI features, enabling Teledyne e2v to offer an 8.9MP ROI image sensor in the same packaging, allowing space engineers to make even smaller cameras because they can use smaller optics. This sensor also features both LVDS and MIPI outputs, which ease the integration. The Emerald 67M USV is a 67MP (8192 x 8192) image sensor that features one of the smallest global shutter pixel pitches (2.5µm) on the market. This 8K high-resolution device can cover a large swath for Earth observation and is also suitable for space domain awareness applications, allowing them to cover a large field of view. Emerald 67M USV combines low noise (<3e- @ 12 bits), providing excellent image quality in low light conditions, and up to 65 fps @10 bits, providing sharp images at very high speed. The image sensor can support monochrome or colour video and can be used for multispectral imaging. Teledyne e2v provides a full range of tools to ease system integration of the CMOS sensors and accelerate time-to-market. These tools include evaluation kits, reference designs, radiation reports and space qualification reports. "With a dedicated support team and quick response times, Teledyne e2v in Grenoble supports space engineers from design concept to system launch," adds Céline Semécas. "Furthermore, Teledyne e2v is used to managing long-term supplies with applications that require long product life cycles and obsolescence management." During SmallSat Europe 2025, Europe's leading event dedicated to small satellites, which will take place on May 27 and 28 at the RAI Convention Center in Amsterdam, visitors to the Teledyne stand, at booth 737, can watch a live demo showcasing the performance characteristics of the new Emerald Gen2 12M USV upscreened image sensors. Hashtag: #Teledyne The issuer is solely responsible for the content of this announcement. Teledyne Space Imaging Teledyne Space Imaging offers innovative space imaging products, including those from sister companies. This new line of industrial image sensors upscreened for space is from Teledyne e2v in Grenoble. This facility is known for its high-performance, high-reliability semiconductors for the most demanding space applications. Teledyne Space Imaging is part of Teledyne Technologies, a leading provider of sophisticated digital imaging products and software, instrumentation, aerospace and defense electronics, and engineered systems. Teledyne's operations are primarily located in the United States, Canada, the United Kingdom, and Western and Northern Europe. For more information, visit Teledyne's websites: and Teledyne e2v
Malay Mail
3 days ago
- Business
- Malay Mail
Teledyne Space Imaging Launches Industrial Image Sensors Tested for Space
GRENOBLE, FRANCE - Media OutReach Newswire - 26 May 2025 - Teledyne Technologies Incorporated (NYSE:TDY), a leading provider of advanced imaging solutions, is proud to announce the release of three variants of industrial CMOS sensors, with resolutions ranging from 1.3MP up to 67MP, following a delta space qualification methodology and radiation testing. These industrial image sensors are designed, manufactured and tested in Grenoble-France and Seville-Spain and upscreened for space in the Grenoble facilities. The Upscreened Variants (USV) are intended to be suitable for new space applications such as Earth observation and remote sensing payloads, star trackers, monitoring cameras, and cameras for space suits, rovers, moon landers, and space situational or domain awareness. These new products complement Teledyne's ongoing offerings for demanding science and defense missions by providing options for the less rigorous New Space market."Within the New Space industry, some system designers may use COTS sensors and make them fly with no upscreening, which means that they take the risk of any malfunctions or errors further down the line," explains Céline Semécas, Product Marketing Manager, Teledyne e2v. "Teledyne e2v's industrial upscreened image sensors are tested for space and are delivered as flight models with lot validation test certificates and radiation test reports."The three CMOS sensors will undergo full screening, serialization and lot validation tests. Depending on the mission profile, they are delivered as flight models with two levels of screening, according to U1 (ESCC9020-like) or U3 (NASA Class 3 tailored for image sensors). Devices were sampled and have been through radiation characterization in specialized facilities, including testing for Single Event Latch-up (SEL), Single Event Effect (SEE), and Single Event Functional Interrupt (SEFI) malfunctions or errors. The image sensors feature a broad range of embedded functions, including sub-sampling, multi-region of interest (ROI), defective pixel correction, and high dynamic range satellite star trackers and monitoring cameras, the Ruby 1.3M USV is a radiation tolerant 1.3MP (1280 x 1024) global shutter sensor optimized for space systems that are subject to constraints, such as size, weight and power (SWaP) and cost. Housed in a 12.7mm x 12.7mm CLCC packaging, this 5.3µm pixel pitch sensor can fit with cost-effective 1/1.8" lenses, consumes very low (≤200mW) power, and is available in a monochrome or colour Emerald Gen2 12M USV is a compact 12MP (4096 x 3072) global shutter imaging sensor for monitoring cameras with a 2.8µm pitch, and available in monochrome and colour versions. It features a very low readout noise performance of less than 3 electrons, delivering excellent image quality and the ability to work in high-contrast scenes. It has ROI features, enabling Teledyne e2v to offer an 8.9MP ROI image sensor in the same packaging, allowing space engineers to make even smaller cameras because they can use smaller optics. This sensor also features both LVDS and MIPI outputs, which ease the Emerald 67M USV is a 67MP (8192 x 8192) image sensor that features one of the smallest global shutter pixel pitches (2.5µm) on the market. This 8K high-resolution device can cover a large swath for Earth observation and is also suitable for space domain awareness applications, allowing them to cover a large field of view. Emerald 67M USV combines low noise (<3e- @ 12 bits), providing excellent image quality in low light conditions, and up to 65 fps @10 bits, providing sharp images at very high speed. The image sensor can support monochrome or colour video and can be used for multispectral e2v provides a full range of tools to ease system integration of the CMOS sensors and accelerate time-to-market. These tools include evaluation kits, reference designs, radiation reports and space qualification reports. "With a dedicated support team and quick response times, Teledyne e2v in Grenoble supports space engineers from design concept to system launch," adds Céline Semécas. "Furthermore, Teledyne e2v is used to managing long-term supplies with applications that require long product life cycles and obsolescence management."During SmallSat Europe 2025, Europe's leading event dedicated to small satellites, which will take place on May 27 and 28 at the RAI Convention Center in Amsterdam, visitors to the Teledyne stand, at booth 737, can watch a live demo showcasing the performance characteristics of the new Emerald Gen2 12M USV upscreened image #Teledyne The issuer is solely responsible for the content of this announcement. Teledyne Space Imaging Teledyne Space Imaging offers innovative space imaging products, including those from sister companies. This new line of industrial image sensors upscreened for space is from Teledyne e2v in Grenoble. This facility is known for its high-performance, high-reliability semiconductors for the most demanding space applications. Teledyne Space Imaging is part of Teledyne Technologies, a leading provider of sophisticated digital imaging products and software, instrumentation, aerospace and defense electronics, and engineered systems. Teledyne's operations are primarily located in the United States, Canada, the United Kingdom, and Western and Northern Europe. For more information, visit Teledyne's websites: and
Yahoo
09-05-2025
- Business
- Yahoo
Former SK hynix employee transferred advanced chip packaging technologies to Huawei
When you buy through links on our articles, Future and its syndication partners may earn a commission. A former SK Hynix employee has been formally accused of illegally transferring technologies related to advanced chip packaging used for 3D NAND, HBM, and multi-chiplet assemblies as well as CMOS image sensors to Huawei's HiSilicon division, reports DigiTimes citing the Seoul Central District Prosecutor's office. There is an interesting wrinkle in this story: Huawei's HiSilicon did not directly ask for specific technologies. While working at Huawei, the suspect allegedly took IP related to CMOS image sensors (CIS) and hybrid bonding chip packaging technology that is used for 3D NAND, HBM3/HBM3E/HBM4 memory, as well as advanced stacked multi-chiplet packages (e.g., TSMC's SoIC and Intel's Foveros 3D). It is unclear whether the suspect's targets were hybrid bonding and image sensors, or 'just' hybrid bonding as modern CMOS sensors also use hybrid bonding. SK Hynix reportedly clarified that the leaked bonding-related information concerned general wafer-to-wafer processes and not the specific hybrid bonding technique currently being developed or used for commercial products. For Chinese companies like Huawei (which does not have access to advanced process technologies and packaging methods used by TSMC and SK hynix) as well as SMIC (which does not have access to the latest lithography equipment made by ASML), getting wafer bonding know-how from SK hynix, which had licensed such technologies from Xperi, may be considered as a major breakthrough as wafer bonding is becoming increasingly important for multiple semiconductor applications. The individual in question, a South Korean citizen named only in the complaint by his surname, Kim, previously worked for the Chinese unit of SK hynix. Authorities allege that in 2022 he secured a position with HiSilicon and, during the hiring process, improperly accessed and misused internal data belonging to SK hynix. Kim reportedly printed out and captured photographs of internal files against policy. Investigators discovered that over 11,000 photographs of confidential content were taken, and steps were allegedly made to mask the origin by removing company identifiers such as brand logos and secrecy labels from the images. Evidence indicates that Kim submitted these materials as part of job applications to two separate companies in China, using them to enhance his qualifications. Authorities now claim this was a calculated effort to secure employment using unlawfully obtained information from his former employer. The report confirms that many technologies developed in China in general and by Huawei specifically originate from multi-national corporations. But there is an interesting twist: Huawei did not explicitly ask the suspect to bring it SK hynix's trade secrets (even though the company is known for poaching highly-skilled employees from world-class companies by offering them huge salaries), but accepted them as part of the hiring process. The case has drawn attention in South Korea due to rising concerns about the outflow of specialized semiconductor knowledge, specifically as China is trying hard to achieve semiconductor self-sufficiency. It highlights the increasing risks around workforce migration and the global effort to enforce tighter control over the transmission of high-value industrial IP. This is not the first time when an SK hynix employee left for Huawei and takes the company's IP with them. Last year the Suwon District Court sentenced one of SK hynix's employees who departed to Huawei with 4,000 secret documents to 18 months behind bars and a fine. Follow Tom's Hardware on Google News to get our up-to-date news, analysis, and reviews in your feeds. Make sure to click the Follow button.
