Centre approves 2 semiconductor units for Odisha
Earlier in the day, the Union Cabinet, chaired by the Prime Minister, approved four more semiconductor projects under India Semiconductor Mission (ISM), two of which will come to Odisha and one each for Punjab and Andhra Pradesh.
After the Union Cabinet meeting, Vaishnaw said a silicon carbide semiconductor plant will be set up in Bhubaneswar with an investment of Rs 2,066 crore by SiCsem Pvt Ltd. 'Silicon carbide is a very robust material and can sustain at high temperatures.
Silicon carbide is used in our missiles, satellites, telecom towers, rockets, railway engines, etc,' Vaishnaw said. The minister said the plant will have a capacity to produce 9.6 crore chips per year.
The Cabinet also approved US chip major Intel-backed 3D Glass semiconductor manufacturing unit in Odisha with an investment of Rs 1,943 crore. The plant will be set up by Heterogenous Integration Packaging Solutions Private Limited with an annual production capacity of 5 crore units.
'I sincerely express my gratitude to Hon'ble Prime Minister Shri @narendramodi ji and Hon'ble Union Minister Shri @AshwiniVaishnaw ji for the Central Cabinet's approval of the establishment of two semiconductor manufacturing units in Odisha,' Majhi said in a post on X.
The Chief Minister said the recent amendment of the Odisha Semiconductor Manufacturing and Fabless Policy, aimed at enhancing investment viability, competitiveness and sustainability, together with this significant Cabinet approval, marks a major milestone in the State's industrial and technological advancement.
'This collaborative effort will accelerate innovation, generate employment and strengthen Odisha's position as a vital contributor towards the vision of #AtmanirbharBharat. I look forward to continued partnership between the State and the Central governments to further this strategic initiative for the comprehensive development of Odisha and the nation. #doubleengine,' Majhi said.
SicSem Private Limited is collaborating with Clas-SiC Wafer Fab Ltd, UK, to establish an integrated facility of Silicon Carbide (SiC) based Compound Semiconductors in Info Valley, Bhubaneswar.
This project proposes to manufacture Silicon Carbide devices. This compound semiconductor fab will have an annual capacity of 60,000 wafers and packaging capacity of 96 million units.
The proposed products will have applications in missiles, defence equipment, electric vehicles (EVs), railway, fast chargers, data centre racks, consumer appliances, and solar power inverters, an official statement said.
3D Glass Solutions Inc (3DGS) will be setting up a vertically integrated advanced packaging and embedded glass substrate unit in Info Valley, Bhubaneswar.
This unit will bring the world's most advanced packaging technology to India. Advanced packaging brings the next generation of efficiency to semiconductor industry.
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