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Yahoo
21-05-2025
- Business
- Yahoo
Western Digital Unveils Open Storage Innovations at Computex 2025
Western Digital Corporation WDC is driving a new era of storage innovation by advancing infrastructure solutions tailored for artificial intelligence/machine learning (AI/ML), software-defined storage (SDS) and disaggregated storage. With a focus on hyperscale cloud service providers (CSPs), enterprises and Storage-as-a-Service (STaaS) vendors, the company's Platforms Business delivers both high-capacity JBODs (Just a Bunch of Disks) and high-performance EBOF (Ethernet Bunch of Flash) NVMe-oF solutions to power intensive data workloads. As AI and data-centric computing evolve, organizations are under increasing pressure to deploy scalable, efficient and sustainable storage systems. To address this demand, Western Digital has announced major enhancements to its Open Composable Compatibility Lab (OCCL), including the launch of OCCL 2.0, the Ultrastar Data102 ORv3 JBOD and the OpenFlex Data24 4100, which feature single-port SSDs and additional SSD qualifications for its OpenFlex Data24 NVMe-oF platform. Western Digital Corporation price-consensus-chart | Western Digital Corporation Quote At Computex, Western Digital introduced the OpenFlex Data24 4100 EBOF, designed for cloud environments using single-port SSDs and system-level mirroring. It joins the Data24 4000 series. The new Ultrastar Data102 3000 ORv3 JBOD, aligned with Open Rack v3 specifications, offers improved efficiency, airflow and manageability. Located in Colorado Springs, the OCCL is a vendor-neutral innovation hub designed to accelerate industry-wide adoption of open, fabric-attached storage and SDS solutions. OCCL 2.0 introduces new capabilities such as comprehensive solutions architecture guidance for deploying disaggregated infrastructure, best practice frameworks for maximizing storage efficiency and benchmarking tools for evaluating SSD partner performance. With these updates, OCCL 2.0 aims to deepen collaboration with ecosystem partners while helping customers reduce deployment risks, improve interoperability and build future-ready infrastructure. The lab continues to play a pivotal role in shaping the next generation of composable architectures, with a growing list of ecosystem collaborators that includes Arista Networks, Broadcom, DapuStor, Graid Technology, Ingrasys, Intel, Kioxia, MinIO, NVIDIA, OSNexus, PEAK:AIO, Phison, SanDisk, ScaleFlux, ThinkParQ/BeeGFS and Xinnor. As the industry moves away from proprietary models, Western Digital's OCCL 2.0 strengthens its leadership in creating flexible, open ecosystems that meet the performance, efficiency and scale demands of modern data infrastructure. Management expects the proliferation of generative AI-driven storage deployments to result in a client and consumer device refresh cycle and boost content growth in smartphone, gaming, PC and consumer in the long run. Increasing AI adoption is likely to drive increased storage demand across both HDD and Flash at the edge and core, thereby providing ample business opportunities. As demand grows, high-bandwidth memory (HBM) becomes key for AI servers, while NAND flash remains vital for storage, powering SSDs for text, images and videos. Gen AI adoption is driving eSSD sales due to its speed, reliability and efficiency over HDDs. Growing AI data boosts demand, fueling eSSD market growth and reshaping storage. Western Digital currently carries a Zacks Rank #5 (Strong Sell). Shares of the company have lost 31.4% in the past year compared with the Zacks Computer- Storage Devices industry's decline of 31.5%. You can see the complete list of today's Zacks #1 (Strong Buy) Rank stocks here. Image Source: Zacks Investment Research Some better-ranked stocks from the broader technology space are TaskUs, Inc. TASK, SAP SAP and Teradata Corporation TDC. TASK sports a Zacks Rank #1 (Strong Buy) while SAP and TDC carry a Zacks Rank #2 (Buy). TaskUs' earnings beat the Zacks Consensus Estimate in two of the trailing four quarters, with the average surprise being 6.39%. In the last reported quarter, TASK delivered an earnings surprise of 18.75%. Its shares have soared 11.8% in the past year. SAP's earnings beat the Zacks Consensus Estimate in each of the trailing four quarters, with the average surprise being 10.14%. In the last reported quarter, SAP delivered an earnings surprise of 8.63%. The company's long-term earnings growth rate is 10.2%. Its shares have surged 53.4% in the past year. Teradata's earnings beat the Zacks Consensus Estimate in each of the trailing four quarters with the average surprise being 24.63%. In the last reported quarter, TDC delivered an earnings surprise of 15.79%. Its shares have declined 31.1% in the past year. Want the latest recommendations from Zacks Investment Research? Today, you can download 7 Best Stocks for the Next 30 Days. Click to get this free report Western Digital Corporation (WDC) : Free Stock Analysis Report SAP SE (SAP) : Free Stock Analysis Report Teradata Corporation (TDC) : Free Stock Analysis Report TaskUs, Inc. (TASK) : Free Stock Analysis Report This article originally published on Zacks Investment Research ( Zacks Investment Research Error in retrieving data Sign in to access your portfolio Error in retrieving data Error in retrieving data Error in retrieving data Error in retrieving data
Channel Post MEA
20-05-2025
- Business
- Channel Post MEA
Western Digital Displays Wide Range of Storage Solutions at Computex 2025
Western Digital is redefining what's possible in storage infrastructure for AI/ML, disaggregated storage and software-defined storage (SDS) for CSPs, enterprises and STaaS providers. From massive-capacity, reliable JBODs (Just a Bunch of Disks) to ultra-fast EBOF (Ethernet Bunch of Flash) NVMe-oF disaggregated storage solutions for AI, the company's Platforms Business delivers world-class HDD- and SSD-based solutions that power today's most demanding workloads. As AI, ML and data-heavy workloads continue to accelerate, organizations face growing pressure to build flexible storage infrastructures that are scalable, efficient and sustainable. Traditional systems may struggle to keep pace with modern demands. Giving customers the flexibility to scale and the freedom to avoid vendor lock-in, Western Digital is announcing the expansion of the company's Open Composable Compatibility Lab (OCCL); a new Ultrastar Data102 ORv3 JBOD and a OpenFlex Data24 4100 with single-port SSDs; as well as new SSD qualifications for its OpenFlex Data24 NVMe-oF storage platform. Open Lab. Smarter Infrastructure. OCCL 2.0 is Here. Western Digital's Open Composable Compatibility Lab (OCCL) in Colorado Springs accelerates industry-wide interoperability for fabric-attached devices and software-defined storage. Designed for CSPs and enterprise customers, the OCCL serves as a vendor-neutral proving ground to simulate real-world environments and workloads—providing critical insights into system compatibility, interoperability, energy efficiency, and performance optimization. For modern NVMe-oF architectures, OCCL provides testing across disaggregated compute, storage and networking to help customers scale more efficiently, reduce costs, and deploy with greater confidence. Key enhancements include: Solutions Architectures : OCCL 2.0 will generate detailed solutions architectures, offering guidance on deploying and managing composable disaggregated infrastructure effectively. : OCCL 2.0 will generate detailed solutions architectures, offering guidance on deploying and managing composable disaggregated infrastructure effectively. Disaggregated Storage Best Practices : OCCL 2.0 will highlight best practices for disaggregated storage, helping organizations to maximize efficiency and scalability. : OCCL 2.0 will highlight best practices for disaggregated storage, helping organizations to maximize efficiency and scalability. Industry Expertise : OCCL 2.0 will continue to be a source of thought leadership, sharing strategic insights and innovations in the field of composable infrastructure. : OCCL 2.0 will continue to be a source of thought leadership, sharing strategic insights and innovations in the field of composable infrastructure. SSD Partner Benchmarking: OCCL 2.0 will include comprehensive results from benchmarking tools to evaluate the performance of SSD partners, ensuring optimal storage solutions. These advancements will further solidify OCCL's role as a leading lab in the industry for creating partnerships with customers and suppliers, benchmarking for establishing architectural control points, and driving forward the adoption and implementation of new open ecosystems to replace proprietary architectures. OCCL 2.0 growing list of ecosystem participants include: Arista Networks, Broadcom, DapuStor, Graid Technology Inc., Ingrasys, Intel, Kioxia, MinIO, NVIDIA, OSNexus, PEAK:AIO, Phison, Sandisk, ScaleFlux, ThinkParQ Gmbh/BeeGFS, and Xinnor. New Product Enhancements for Cloud and Enterprise Workloads At Computex, Western Digital is also introducing the new OpenFlex Data24 4100 EBOF to its Data24 4000 series, complementing the already available Data24 4200 dual-port SSD model. The Data24 4100 is designed for cloud-like environments where high availability is not a primary requirement. It uses single-port SSDs where performance is optimized via a single connection to each SSD and redundancy is provided by mirroring the storage system. This new addition ensures that customers have access to the best options for optimizing their storage infrastructure. The Data24 4100 is expected to be available in CQ3 2025. The new Ultrastar Data102 3000 ORv3 JBOD is designed to meet the increasing data demands of cloud data centers. In alignment with the broader Open Compute Project (OCP) initiative, the Data 102 3000 ORv3 is designed to meet the Open Rack v3 (ORv3) specification, which focuses on rack design and power supply regulation. Complying with Rack Geometry Option 1, this future-ready solution is designed to deliver improved power efficiency, better airflow, and enhanced system manageability over the prior generation design. Additionally, the ORv3 version of the Ultrastar Data 102 3000 leverages common building blocks from the 3000 series such as controllers, enclosures, and Customer Replaceable Units (CRUs), and complies with FIPS 140-3 Level 3 and TAA standards, making it a robust and reliable choice for modern data centers. The Data 102 3000 is expected to be available in CQ4 2025. Flexibility and Choice: Now Qualifying Multiple SSD Vendors Western Digital's Platforms business now offers customers enhanced flexibility and choice in building their storage infrastructure. By supporting a multi-SSD vendor strategy, Western Digital has currently qualified SSDs with leading providers such as DapuStor, Kioxia, Phison, Sandisk and ScaleFlux with additional vendors in the qualification process. This approach empowers both Western Digital and its customers to leverage preferred suppliers while optimizing for performance, cost, and supply chain resilience. By qualifying multiple SSD vendors, Western Digital ensures that customers have access to the best possible options for their storage infrastructure, reinforcing its commitment to innovation and excellence in the industry. 'As workloads grow more complex and AI accelerates infrastructure demands, the future will be defined by those who can scale smarter, move faster, and deploy with confidence,' said Owais Mohammed, Sales Director, IMEA of Western Digital. 'With OCCL 2.0 and our latest Platform innovations, we're not just keeping up—we're setting the pace for what modern, disaggregated, and software-defined data centers can achieve. We remain deeply committed to enabling open, flexible architectures that empower customers to build scalable infrastructure tailored to their evolving data needs.' Meet Western Digital at Computex: Experience the Future of Data Infrastructure Visit Western Digital at Computex in Taipei. Find us at booth J1303a in Hall 1 Storage and Management Solutions at the Taipei Nangang Exhibition Center from May 20-23. Western Digital's OpenFlex Data 24 NVMe-oF data storage platform, RapidFlex NVMe-oF controllers, Ultrastar Data102 hybrid storage platform and the Ultrastar Transporter will be on display. 0 0
Yahoo
15-05-2025
- Business
- Yahoo
Western Digital, Ingrasys Partner for Next-Gen Fabric-Attached Storage
Western Digital Corporation WDC recently teamed up with Ingrasys, a subsidiary of Foxconn Technology Group, to transform the way storage and networking are deployed at scale. The initiative aims to engineer a Top-of-Rack (TOR) Ethernet Bunch of Flash (EBOF) switch with embedded storage—a new frontier in fabric-attached, disaggregated infrastructure designed to meet the surging data demands of AI and high-performance state-of-the-art TOR EBOF switch integrates Western Digital's RapidFlex NVMe-oF bridge technology directly into a high-performance TOR switch. This convergence eliminates the need for separate storage networks, minimizes data movement latency and offers greater flexibility and scalability. Per the agreement, the TOR switch will be manufactured by Ingrasys, leveraging its expertise in high-density, GPU-optimized systems, while WDC will lead the architecture and go-to-market efforts, with a vision to make NVMe-oF disaggregated storage mainstream among cloud service providers (CSPs) and storage OEMs. The next-generation TOR switch from Ingrasys is expected to hit the market in 2027, featuring top-notch design and performance. At the core of the embedded storage architecture is WDC's RapidFlex, offering 100G Ethernet connectivity and support for NVMe/PCIe Gen6 E3.S/L SSDs. The switch leverages NVIDIA's Spectrum-4 ASIC, ensuring best-in-class switching performance and ultra-low latency. Offering flexible 400GbE and 800GbE cabling, the switch is designed for emerging hyperscale and enterprise data center NVMe-oF fabric bridge is an innovative solution for fabric-attached storage, designed for modern data centers. It stands out as the only NVMe-oF bridge that relies heavily on hardware acceleration and eliminates firmware from the data path. This enables I/O read and write operations to pass through the adapter with very low latency via direct Ethernet. This unique design supports smooth, high-speed integration of NVMe SSDs into disaggregated systems, allowing storage to scale independently from computing generative AI, real-time analytics and high-throughput data applications become central to business operations, data center operators are under constant pressure to innovate. This flagship initiative is likely to become a key catalyst in next-generation data center design, aligning with trends like edge computing, data locality, GPU-driven workloads and software-defined infrastructure. The company expects the growing use of generative AI to drive a refresh cycle in client and consumer devices, boosting content growth in smartphones, gaming, PCs and more. Gen AI adoption jumped from 33% in 2023 to 65% in 2024, increasing storage demand for both HDDs and Flash. High-bandwidth memory is key for AI servers, while NAND flash powers SSDs for storing text, images and video. As AI data grows, eSSD sales rise due to their speed, reliability, and efficiency, helping reshape the storage ongoing macroeconomic volatility and uncertainty caused by the damaging impact of levying tariffs and escalating global trade conflicts remain concerns for management in the near term, as these are likely to create demand fluctuations in areas such as the enterprise segment and parts of its distribution and retail business. Despite the broader uncertainty in the environment, demand from its hyperscale customers remains strong amid a constrained supply February 2025, Western Digital completed the separation of its HDD and Flash businesses into two independent, publicly traded companies, each with a specific focus on its respective market. With a deep understanding of memory and storage technology, the new SanDisk is ready to meet market demands. It is well-equipped to take advantage of AI opportunities while maximizing the value of its products for both consumers and businesses. WDC currently carries a Zacks Rank #5 (Strong Sell). Shares of the company have lost 33.6% in the past year compared with the Computer- Storage Devices industry's decline of 31.7%. Image Source: Zacks Investment Research Some better-ranked stocks from the broader technology space are Juniper Networks, Inc. JNPR, InterDigital, Inc. IDCC and Ubiquiti Inc. UI. JNPR presently sport a Zacks Rank #1(Strong Buy), while IDCC & UI carries a Zacks Rank #2 (Buy). You can see the complete list of today's Zacks #1 Rank stocks is leveraging the 400-gig cycle to capture hyperscale switching opportunities inside the data center. The company is set to capitalize on the increasing demand for data center virtualization, cloud computing and mobile traffic packet/optical convergence. Juniper also introduced new features within the AI-driven enterprise portfolio that enable customers to simplify the rollout of their campus wired and wireless networks while bringing greater insight to network operators. In the last reported quarter, it delivered an earnings surprise of 4.88%.IDCC is a pioneer in advanced mobile technologies that enable wireless communications and capabilities. The company engages in designing and developing a wide range of advanced technology solutions, which are used in digital cellular as well as wireless 3G, 4G and IEEE 802-related products and networks. It has a long-term growth expectation of 15%.Ubiquiti's effective management of its strong global network of more than 100 distributors and master resellers improved its visibility for future demand and inventory management techniques. In the last reported quarter, Ubiquiti delivered an earnings surprise of 33.3%. Its highly flexible global business model remains well-suited to adapt to the changing market dynamics to overcome challenges while maximizing growth. Want the latest recommendations from Zacks Investment Research? Today, you can download 7 Best Stocks for the Next 30 Days. Click to get this free report Western Digital Corporation (WDC) : Free Stock Analysis Report Juniper Networks, Inc. (JNPR) : Free Stock Analysis Report InterDigital, Inc. (IDCC) : Free Stock Analysis Report Ubiquiti Inc. (UI) : Free Stock Analysis Report This article originally published on Zacks Investment Research ( Zacks Investment Research Error in retrieving data Sign in to access your portfolio Error in retrieving data Error in retrieving data Error in retrieving data Error in retrieving data
Business Wire
14-05-2025
- Business
- Business Wire
Western Digital and Ingrasys Establish Long-term Collaboration to Deliver High-Performance, Fabric-Attached Disaggregated Storage for AI Workflows
SAN JOSE, Calif. & TAIPEI, Taiwan--(BUSINESS WIRE)-- (Computex 2025) – Western Digital (Nasdaq: WDC) and Ingrasys, a subsidiary of Foxconn Technology Group, the world's largest electronics manufacturer, today announced a strategic collaboration to deliver a new flagship Top-of-Rack (TOR) switch with embedded storage. This new TOR EBOF (Ethernet Bunch of Flash) will provide distributed storage at the network edge for lower latency storage access, reducing the need for separate storage networks and avoiding trips to centralized storage arrays. In this joint effort, Ingrasys will manufacture the high-density TOR EBOF, leveraging Western Digital's RapidFlex™ NVMe-oF™ bridge technology. Western Digital will collaborate with Ingrasys on the architecture and lead the go-to-market efforts to promote NVMe-oF disaggregated storage solutions for cloud service providers (CSPs) and storage OEMs. This collaboration marks a significant milestone in the rapidly expanding AI market, accelerating the adoption of fabric-attached disaggregated storage to meet the ever-growing demands of AI workflows. This collaboration marks a significant milestone in the rapidly expanding AI market, accelerating the adoption of fabric-attached disaggregated storage to meet the ever-growing demands of AI workflows. By combining Ingrasys' world-class manufacturing capabilities expertise in GPU servers, and Western Digital's expertise in NVMe-oF and fabric-attached storage, the two companies are enabling more flexible disaggregated infrastructure that unlocks new levels of efficiency, scalability, and performance for data centers tackling the challenges of AI at scale. The Ingrasys TOR EBOF, targeted for 2027 availability, represents a cutting-edge integration of networking and storage technologies. This innovative TOR switch features embedded storage capabilities enabled by Western Digital's next-generation RapidFlex Fabric bridge device supporting 100G Ethernet and NVMe™/PCIe® Gen6 drive slots for E3.S/L SSD devices. At its core, the TOR switch is powered by the NVIDIA Spectrum™-4 switch ASIC, ensuring high-performance switching. The switch also offers flexibility with 400/800GbE cabling options making it a robust solution for future data center needs. Western Digital's RapidFlex NVMe-oF fabric bridge device is a pioneering solution in fabric-attached storage, offering low-power, extreme performance and flexibility for modern data centers. As the only NVMe-oF bridge device that is based on extensive levels of hardware acceleration and removes firmware from the performance path, the I/O read and write payload flows through the adapter with minimal latency and direct Ethernet connectivity. This differentiated approach facilitates seamless, high-performance integration of NVMe SSDs into disaggregated architectures, allowing for efficient scaling of storage resources independently from compute. 'Together with Ingrasys, we continue to accelerate the shift toward disaggregated infrastructure by co-developing cutting-edge, fabric-attached solutions designed for the data demands of AI and modern workloads. This collaboration brings together two leaders in storage infrastructure modernization to deliver flexible, scalable architectures that unlock new levels of efficiency and performance for our customers,' said Kurt Chan, vice president and general manager, Western Digital Platforms Business. 'Our collaboration with Western Digital reflects a shared commitment to long-term innovation and customer-centric design. By combining our expertise in scalable system integration with Western Digital's leadership in storage technologies, we're building a foundation for future-ready, fabric-attached solutions that will meet the evolving demands of AI and disaggregated infrastructure. This partnership is just the beginning of what we believe will be a lasting journey of co-innovation,' said Benjamin Ting, president of Ingrasys. 'The collaboration between Western Digital and Ingrasys brings together the high-performance storage and scalable system transformation needed to fully unlock the potential of accelerated computing. As AI and data-intensive workloads push infrastructure limits, this joint effort is set to deliver the performance, low latency, and disaggregated scalability that next-generation data centers require,' said Gilad Shainer, senior vice president of networking at NVIDIA. Meet Western Digital at Computex: Experience the Future of Data Infrastructure Visit Western Digital's at Computex in Taipei. Find us at booth J1303a in Hall 1 Storage and Management Solutions at the Taipei Nangang Exhibition Center from May 20-23. About Ingrasys Ingrasys, a subsidiary of Foxconn Technology Group, is a global leader in cloud infrastructure and AI computing solutions. The company delivers high-performance servers, storage systems, AI accelerators, and rack-scale platforms with advanced liquid cooling. Backed by a vertically integrated supply chain and engineering expertise, Ingrasys drives AI innovation to empower the next generation of sustainable data centers. Learn more at About Western Digital Western Digital empowers the systems and people who rely on data. Consistently delivering massive capacity, high quality and low TCO, Western Digital is trusted by hyperscale cloud providers, enterprise data centers, content professionals and consumers around the world. Core to its values, the company recognizes the urgency to combat climate change and is on a mission to design storage technologies that not only meet today's data demands but also contribute to a more climate-conscious future. Follow Western Digital on LinkedIn and learn more at Forward-Looking Statements This press release contains forward-looking statements within the meaning of federal securities laws, including statements regarding expectations for: the outcome, impact, performance, value and timeline of the strategic collaboration between Western Digital and Ingrasys; AI- and data-driven uses and demand for data storage solutions; and market opportunities. These forward-looking statements are based on management's current expectations and are subject to risks and uncertainties that could cause actual results to differ materially from those expressed or implied in the forward-looking statements. Key risks and uncertainties that could cause actual results to differ materially from those expressed or implied in the forward-looking statements include: adverse global or regional conditions, including new or additional tariffs or trade restrictions; volatility in demand for Western Digital's products; inflation; increases in interest rates and an economic recession; future responses to and effects of global health crises; the impact of business and market conditions; the outcome and impact of Western Digital's completed separation of its HDD and Flash businesses, including with respect to stock price volatility and the diversion of management's attention from ongoing business operations and opportunities; the impact of competitive products and pricing; Western Digital's development and introduction of products based on new technologies and expansion into new data storage markets; risks associated with cost saving initiatives, restructurings, acquisitions, divestitures, mergers, joint ventures and Western Digital's strategic relationships; difficulties or delays in manufacturing or other supply chain disruptions; hiring and retention of key employees; Western Digital's level of debt and other financial obligations; changes to Western Digital's relationships with key customers; compromise, damage or interruption from cybersecurity incidents or other data system security risks; actions by competitors; any decisions to reduce or discontinue paying cash dividends; Western Digital's ability to achieve its greenhouse gas emissions reduction and other sustainability goals; the impact of international conflicts; risks associated with compliance with changing legal and regulatory requirements and the outcome of legal proceedings; and other risks and uncertainties listed in Western Digital's filings with the Securities and Exchange Commission (the 'SEC'), including Western Digital's Annual Report on Form 10-K filed with the SEC on August 20, 2024 and Quarterly Report on Form 10-Q filed with the SEC on May 2, 2025, to which your attention is directed. You should not place undue reliance on these forward-looking statements, which speak only as of the date hereof, and Western Digital undertakes no obligation to update or revise these forward-looking statements to reflect new information or events, except as required by law. © 2025 Western Digital Corporation or its affiliates. All rights reserved. Western Digital, the Western Digital design, the Western Digital logo, and RapidFlex are registered trademarks or trademarks of Western Digital Corporation or its affiliates in the US and/or other countries. NVIDIA and NVIDIA Spectrum are trademarks and/or registered trademarks of NVIDIA Corporation. The NVMe and NVMe-oF word marks are trademarks of NVM Express, Inc. PCIe is a registered trademark and/or service mark of PCI-SIG in the U.S. and/or other countries. All other marks are the property of their respective owners. Product specifications are subject to change without notice. Pictures shown may vary from actual products. 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