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Hans India
3 days ago
- Business
- Hans India
Centre approves 2 semiconductor units for Odisha
Bhubaneswar: Chief Minister Mohan Charan Majhi on Tuesday said the Union Cabinet's approval for the establishment of two semiconductor units in Odisha will accelerate the State's growth in the sector. The Chief Minister expressed his gratitude to Prime Minister Narendra Modi and Union minister Ashwini Vaishnaw for the Centre's approval of the two semiconductor units in Odisha. Earlier in the day, the Union Cabinet, chaired by the Prime Minister, approved four more semiconductor projects under India Semiconductor Mission (ISM), two of which will come to Odisha and one each for Punjab and Andhra Pradesh. After the Union Cabinet meeting, Vaishnaw said a silicon carbide semiconductor plant will be set up in Bhubaneswar with an investment of Rs 2,066 crore by SiCsem Pvt Ltd. 'Silicon carbide is a very robust material and can sustain at high temperatures. Silicon carbide is used in our missiles, satellites, telecom towers, rockets, railway engines, etc,' Vaishnaw said. The minister said the plant will have a capacity to produce 9.6 crore chips per year. The Cabinet also approved US chip major Intel-backed 3D Glass semiconductor manufacturing unit in Odisha with an investment of Rs 1,943 crore. The plant will be set up by Heterogenous Integration Packaging Solutions Private Limited with an annual production capacity of 5 crore units. 'I sincerely express my gratitude to Hon'ble Prime Minister Shri @narendramodi ji and Hon'ble Union Minister Shri @AshwiniVaishnaw ji for the Central Cabinet's approval of the establishment of two semiconductor manufacturing units in Odisha,' Majhi said in a post on X. The Chief Minister said the recent amendment of the Odisha Semiconductor Manufacturing and Fabless Policy, aimed at enhancing investment viability, competitiveness and sustainability, together with this significant Cabinet approval, marks a major milestone in the State's industrial and technological advancement. 'This collaborative effort will accelerate innovation, generate employment and strengthen Odisha's position as a vital contributor towards the vision of #AtmanirbharBharat. I look forward to continued partnership between the State and the Central governments to further this strategic initiative for the comprehensive development of Odisha and the nation. #doubleengine,' Majhi said. SicSem Private Limited is collaborating with Clas-SiC Wafer Fab Ltd, UK, to establish an integrated facility of Silicon Carbide (SiC) based Compound Semiconductors in Info Valley, Bhubaneswar. This project proposes to manufacture Silicon Carbide devices. This compound semiconductor fab will have an annual capacity of 60,000 wafers and packaging capacity of 96 million units. The proposed products will have applications in missiles, defence equipment, electric vehicles (EVs), railway, fast chargers, data centre racks, consumer appliances, and solar power inverters, an official statement said. 3D Glass Solutions Inc (3DGS) will be setting up a vertically integrated advanced packaging and embedded glass substrate unit in Info Valley, Bhubaneswar. This unit will bring the world's most advanced packaging technology to India. Advanced packaging brings the next generation of efficiency to semiconductor industry.
Time of India
3 days ago
- Business
- Time of India
Four chip plants entailing Rs 4.6k crore investment in AP, Odisha, Punjab get govt nod
NEW DELHI: Strengthening India's efforts in attaining self-sufficiency in the critical semiconductor segment, the Union Cabinet on Tuesday approved four semiconductor projects, entailing a total investment of Rs 4,594 crore, with one of them being backed by US chipmaker Intel as well as defence and aerospace manufacturer Lockheed Martin. The projects will come up in Odisha, Punjab and Andhra Pradesh, IT & electronics minister Ashwini Vaishnaw said. The proposals were approved under the India Semiconductor Mission, which initially started the country's semiconductor manufacturing push with an outlay of Rs 76,000 crore to provide support for those setting up chip manufacturing facilities. "This is a new industry that we have started in India, and we were able to make a breakthrough after trying for decades previously. We will build upon this," Vaishnaw said. The Cabinet also approved US chip major Intel-backed 3D Glass semiconductor manufacturing unit in Odisha with an investment of Rs 1,943 crore. The plant will be set up by Heterogenous Integration Packaging Solutions with an annual production capacity of five crore units. Vaishnaw said the project will be backed by US firm Lockheed Martin as well.
Economic Times
3 days ago
- Business
- Economic Times
Centre approves two semiconductor units for Odisha
Chief Minister Mohan Charan Majhi on Tuesday said the Union Cabinet's approval for the establishment of two semiconductor units in Odisha will accelerate the state's growth in the CM expressed his gratitude to Prime Minister Narendra Modi and Union minister Ashwini Vaishnaw for the Centre's approval of the two semiconductor units in Odisha. Opposition BJD, which had announced the Odisha Semiconductor Manufacturing and Fabless Policy 2023, said: "While other states were only announcing semiconductor units in 2024, the decision by the Union Cabinet to approve two such units in Odisha today is truly commendable." BJD senior vice-president Debi Prasad Mishra at a press conference here, expressed confidence that the state government will take proactive steps to develop the required supporting ecosystem for these units within the stipulated in the day, the Union Cabinet, chaired by Prime Minister Narendra Modi, approved four more semiconductor projects under India Semiconductor Mission (ISM), two of which will come to Odisha and one each for Punjab and Andhra Pradesh. After the Union Cabinet meeting, Vaishnaw said that a silicon carbide semiconductor plant will be set up in Bhubaneswar with an investment of Rs 2,066 crore by SiCsem. "Silicon carbide is a very robust material and can sustain at high temperatures. Silicon carbide is used in our missiles, satellites, telecom towers, rockets, railway engines, etc," Vaishnaw said. The minister said that the plant will have a capacity to produce 9.6 crore chips per Cabinet also approved US chip major Intel-backed 3D Glass semiconductor manufacturing unit in Odisha with an investment of Rs 1,943 crore. The plant will be set up by Heterogenous Integration Packaging Solutions Pvt Ltd with an annual production capacity of 5 crore units."I sincerely express my gratitude to Hon'ble Prime Minister Shri @narendramodi ji and Hon'ble Union Minister Shri @AshwiniVaishnaw ji for the Central Cabinet's approval of the establishment of two semiconductor manufacturing units in Odisha," Majhi said in a post on chief minister said the recent amendment of the Odisha Semiconductor Manufacturing and Fabless Policy, aimed at enhancing investment viability, competitiveness, and sustainability, together with this significant Cabinet approval, marks a major milestone in the state's industrial and technological advancement."This collaborative effort will accelerate innovation, generate employment, and strengthen Odisha's position as a vital contributor towards the vision of #AtmanirbharBharat. I look forward to continued partnership between the state and Central governments to further this strategic initiative for the comprehensive development of Odisha and the nation. #doubleengine," Majhi Private Limited is collaborating with Clas-SiC Wafer Fab Ltd, UK, to establish an integrated facility of Silicon Carbide (SiC) based Compound Semiconductors in Info Valley, Bhubaneshwar, project proposes to manufacture Silicon Carbide devices. This compound semiconductor fab will have an annual capacity of 60,000 wafers and packaging capacity of 96 million units. The proposed products will have applications in missiles, defence equipment, electric vehicles (EVs), railway, fast chargers, data centre racks, consumer appliances, and solar power inverters, an official statement said.3D Glass Solutions Inc (3DGS) will be setting up a vertically integrated advanced packaging and embedded glass substrate unit in Info Valley, Bhubaneshwar, Odisha. This unit will bring the world's most advanced packaging technology to India. Advanced packaging brings the next generation of efficiency to semiconductor industry, the statement facility will have a large variety of advanced technologies, including glass interposers with passives and silicon bridges, and 3D Heterogeneous Integration (3DHI) capacity of this unit will be approximately 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules per annum. The proposed products will have significant applications in defence, high-performance computing, artificial intelligence, RF and automotive, photonics and co-packaged optics and leader Mishra said the process of setting up semiconductor units in Odisha was initiated under the leadership of former Chief Minister Naveen Patnaik during the BJD government. "The recent decision by the Union Cabinet to establish two semiconductor units in Odisha is rooted in the initiatives undertaken during the BJD regime," he said that investors interested in establishing a semiconductor industry in the state was cultivated during the 2nd edition of the Make in Odisha conclave held in December 2022, where several proposals were received. Accordingly, a dedicated policy for the semiconductor sector and its supporting ecosystem was formulated in 2023, he said. The BJD leader said that discussions were held with multiple international investors to attract investment in this sector, and efforts began to establish the necessary ecosystem to develop Odisha as a cutting-edge electronics manufacturing hub. Elevate your knowledge and leadership skills at a cost cheaper than your daily tea. As 50% US tariff looms, 6 key steps that can safeguard Indian economy As big fat Indian wedding slims to budget, Manyavar loses lustre Why are mid-cap stocks fizzling out? 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Time of India
3 days ago
- Business
- Time of India
Centre approves two semiconductor units for Odisha
Chief Minister Mohan Charan Majhi on Tuesday said the Union Cabinet 's approval for the establishment of two semiconductor units in Odisha will accelerate the state's growth in the CM expressed his gratitude to Prime Minister Narendra Modi and Union minister Ashwini Vaishnaw for the Centre's approval of the two semiconductor units in BJD, which had announced the Odisha Semiconductor Manufacturing and Fabless Policy 2023, said: "While other states were only announcing semiconductor units in 2024, the decision by the Union Cabinet to approve two such units in Odisha today is truly commendable."BJD senior vice-president Debi Prasad Mishra at a press conference here, expressed confidence that the state government will take proactive steps to develop the required supporting ecosystem for these units within the stipulated in the day, the Union Cabinet, chaired by Prime Minister Narendra Modi, approved four more semiconductor projects under India Semiconductor Mission (ISM), two of which will come to Odisha and one each for Punjab and Andhra the Union Cabinet meeting, Vaishnaw said that a silicon carbide semiconductor plant will be set up in Bhubaneswar with an investment of Rs 2,066 crore by SiCsem. Silicon carbide is a very robust material and can sustain at high temperatures. Silicon carbide is used in our missiles, satellites, telecom towers, rockets, railway engines, etc," Vaishnaw minister said that the plant will have a capacity to produce 9.6 crore chips per Cabinet also approved US chip major Intel-backed 3D Glass semiconductor manufacturing unit in Odisha with an investment of Rs 1,943 crore. The plant will be set up by Heterogenous Integration Packaging Solutions Pvt Ltd with an annual production capacity of 5 crore units."I sincerely express my gratitude to Hon'ble Prime Minister Shri @narendramodi ji and Hon'ble Union Minister Shri @AshwiniVaishnaw ji for the Central Cabinet's approval of the establishment of two semiconductor manufacturing units in Odisha," Majhi said in a post on chief minister said the recent amendment of the Odisha Semiconductor Manufacturing and Fabless Policy, aimed at enhancing investment viability, competitiveness, and sustainability, together with this significant Cabinet approval, marks a major milestone in the state's industrial and technological advancement."This collaborative effort will accelerate innovation, generate employment, and strengthen Odisha's position as a vital contributor towards the vision of #AtmanirbharBharat. I look forward to continued partnership between the state and Central governments to further this strategic initiative for the comprehensive development of Odisha and the nation. #doubleengine," Majhi Private Limited is collaborating with Clas-SiC Wafer Fab Ltd, UK, to establish an integrated facility of Silicon Carbide (SiC) based Compound Semiconductors in Info Valley, Bhubaneshwar, project proposes to manufacture Silicon Carbide devices. This compound semiconductor fab will have an annual capacity of 60,000 wafers and packaging capacity of 96 million units. The proposed products will have applications in missiles, defence equipment, electric vehicles (EVs), railway, fast chargers, data centre racks, consumer appliances, and solar power inverters, an official statement said.3D Glass Solutions Inc (3DGS) will be setting up a vertically integrated advanced packaging and embedded glass substrate unit in Info Valley, Bhubaneshwar, Odisha. This unit will bring the world's most advanced packaging technology to India. Advanced packaging brings the next generation of efficiency to semiconductor industry, the statement facility will have a large variety of advanced technologies, including glass interposers with passives and silicon bridges, and 3D Heterogeneous Integration (3DHI) capacity of this unit will be approximately 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules per annum. The proposed products will have significant applications in defence, high-performance computing, artificial intelligence, RF and automotive, photonics and co-packaged optics and leader Mishra said the process of setting up semiconductor units in Odisha was initiated under the leadership of former Chief Minister Naveen Patnaik during the BJD government. "The recent decision by the Union Cabinet to establish two semiconductor units in Odisha is rooted in the initiatives undertaken during the BJD regime," he said that investors interested in establishing a semiconductor industry in the state was cultivated during the 2nd edition of the Make in Odisha conclave held in December 2022, where several proposals were received. Accordingly, a dedicated policy for the semiconductor sector and its supporting ecosystem was formulated in 2023, he BJD leader said that discussions were held with multiple international investors to attract investment in this sector, and efforts began to establish the necessary ecosystem to develop Odisha as a cutting-edge electronics manufacturing hub.
India.com
3 days ago
- Business
- India.com
Amid Trump's tariffs tension, Modi Govt takes rapid decisions, approves Rs 46000000000 investment in…, to boost…
The Union Cabinet has cleared four semiconductor projects worth a total investment of Rs 4594 crore for Odisha, Punjab, and Andhra Pradesh, Information & Broadcasting Minister Ashwini Vaishnaw said on Tuesday. These projects have been sanctioned under the Rs 76000 crore India Semiconductor Mission, aimed at providing financial support to establish chip manufacturing facilities in the country. 'Cabinet has approved four semiconductor plants that will be set up in Odisha, Punjab and Andhra Pradesh,' Vaishnaw said. Where Will The Semiconductor Plants Be Established? The minister said that a silicon carbide semiconductor plant will be set up in Bhubaneswar with an investment of Rs 2,066 crore by SiCsem Pvt Ltd. 'Silicon carbide is a very robust material and can sustain at high temperatures. Silicon carbide is used in our missiles, satellites, telecom towers, rockets, railway engines, etc,' Vaishnaw said. The minister said that the plant will have a capacity to produce 9.6 crore chips per year. The Cabinet also approved US chip major Intel-backed 3D Glass semiconductor manufacturing unit in Odisha with an investment of Rs 1,943 crore. The plant will be set up by Heterogenous Integration Packaging Solutions Pvt Ltd with an annual production capacity of 5 crore units. Will US Firm To Back India's Semiconductor Mission? The minister said the project will be backed by US firm Lockheed Martin as well. A chip packaging plant in Andhra Pradesh, to be set up by Advanced System in Package Technologies with an investment of Rs 468 crore, was also approved by the Cabinet. It will have a capacity to produce 9.6 crore chips per year. The cabinet also cleared a semiconductor project of electronics component maker firm CDIL. The facility will be set up in Punjab with an investment of Rs 117 crore, having an annual production capacity of 15.8 crore units. The minister said that due to various steps taken by the Prime Minister Narendra Modi-led government, the electronics manufacturing sector has grown six times to Rs 12 lakh crore in the last 11 years. He said that electronics exports have grown by 8 times to Rs 3.3 lakh crore and mobile production has increased by 28 times to Rs 5.5 lakh crore. (With Inputs From PTI)
