Latest news with #HiSilicon
Yahoo
4 days ago
- Business
- Yahoo
Ex-Huawei semiconductor secret thieves sentenced to jail
When you buy through links on our articles, Future and its syndication partners may earn a commission. 14 ex-Huawei workers have been sentenced to jail over secret theft Former engineers went on to work at Wi-Fi chip startup Zunpai Huawei has been on both sides of the IP legal fence A Shanghai court has sentenced 14 former Huawei employees to jail for stealing chip-related business secrets, sending ripples across the industry not just in China but also globally. The employees worked for Zunpai Communication Technology – a startup founded be engineers from HiSilicon, a Huawei unit. The court issued jail terms of up to six years and imposed further financial penalties in a July 28 ruling which landed in Huawei's favor. Shanghai court jails former Huawei engineers over secret stealing After leaving Huawei in 2019, Zhang Kun, a former researcher at HiSilicon, founded Zunpai in 2021 and hired former coworkers. The startup was accused of using proprietary information by Huawei, despite the fact that the company developed Wi-Fi communication chips. According to court documents from August 2023, the Huawei subsidiary requested that the Shanghai Intellectual Property court freeze assets under Zunpai and its subsidiaries valued at 95 million yuan. The court's decision has not been made public online, and Huawei has not made any public remarks regarding the case. According to a South China Morning Post report, the engineers may still have grounds to challenge the decision. More broadly, it reflect a growing commitment in China toward protecting IP, with China's Supreme People's Procuratorate stating that 21,000 people were criminally prosecuted for IP crimes in 2024 alone, including a nine-year sentence for criminal copyright infringement of Lego bricks (via National Law Review). For Huawai, though, it represents a reversal of roles. In 2019, the Shenzhen tech giant was indicted on ten counts of stealing Western technology, attempting to steal secrets, wire fraud, and obstruction of justice. TechRadar Pro has contacted Huawei for a comment, but we did not receive an immediate response. You might also like This huge US router brand could be banned from operating in most of Europe due to patent litigation We've listed the best job sites and best recruitment platforms Check out the best productivity apps
Phone Arena
5 days ago
- Business
- Phone Arena
Ex-employees of this major phone maker are now sentenced to jail for stealing chip secrets
The Huawei Mate X6 for reference. | Image by PhoneArena A total of 14 ex-Huawei employees will find themselves behind bars – they were found guilty and sentenced to prison for stealing Huawei secrets. A court in Shanghai has sentenced the former staff for misappropriating trade secrets related to chip technology, according to reports. The ruling was issued recently by the Shanghai Third Intermediate People's Court and found the individuals guilty of stealing intellectual property after they left Huawei's chip division, HiSilicon, to form a new company. The convicted employees were working for the start-up Zunpai Communication Technology and received prison sentences of up to six years, in addition to financial penalties. As of now, the court has not made the full ruling publicly available, the overseas media informs us, and it remains unclear whether the defendants plan to appeal. Huawei has not issued a comment in response to the verdict. The case has sent a ripple through China's semiconductor sector, drawing fresh attention to ongoing concerns about intellectual property protection. According to the reports, Zhang Kun, previously a researcher at HiSilicon, left Huawei in 2019 and launched Zunpai in March 2021 with the goal of developing Wi-Fi communication chips. He succeeded in recruiting several of his former colleagues to join the venture. Huawei responded swiftly. In August 2023, a legal filing revealed that Shanghai HiSilicon Technology, a Huawei subsidiary, petitioned the Shanghai Intellectual Property Court to freeze assets worth 95 million yuan (approximately US$13.1 million) belonging to Zunpai and its related said the smartphone world is a boring one, is mistaken. Some iPhone screens are made by BOE. | Image by PhoneArena Mere hours ago, it became known that trouble continues to mount for Chinese display maker BOE. Following reports that Apple may drop the company over cracking issues with iPhone 17 screens – and the looming threat of a US trade ban – BOE now faces the possibility of a new investigation by the US Department of Defense. As we told you, the inquiry would be launched at the request of the House Armed Services Committee as part of an amendment to the $852 billion US defense budget currently under review. Lawmakers suspect BOE may be supporting China's military through government-subsidized production of small display technologies with potential military Secretary of Defense has until February 1, 2026, to determine whether BOE or its affiliates should be classified as military-linked companies. If added to the list, BOE could be barred from supplying the US military, though it would still be allowed to do business with American commercial clients – including Apple.
South China Morning Post
5 days ago
- Business
- South China Morning Post
Ex-Huawei employees sentenced to jail for stealing semiconductor-related secrets
A Shanghai court sentenced 14 former Huawei Technologies employees to jail for stealing chip-related business secrets from the company, the state-owned Securities Times newspaper reported on Saturday. According to the report, the Shanghai Third Intermediate People's Court on July 28 sentenced 14 employees of Zunpai Communication Technology, a start-up founded by engineers from Huawei's chip development unit HiSilicon , to jail terms of up to six years on top of financial penalties. The court has not published the verdict on its website and it is not known whether the engineers will appeal the ruling. Huawei did not immediately reply to a request for comment. The case sent shock waves through China's semiconductor industry and highlighted the issue of intellectual property theft on the mainland. According to the Securities Times report, Zhang Kun, a former researcher at HiSilicon, left Huawei in 2019 and founded Zunpai in March 2021 to develop Wi-fi communication chips. Zhang managed to persuade some of his former colleagues to join him at the start-up. Huawei Technologies quickly took action against Zunpai. According to a legal document published in August 2023, Shanghai HiSilicon Technology, a Huawei subsidiary, applied to the Shanghai Intellectual Property Court to freeze 95 million yuan (US$13.1 million) worth of assets under Zunpai and its subsidiaries.
Yahoo
29-07-2025
- Automotive
- Yahoo
Rising Global Demand and Strategic Export Through Hong Kong Trade Hub Fueling Expansion
In 2024, China's automotive semiconductor exports hit USD 419.15 billion, propelled by the rise in autonomous and electric vehicles. The sector is fueled by significant investments from top domestic companies such as SMIC, Huawei's HiSilicon, and BYD Semiconductor, alongside global giants like Intel and Samsung. Government support and funding, including the National Integrated Circuit Industry Investment Fund, aid market growth. Memory chips rank as the second-largest segment, crucial for AI and automotive applications. India is a major importer, driving demand with its booming electronics market. The report delves into export trends, market dynamics, and key industry players. Chinese Semiconductor Market for Automotive Dublin, July 29, 2025 (GLOBE NEWSWIRE) -- The "China Semiconductor Market for Automotive by Component (Microcontroller, Power Semiconductor, Sensor & MEMS Device, Memory Chip, Analog & Mixed Signal IC), Global & China Semiconductor Export, Alternate Destination - Trends and Strategic Recommendation" report has been added to 2024, China's exports of automotive semiconductors reached USD 419.15 billion in 2024, from USD 280.81 billion in 2020, with a CAGR of 8.9%, driven by increased sales of autonomous and electric vehicles. The report provides valuable information for market leaders and new entrants regarding revenue estimates for both the overall automotive semiconductor market in China and its sub-segments. It will assist stakeholders in understanding the competitive landscape, positioning their businesses more effectively, and planning appropriate go-to-market strategies. Additionally, the report offers insights into the current market conditions and highlights key drivers, restraints, challenges, and opportunities within the industry. China's semiconductor market for the automotive sector is experiencing substantial investment from both domestic and global companies. Major players such as SMIC, Huawei's HiSilicon, YMTC, BYD Semiconductor, and Tsinghua Unigroup are leading domestic efforts, while international firms like Intel, Samsung, and SK Hynix are expanding their presence through joint ventures and new fabrication plants. The Chinese government supports the market with the National Integrated Circuit Industry Investment Fund (Big Fund), local government funds, subsidies, tax breaks, and low-interest loans, all aimed at achieving self-sufficiency and a complete supply global demand for advanced electronics and automotive technologies surges, China exports semiconductors worldwide, often using Hong Kong as a trade hub. The rise of modern vehicles, primarily electric and connected cars, has significantly increased the demand for semiconductors, as these vehicles require advanced chips for powertrain control, advanced driver assistance, infotainment, and battery management. Consequently, the automotive sector has become a key driver of semiconductor growth in chips are the second-largest segment in China's automotive semiconductor chips rank second in the Chinese automotive semiconductor market. These chips also hold the second-largest position in the global semiconductor industry due to soaring demand for data storage and processing, driven by AI, data centers, consumer electronics, and advanced automotive technologies. Memory chips are vital for storing and retrieving data in electronic devices, enabling everything from application execution to real-time system operations - an essential requirement for modern vehicles that rely on significant amounts of data for infotainment, ADAS, and autonomous driving features. Memory chips are extensively used in high-end infotainment systems, ADAS, and digital instrument clusters in and autonomous vehicles demand even more memory due to their complex computing and data processing needs. China is focusing on boosting domestic production of mature-node chips while also making significant advancements in advanced memory technology, particularly in NAND and DRAM, with companies like YMTC and CXMT leading the way. YMTC has developed advanced 3D TLC NAND chips that compete with global leaders like Samsung and Micron, while CXMT has produced and released G4 DDR5 DRAM. SMIC has also manufactured 7 nm chips for Huawei's Mate 60 is the second-largest importer of semiconductors from is the second-largest importer of electronics, integrated circuits, and memory chips worldwide. This is primarily due to the country's robust electronics sector, digitalization, and the lack of large-scale domestic semiconductor manufacturing. In 2024, imports of electronic integrated circuits from China alone reached USD 6.1 million. These components are essential in the automotive sector for advanced features such as infotainment, ADAS, telematics, and digital instrument clusters, which require significant memory and processing power. The Indian market for advanced automotive features is rapidly growing, driven by rising consumer demand for connectivity, safety, and adoption of EVs and connected cars is accelerating, supported by government initiatives like the Faster Adoption and Manufacturing of Hybrid and Electric Vehicles (FAME) scheme. Investment in India's electronics and semiconductor ecosystem is also on the rise, with both domestic and international companies expanding production and R&D. The government has launched incentive programs such as the Production-Linked Incentive (PLI) scheme for electronics manufacturing, further increasing demand for imported memory and integrated circuits as local supply struggles to keep pace. Recent examples include automakers like Tata Motors and Mahindra integrating more sophisticated electronics into their latest models, reflecting the broader trend of technology-driven growth in India's automotive and electronics Coverage:The report provides an in-depth analysis of the China semiconductor market for automotive, focusing on various types, including microcontrollers, power semiconductors, sensors & MEMS devices, memory chips, and analog & mixed-signal integrated circuits. It examines export trends, the impact of trade policies and restrictions, and the diversification of the semiconductor industry away from China. The report also explores alternative manufacturing destinations, offering a comparative analysis of these locations, along with the challenges and strategies associated with the the report assesses the effects of the global automotive sector on the semiconductor market and presents a future outlook. It includes detailed information about the major factors driving growth in China's semiconductor market. A thorough analysis of key industry players provides insights into their business overviews, product offerings, key strategies, contracts, partnerships, agreements, new product launches, mergers, and report provides insights into the following points: Analysis of critical drivers (increased domestic investments in semiconductors), restraints (shortage of manufacturing facilities for 12 mm machines), opportunities (substantial investments by < 12-inch wafer manufacturers), and challenges (technological gap) influencing the growth of the China semiconductor market for automotive Product Development/Innovation: Detailed insights into upcoming technologies and new products launched in the China semiconductor market for automotive Market Development: Comprehensive market information - the report analyses the authentication and brand protection market across Chinese countries Market Diversification: Exhaustive information about new products & services, untapped geographies, recent developments, and investments in the China semiconductor market for automotive Competitive Assessment: In-depth assessment of market shares, growth strategies, and service offerings of leading players, such as SMIC, GigaDevice Semiconductor Inc., Novosense Microelectronics, Silan Microelectronics, and HiSilicon Key Attributes: Report Attribute Details No. of Pages 104 Forecast Period 2020 - 2024 Estimated Market Value (USD) in 2020 $280.81 Billion Forecasted Market Value (USD) by 2024 $419.15 Billion Compound Annual Growth Rate 8.9% Regions Covered China, Global Key Topics Covered: 1 Introduction1.1 Global Automotive Semiconductor Industry Overview1.2 Historical Development of China Automotive Semiconductor Industry1.3 Key Factors Driving Industry Shift from China1.3.1 Regulatory Factors1.3.1.1 Restrictive Controls by Us Government1.3.1.2 Chips Act and Other Global Legislation1.3.1.3 National Security Concerns1.3.2 Geopolitical Factors1.3.2.1 Taiwan Strait Tensions1.3.2.2 Russia-Ukraine War1.3.2.3 Technology Alliances1.3.2.4 Technology Limitations1.3.3 Economic and Supply Chain Factors1.3.3.1 Rising Manufacturing Costs in China1.3.3.2 Incentives from Alternative Locations1.3.4 Challenges1.3.4.1 Dependency on Foreign Ip & Architecture and Gaps in Certification1.3.4.2 Heavy Reliance on Imported Semiconductor Manufacturing Equipment2 China Automotive Semiconductor Industry2.1 Current State of China's Automotive Semiconductors2.1.1 Microcontrollers2.1.1.1 Key Manufacturers, Core Competencies, and Production Capacities2.1.1.2 Future Roadmap2.1.2 Power Semiconductors2.1.3 Sensors & Mems2.1.4 Memory Chips2.1.5 Analog & Mixed-Signal Integrated Circuits2.2 Market Value Assessment3 Key Players in China Automotive Semiconductor Industry3.1 Domestic Manufacturers3.1.1 SMIC3.1.1.1 Overview3.1.1.2 Recent Financials3.1.1.3 Production Plants and Capacity3.1.1.4 Future Strategy3.1.2 Gigadevice3.1.3 Novosense Microelectronics3.1.4 Silan Microelectronics3.1.5 Hisilicon3.1.6 Hua Hong Semiconductor Limited3.1.7 Byd Semiconductor3.1.8 Nexperia3.1.9 Changxin Memory Technologies3.1.10 Yangtze Memory Technologies Corp3.1.11 Goertek Microelectronics Inc.3.1.12 China Resources Microelectronics Limited3.1.13 Hesai Technology3.2 Global Manufacturers in China3.2.1 Nxp Semiconductors3.2.2 Infineon Technologies3.2.3 Stmicroelectronics3.2.4 Texas Instruments3.2.5 Renesas Electronics Corporation3.3 Joint Ventures and Strategic Partnerships4 Export Analysis of China's Automotive Semiconductors4.1 Key Export Product Categories4.2 Global Semiconductor Exports4.3 Exports from China5 Diversification of China Automotive Semiconductor Industry5.1 Geopolitical Factors5.1.1 US-China Trade Tensions5.1.1.1 US-China Tariffs5.1.1.2 Diversification Strategies5.1.2 Technology Export Controls5.1.2.1 Us & Chinese Technology Export Controls5.1.2.2 Impact of Export Controls5.1.3 National Security Concerns5.2 Supply Chain Resilience Strategies5.2.1 Knowledge Gained from COVID-19 Pandemic5.2.1.1 Realization by China After COVID-195.2.1.2 Impact on Global Players5.2.1.3 Shift from Jit to Strategic Resilience5.3 Economic Factors5.3.1 Rising Manufacturing Costs in China5.3.1.1 Cost Comparison5.3.1.2 Bill of Materials5.3.2 Incentive Programs in Alternative Locations5.4 Impact on Global Automotive Industry5.4.1 Effects on Automotive Production Costs5.4.2 Supply Chain Reliability and Resilience5.4.3 Regional Manufacturing Clusters5.4.4 Technology Development and Innovation Patterns6 Alternative Manufacturing Destinations6.1 Overview6.2 Comparative Analysis of Alternative Manufacturing Locations6.2.1 Ranking as Alternatives to China6.3 Technology Dominance, by Country/Region6.4 Southeast Asia6.4.1 Malaysia6.4.1.1 Government Incentives and Support6.4.1.2 Key Diversifications6.4.1.3 Challenges6.4.2 Vietnam6.4.3 Thailand6.4.4 Singapore6.4.5 South Korea6.4.6 Taiwan6.5 North America6.6 Europe6.7 India7 Future Outlook and Recommendations7.1 Projected Industry Shifts, 2025-20307.2 Technology Roadmap7.3 Strategic Recommendations for Industry Stakeholders7.3.1 Diversification7.3.2 Technology7.3.3 Supply ChainFor more information about this report visit About is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends. Attachment Chinese Semiconductor Market for Automotive CONTACT: CONTACT: Laura Wood,Senior Press Manager press@ For E.S.T Office Hours Call 1-917-300-0470 For U.S./ CAN Toll Free Call 1-800-526-8630 For GMT Office Hours Call +353-1-416-8900Sign in to access your portfolio
Phone Arena
06-07-2025
- Business
- Phone Arena
Huawei's next AP for the Mate 80 series rumored to have 20% hike in performance
Huawei's HiSilicon unit was once a highly regarded team of chip designers, and Huawei was TSMC's second-largest customer after Apple. Only now is Huawei trying to make a comeback after U.S. sanctions created a huge gap between smartphone SoCs designed by Apple, Qualcomm, MediaTek, and those designed by Huawei. The 7nm Kirin 9000S powering the Mate 60 series was released in 2023 and stunned many by bringing 5G support back to Huawei phones. The sanctions have limited what Huawei can do to improve its chips by preventing the company from obtaining advanced lithography machines, making it harder for complex circuitry patterns to be transferred onto silicon wafers. Following the release of the Kirin 9000S application processor (AP) with the Mate 60 line, all Huawei could do was change configurations on subsequent chips to get a boost in performance. The Kirin 9010 was introduced last year with the Pura 70 series. With the Mate 70 line came the Kirin 9020. The latter chip delivered a 40% improvement in performance over the Kirin 9000S, according to Huawei. The rumored Kirin 9030 AP is tipped to have a 20% performance boost over the Kirin 9020. | Image Credit-Weibo, Huawei Central Because of the sanctions, Huawei and foundry SMIC are not able to obtain an extreme ultraviolet (EUV) lithography machine. This is part of the reason why Huawei can't close the gap with chips designed by aforementioned names like Apple, Qualcomm, and MediaTek. Huawei hopes to be able to use multiple impressions to make up for its inability to obtain advanced lithography systems. The problem with using multiple impressions is that it is very costly to use this technique. Misalignments lead to short circuits, which lead to lower yields, higher costs, and reliability problems. Nonetheless, with Huawei's chipsets 1-2 generations behind those from the top processor players, it hopes to have a 5nm chipset available, perhaps by the end of this year. Secure your connection now at a bargain price! We may earn a commission if you make a purchase Check Out The Offer
