Latest news with #DesignCon2025
Globe and Mail
18-02-2025
- Business
- Globe and Mail
DesignCon Wraps 30th Anniversary with Record Number of Attendees, Hosting Powerhouse Speakers from Nvidia, Amazon and Lawrence Berkeley National Laboratory
Key topics covered included AI computing, high-speed applications and more. SANTA CLARA, CA / ACCESS Newswire / February 18, 2025 / DesignCon, the premiere event for chip, board, and systems design engineers, concludes the 30th edition by bringing together 5,400 engineers, for a total of 13% growth to connect and learn about critical technological advancements in the industry. DesignCon presented more than 200 educational and networking sessions across the three-day event, featuring topics on AI computing, optimization of interconnects, electromagnetic compatibility and interference, power integrity and other high-speed applications. Keynote speakers from Nvidia, Amazon and Lawrence Berkeley National Laboratory presented chief insights into the future of engineering excellence and discussed an array of topics from electronics for future high energy particle colliders to the transformative power of accelerated computing and enabling global connectivity with low Earth orbit satellite technology. Over 170 industry suppliers of electronic and design manufacturing services showcased the latest innovations in semiconductor and high-speed communication systems design. Leading exhibitors including Amphenol, Keysight Technologies, Marvell Technology, Molex, Samtec and TE Connectivity were among those that highlighted solutions for thermal management, component manufacturing, electronics assembly, signal integrity, AI and machine learning and connectivity. Celebrating 30 years, DesignCon 2025 hosted multiple experiences commemorating the milestone, such as an anniversary lounge on the expo floor including a timeline honoring important events and technologies since the event's founding in 1995, as well as a special Welcome Reception on opening day. A Lunar New Year celebration could also be seen on the DesignCon show floor, in honor of Lunar New Year 2025 - Year of the Snake. " DesignCon's milestone event hosted impressive growth in both the number of attendees, as well as exhibiting companies," says Suzanne Deffree, Group Event Director, Informa Markets Engineering. "The breadth of expertise showcased provides first-hand insights and education aimed at expanding and innovating critical solutions in the design engineering community. DesignCon brought together professionals across the business to celebrate the industry's progress over the past three decades and inspire future success across the globe." Looking to the next 30 years, DesignCon hosted several initiatives to ensure continuous growth of engineering. These included the sophomore-year edition of the event's 40 Under 40 program, for which DesignCon hosted 40 rising engineers, providing these individuals with complimentary access to DesignCon's education, expo floor and networking, as well as an exclusive breakfast with leading industry mentors, engineers and entrepreneurs. Efforts also included a Women in Engineering career-development panel led by the official event publication, Design News, on, as well as additional career-development sessions and a networking reception, presented in partnership with IEEE EMC Society and IEEE Women. DesignCon will return to Santa Clara Convention Center, Feb. 24-26, 2026. For more information on DesignCon, please visit About DesignCon DesignCon is the world's premier conference for chip, board, and systems design engineers in the high-speed communications and semiconductor communities. DesignCon, created by engineers for engineers, takes place annually in Silicon Valley and remains the largest annual gathering of chip, board, and systems designers in the country. DesignCon is organized by Informa, a leading B2B information services group and the largest B2B events and exhibitions organizer in the world. To learn more and for the latest news and information, visit Design News and Battery Technology Online are the official publications of DesignCon. Connect with DesignCon and join the conversation on Facebook and LinkedIn. About Informa Markets Engineering Informa Markets' Engineering portfolio, a subsidiary of Informa plc (LON:INF), is the leading B2B event producer, publisher, and digital media business for the world's $3-trillion advanced, technology-based manufacturing industry. Our print and electronic products deliver trusted information to the engineering market and leverage our proprietary 1.3-million-name database to connect suppliers with buyers and purchase influencers. We produce more than 50 events and conferences in a dozen countries, connecting manufacturing professionals from around the globe. The Engineering portfolio is organized by Informa, the world's leading exhibitions organizer that brings a diverse range of specialist markets to life, unlocking opportunities and helping them to thrive 365 days of the year. For more information, please visit View the original press release on ACCESS Newswire
Yahoo
18-02-2025
- Business
- Yahoo
DesignCon Wraps 30th Anniversary with Record Number of Attendees, Hosting Powerhouse Speakers from Nvidia, Amazon and Lawrence Berkeley National Laboratory
Key topics covered included AI computing, high-speed applications and more. SANTA CLARA, CA / ACCESS Newswire / February 18, 2025 / DesignCon, the premiere event for chip, board, and systems design engineers, concludes the 30th edition by bringing together 5,400 engineers, for a total of 13% growth to connect and learn about critical technological advancements in the industry. DesignCon presented more than 200 educational and networking sessions across the three-day event, featuring topics on AI computing, optimization of interconnects, electromagnetic compatibility and interference, power integrity and other high-speed applications. Keynote speakers from Nvidia, Amazon and Lawrence Berkeley National Laboratory presented chief insights into the future of engineering excellence and discussed an array of topics from electronics for future high energy particle colliders to the transformative power of accelerated computing and enabling global connectivity with low Earth orbit satellite technology. Over 170 industry suppliers of electronic and design manufacturing services showcased the latest innovations in semiconductor and high-speed communication systems design. Leading exhibitors including Amphenol, Keysight Technologies, Marvell Technology, Molex, Samtec and TE Connectivity were among those that highlighted solutions for thermal management, component manufacturing, electronics assembly, signal integrity, AI and machine learning and connectivity. Celebrating 30 years, DesignCon 2025 hosted multiple experiences commemorating the milestone, such as an anniversary lounge on the expo floor including a timeline honoring important events and technologies since the event's founding in 1995, as well as a special Welcome Reception on opening day. A Lunar New Year celebration could also be seen on the DesignCon show floor, in honor of Lunar New Year 2025 - Year of the Snake. "DesignCon's milestone event hosted impressive growth in both the number of attendees, as well as exhibiting companies," says Suzanne Deffree, Group Event Director, Informa Markets Engineering. "The breadth of expertise showcased provides first-hand insights and education aimed at expanding and innovating critical solutions in the design engineering community. DesignCon brought together professionals across the business to celebrate the industry's progress over the past three decades and inspire future success across the globe." Looking to the next 30 years, DesignCon hosted several initiatives to ensure continuous growth of engineering. These included the sophomore-year edition of the event's 40 Under 40 program, for which DesignCon hosted 40 rising engineers, providing these individuals with complimentary access to DesignCon's education, expo floor and networking, as well as an exclusive breakfast with leading industry mentors, engineers and entrepreneurs. Efforts also included a Women in Engineering career-development panel led by the official event publication, Design News, on, as well as additional career-development sessions and a networking reception, presented in partnership with IEEE EMC Society and IEEE Women. DesignCon will return to Santa Clara Convention Center, Feb. 24-26, 2026. For more information on DesignCon, please visit About DesignConDesignCon is the world's premier conference for chip, board, and systems design engineers in the high-speed communications and semiconductor communities. DesignCon, created by engineers for engineers, takes place annually in Silicon Valley and remains the largest annual gathering of chip, board, and systems designers in the country. DesignCon is organized by Informa, a leading B2B information services group and the largest B2B events and exhibitions organizer in the world. To learn more and for the latest news and information, visit Design News and Battery Technology Online are the official publications of DesignCon. Connect with DesignCon and join the conversation on Facebook and LinkedIn. About Informa Markets EngineeringInforma Markets' Engineering portfolio, a subsidiary of Informa plc (LON:INF), is the leading B2B event producer, publisher, and digital media business for the world's $3-trillion advanced, technology-based manufacturing industry. Our print and electronic products deliver trusted information to the engineering market and leverage our proprietary 1.3-million-name database to connect suppliers with buyers and purchase influencers. We produce more than 50 events and conferences in a dozen countries, connecting manufacturing professionals from around the globe. The Engineering portfolio is organized by Informa, the world's leading exhibitions organizer that brings a diverse range of specialist markets to life, unlocking opportunities and helping them to thrive 365 days of the year. For more information, please visit Media ContactInforma Markets SOURCE: INFORMA MARKETS - ENGINEERING View the original press release on ACCESS Newswire
Associated Press
28-01-2025
- Business
- Associated Press
MultiLane Leads 224Gbps/Lane Instrument Innovation at DesignCon 2025
/ -- The insatiable need for higher bandwidth and greater networking speeds, driven as ever by AI and Machine Learning, has greatly accelerated the pace of development and deployment of next-gen networks. 224Gbps/lane is now an essential technology to ensure the HSIO industry can keep pace with demand that shows no sign of slowing down. These condensed development cycles require a robust test and measurement foundation for innovations in 224G/1.6T networking to meet the needed time-to-market. MultiLane is leading the charge in providing 224Gbps/lane instrumentation to enable rapid, high-value host and module testing with scalable precision. The company's showing at DesignCon 2025 booth #727 features industry-leading innovations in 224G test and measurement. The company's latest Bit Error Rate Tester, ML7004F-L, will be featured in a live demonstration recording the bit error rate of a 1.6Tbps (8x224Gbps) Active Electrical Cable, provided by 3M, also shown at booth #326. The first commercially available instrument of its kind, ML7004F-L is a 4-channel 120 Gbaud/lane PAM4 BERT designed for maximum versatility, with up to 35 dB of Rx equalization for long reach passive applications as well as retimed 1.6T optical modules and cables. '3M is well-positioned to serve the dynamic needs of Cloud Service Providers as they pursue versatile interconnect solutions for next-generation Artificial Intelligence,' said Steve Vander Louw, president of display and electronics at 3M. 'MultiLane's cutting edge suite of instruments has enabled a live demonstration of our 1.6Tbps Active Electrical Cable, one of the first known cables publicly demonstrated in this industry.' The MultiLane Signal Integrity Analyzer, the ML8008FX-SIA, is another key instrument in at the MultiLane booth. A MultiLane specialty instrument, the ML8008FX-SIA is designed to provide high-value testing for 224Gbps/lane passive and linear active cables, with ultra-fast testing for S-parameters and crosstalk and low Total Cost of Ownership when validating any kind of custom passive or linear active interconnects such as Flyover Cables, DACs, ACCs, Backplane Cartridges, and Cable Trays. The ML8008FX-SIA's ultra-high throughput capabilities are on full display in a multi-Terabit capable setup. Both sets of instruments can be configured as individual units or densely consolidated for validating extremely high channel count devices. 'We are very pleased with our presence at DesignCon this year,' said Pavel Zivny, Director of Product Development at MultiLane. 'The arrival of AI has only put more pressure on the industry to transition to 224Gbps/lane and we are ideally placed with a comprehensive solution suite that accelerates 1.6T validation cycles from development to deployment.' The ML7004F-L and ML8008FX-SIA join a number of other MultiLane innovations including the company's latest 1.0 mm RF Connectors – board mount connectors, cable assemblies, adapters, and terminators –which lay the foundations for 448Gbps/lane testing. About MultiLane MultiLane is a leading provider of High-Speed IO and Data Center Interconnect test solutions. Products include BERTs, TDR, optical and electrical oscilloscopes, optical switch boxes, and a host of MSA-compliant development tools for a variety of form factors, including QSFP-DD, OSFP, and OSFP-XD. MultiLane's products are used to test semiconductors, ACCs, DACs, AOCs, AECs, backplane cables, optical transceivers, and system switch cards. MultiLane also develops high speed ATE modules that fit in wafer-scale automated test systems. For more information, please visit and follow us on LinkedIn, X and Facebook. MultiLane X YouTube
Yahoo
28-01-2025
- Business
- Yahoo
Marvell to Showcase Accelerated Infrastructure Silicon at DesignCon 2025
Delivering Leading-edge Scale Up and Scale Out for AI Data Centers and Cloud Infrastructure SANTA CLARA, Calif., Jan. 28, 2025 /PRNewswire/ -- Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, will showcase its latest advancements in accelerated infrastructure silicon at DesignCon 2025. The event is scheduled for January 28-30, 2025, at the Santa Clara Convention Center in Santa Clara, California. Visit Marvell at booth 1139 to see the latest accelerated infrastructure products and technologies, including: The Alaska® P PCIe Gen 6 Retimer and PCIe Gen 7 SerDes for extending both inside-the-server and outside-the-chassis connection distances without drastic board redesigns. A 1.6 Tbps active electrical cable powered by the Alaska A PAM4 DSP for use in high-bandwidth scale up (server-to-server) and scale out (server-to-switch) applications. Partner Booth InnovationsPartners featuring Marvell-enabled accelerated infrastructure products at DesignCon 2025 include: 3M (booth 326) Amphenol (booth 833) Keysight (booth 1039) Molex (booth 739) Multilane (booth 727) TE Connectivity (booth 639) Tektronix (booth 819) About Marvell To deliver the data infrastructure technology that connects the world, we're building solutions on the most powerful foundation: our partnerships with our customers. Trusted by the world's leading technology companies for over 25 years, we move, store, process and secure the world's data with semiconductor solutions designed for our customers' current needs and future ambitions. Through a process of deep collaboration and transparency, we're ultimately changing the way tomorrow's enterprise, cloud, automotive, and carrier architectures transform—for the better. Marvell and the M logo are trademarks of Marvell or its affiliates. Please visit for a complete list of Marvell trademarks. Other names and brands may be claimed as the property of others. This press release contains forward-looking statements within the meaning of the federal securities laws that involve risks and uncertainties. Forward-looking statements include, without limitation, any statement that may predict, forecast, indicate or imply future events, results or achievements. Actual events, results or achievements may differ materially from those contemplated in this press release. Forward-looking statements are only predictions and are subject to risks, uncertainties and assumptions that are difficult to predict, including those described in the "Risk Factors" section of our Annual Reports on Form 10-K, Quarterly Reports on Form 10-Q and other documents filed by us from time to time with the SEC. Forward-looking statements speak only as of the date they are made. Readers are cautioned not to put undue reliance on forward-looking statements, and no person assumes any obligation to update or revise any such forward-looking statements, whether as a result of new information, future events or otherwise. For further information, contact:pr@ View original content to download multimedia: SOURCE Marvell Sign in to access your portfolio
