Latest news with #Lip-Bu
Forbes
30-04-2025
- Business
- Forbes
Key Takeaways From Intel Foundry Direct Connect 2025
Intel CEO Lip-Bu Tan On Stage At Direct Connect. Day one of Intel Foundry's Direct Connect event, which is currently underway in San Jose, California, just wrapped and I wanted to share some thoughts. The day was filled with interesting developments from both Intel itself and its diverse array of ecosystem partners. There was a time when no one in the semiconductor industry could build transistors like Intel, but a series of missteps and changes in strategy spread out over the better part of the last decade shifted that paradigm. Now, Intel is attempting to propel its manufacturing processes back into a leadership position, while simultaneously trying to woo fabless semiconductor customers to manufacture their chips in Intel's fabs. To do that, Intel has to establish more trust in the industry and not only prove the competitiveness of its processes, but also that partners can make the chips with familiar and established workflows, consistently and with high reliability. Just about everything I heard today made me believe Intel is on track to do just that. Intel's Dr. Naga Chandrasekaran Holding A Intel 14A Test Wafer. The day began with a keynote address by newly-minted CEO Lip-Bu Tan. Lip-Bu was refreshingly direct and to the point. He outlined a number of Intel Foundry's challenges, and what moves the company was making to address them and chart a successful course for Intel Foundry's future. What I found most assuring during Lip-Bu's time speaking, however, was the parade of partners he brought out on stage and what they had to say. In today's advance semiconductor market, there is no single entity that can be successful on its own – there are simply too many technologies and packaging innovations at play in modern multi-chiplet devices. To that end, Lip-Bu brought out the CEOs of essentially all of the leading EDA tools providers. Sassine Ghazi, Synopsys CEO, At Intel Foundry Direct Connect. Sassine Ghazi of Synopsys, Cadence's Anirudh Devgan, Mike Ellow of Siemens EDA, and PDF/Solutions' John Kibarian came out in succession and all explained how their tools, IP and/or flows have been optimized for Intel's upcoming 18A process and the work is underway for future nodes, like 18A-P, 14A and its derivatives (among others). This strong commitment from Intel's ecosystem partners should carry a lot of weight; the overwhelming majority of fabless semiconductor players will be familiar with these tools, which should facilitate transitions to Intel Foundry's manufacturing processes. All of the EDA providers also voiced their impressions of Intel 18A, which were universally positive. In fact, the scuttlebutt amongst industry insiders has been mostly positive regarding 18A for quite a while. Multiple conversations I've had with trusted folks from the automotive, mobile, and processor industries have all suggested Intel 18A is a highly competitive process. That said, there weren't any new customer announcements today. I suspect there will be more coming soon, however, once Intel Foundry begins talking more about Intel 18A-P, which is a higher performance derivative of 18A that's better suited to a wider array of applications. 18A is already a competitive process and Intel will be shipping its next-generation Panther Lake-based processors built on 18A in volume later this year, but 18A-P addresses some technical issues that should make it a better fit for a more diverse array of architectures. Cadence President & CEO Anirudh Devgan At Direct Connect. Anyone scrutinizing and paying close attention to Intel and its moves with Intel Foundry needs to understand some fundamental realities related to 18A. In addition to being a leading-edge process, with smaller features, it introduces two innovations – Ribbon FETs and PowerVia backside power delivery. It's hard enough to bring a new manufacturing process to market, let alone one with two new key technologies. And to realize the full capabilities of 18A requires chip designers to make specific considerations from the start. To move an existing design or a design that was already in-flight that was originally slated for an existing process to18A is possible, but it may not benefit from Ribbon FETs and to utilize backside power delivery, can incur additional cost. However, optimizing a design for 18A from the start will offset most of the cost related to backside power delivery by easing density requirements and eliminating the need for some metal layers on the frontside. It will also enable designers to realize the maximum benefits of Ribbon FETs, and optimize power, performance, and area. Of course, chip designs don't happen overnight, so it's going to take some time for Intel Foundry's future customers to navigate these waters and decide if 18A, one of its derivatives, or a future process will be the best fit. Intel 18A Details. As for the processes themselves, Intel made plenty of encouraging claims. 18A has already achieved 95%+ of its targets and the optimization areas have already been identified to tweak the process to hit or exceed 100% of those targets next quarter. Intel 18A should deliver a >15% improvement in performance per watt, with 1.3x improvement in chip density versus Intel 3, with an additional ~8% improvement in perf-per-watt coming with 18A-P, along with support for 3D die stacking. Intel 14A Disclosures. Intel Foundry also disclosed some numbers related to its future 14A process. 14A is looking particularly strong at this early stage; Intel is expecting a 15-20% performance per watt increase versus 18A, with another 1.3x increase in density, and a 25-35% reduction in power. Intel 14A will also make use of High NA EUV and introduce second generation Ribbon FETs and PowerDirect. PowerDirect is an evolution of PowerVia that enables direct contact power delivery. Intel Foundry Process Roadmap There was a lot more disclosed during Intel Foundry Direct Connect, including a number of advancements in packing technology that improve interconnect density and performance, but it's just too much to cram into this report. Suffice it to say, after digesting day one's disclosures, my confidence in Intel's foundry efforts has reached a new high. The innovations, technologies, and tools to enable them appear to be in place. Now it's a matter of bringing in new customers, executing, and getting new products to market. Considering the company's huge investments, and the geopolitical pressures to bring more advanced semiconductor manufacturing back to the U.S., I think Intel Foundry can pull this off.
Epoch Times
25-04-2025
- Business
- Epoch Times
Intel Reports Flat Revenue Under New CEO as It Tries to Return to Its Roots
Things haven't improve for Intel in the first quarter of the year, with revenues remaining flat, and losses continuing under the new CEO, who sees no quick fixes to the tech giant's problems as it tries to return to its roots. On April 24, the Santa Clara, California-based company For the second quarter, the company expects revenue of $11.2 billion to $12.4 billion and earnings per share of 32 cents. Meanwhile, management announced an initiative to improve execution and operational efficiency, expecting 2025 operating expenses of $17 billion and 2026 operating expenses of $16 billion. 'The first quarter was a step in the right direction, but there are no quick fixes as we work to get back on a path to gaining market share and driving sustainable growth,' said Intel CEO Lip-Bu Tan, who took over the helm of the company on March 12. 'I am taking swift actions to drive better execution and operational efficiency while empowering our engineers to create great products. We are going back to basics by listening to our customers and making the changes needed to build the new Intel.' Related Stories 4/22/2025 4/23/2025 Intel's chief financial officer, David Zinsner, struck a more positive tone, blaming the macroeconomic environment for the company's lackluster outlook for the second quarter. 'The current macro environment is creating elevated uncertainty across the industry, which is reflected in our outlook. We are taking a disciplined and prudent approach to support continued investment in our core products and foundry businesses while maximizing operational cost savings and capital efficiency,' he said. One of the changes the new CEO is implementing is streamlining the organization, eliminating management layers, and enabling faster decision-making. 'It has been eye-opening for me to see how much time and energy is spent on internal administrative work that does not move our business forward,' Lip-Bu said in a 'We need to radically simplify this to maximize the time spent focusing on our customers.' That will allow Intel to cut costs and focus on what it once did best: empowering engineering talent to create great products, driving greater accountability across the company, and easing customer interaction. For instance, the company integrated the Network and Edge Group (NEX) into Client Computing Group (CCG) and Data Center and AI Group (DCAI) in the first quarter. It modified Intel's segment reporting to align with this and other business reorganizations, and to improve the operating decision-making process. 'We need to get back to our roots and empower our engineers,' Lip-Bu said. 'Many of the changes we will be driving are designed to make engineers more productive by removing burdensome workflows and processes that slow down the pace of innovation.' At January's Consumer Electronics Show, the company launched a range of Intel Core Ultra 200 series processors for laptops and desktops, including models with Intel vPro for business use. In February, Intel launched new Xeon 6 processors with Performance-cores for data centers, as well as versions for network and edge use. This was followed by the release of the latest MLPerf Inference v5.0 benchmarks by MLCommons. While these initiatives may be in the right direction, Intel's new CEO has a long way to go before the company addresses a host of old problems, such as technology missteps, falling market share, and lackluster performance on Wall Street, and returns to its glory days. That was in the 1980s and 1990s, when the semiconductor pioneer was in the right business at the right time, making the chips that powered personal computers in partnership with Microsoft. The combination was often called 'Wintel'—short for Windows and Intel. The personal computer industry is still around, but it hasn't grown as much as it did in its early days. As a result, Intel had to reinvent itself and leverage its core capabilities to expand into growing industries such as the cloud, 5G networks, AI, and intelligent and autonomous edge products. However, it didn't move fast enough to maintain its old momentum, going through one CEO after another—including Pat Gelsinger, an Intel alumnus who was appointed in January 2021 and was succeeded by Lip-Bu last month. Lip-Bu thinks it can happen. 'Intel was once widely seen as the world's most innovative company,' he said in the letter. 'There's no reason we can't get back there, so long as we drive the changes needed to improve. 'It's going to be hard. It will require painful decisions. But we will make them knowing it's what we must do to serve our customers better as we build a new Intel for the future—and I have great confidence in the power of our team and our people to make it happen.' Intel's shares rose 4.37 percent to close at $21.49 on April 24.
Yahoo
26-03-2025
- Business
- Yahoo
Pat Gelsinger supportive of Lip-Bu Tan, warns him about 'the short-termism of Wall Street'
When you buy through links on our articles, Future and its syndication partners may earn a commission. Pat Gelsinger became chief executive of Intel back in 2021 with the aim to turn the company around and regain process technology and product leadership over several years. He was ousted in late 2024 before the job was done, but he remains strongly supportive of the company's mission, so he wants to see the new CEO — Lip-Bu Tan — to finish what he started, he said in an interview with CNBC. "I was committed to and wanting to finish that story on the revitalization of Intel and with the board, the company, and now with Lip-Bu's leadership, you are really cheering them on to finish, because the role that Intel plays in the semiconductor industry is critical and one that's important not just for the industry but for the U.S., so I could not be more supportive of the team and Lip-Bu to finishing their journey," said Pat Gelsinger. The challenges Intel faced, particularly around funding and market expectations, made the transformation extremely difficult. Gelsinger pointed out that one of the biggest obstacles was the financial burden of building a next-generation fabrication network. He noted that his IDM 2.0 strategy — under which Intel remains a vertically integrated maker of its own chips and a contract chipmaker with third party clients — was still the correct one, but acknowledged how capital-intensive and demanding it is for any company. As Intel's core business declined faster than expected, it became clear that external capital was needed to fund the initiative. "It is a heavy assignment, and for any company to carry the financial requirements of building next-generation technology fab network, it is very heavy in terms of capital returns required and the investments required to go accomplish that," Gelsinger acknowledged. "As Intel's core business was challenged and deteriorated more quickly than many people expected, there was just such a need for capital to come from elsewhere." The former CEO of Intel also criticized the short-term focus of financial markets, which he said clashed with the long-term nature of the transformation Intel was undergoing. He described the tension of trying to execute a multi-year strategic shift while meeting quarterly financial expectations, emphasizing that such balancing was extremely difficult. He noted that this is exactly what Lip-Bu Tan will face in the coming quarters."As I have spoken about, the short-termism of Wall Street makes that very challenging and why, yet again, I would say my very best to Intel and Lip-Bu in finishing that seminally important journey," said Gelsinger. "Being a CEO for a transforming public company I truly think is one of the hardest jobs available, because you are trying to do a five-plus-year transformation on a 90-day shot clock, with heavy financial expectation — that is hard." In summary, Pat Gelsinger made it clear that despite leaving, he wants Intel — the company that he spent decades in — to succeed and believes in the path the company is on. He reiterated his full support for both the board and Lip-Bu Tan as they continue forward with the IDM 2.0 vision. Sign in to access your portfolio
Yahoo
12-03-2025
- Business
- Yahoo
Intel Appoints Lip-Bu Tan as Chief Executive Officer
Tan to join Intel board of directors SANTA CLARA, Calif., March 12, 2025--(BUSINESS WIRE)--Intel Corporation (Nasdaq: INTC) today announced that its board of directors has appointed Lip-Bu Tan, an accomplished technology leader with deep semiconductor industry experience, as chief executive officer, effective March 18. He succeeds Interim Co-CEOs David Zinsner and Michelle (MJ) Johnston Holthaus. Tan will also rejoin the Intel board of directors after stepping down from the board in August 2024. Zinsner will remain executive vice president and chief financial officer, and Johnston Holthaus will remain CEO of Intel Products. Frank D. Yeary, who took on the role of interim executive chair of the board during the search for a new CEO, will revert to being the independent chair of the board upon Tan becoming CEO. "Lip-Bu is an exceptional leader whose technology industry expertise, deep relationships across the product and foundry ecosystems, and proven track record of creating shareholder value is exactly what Intel needs in its next CEO," Yeary said. "Throughout his long and distinguished career, he has earned a reputation as an innovator who puts customers at the heart of everything he does, delivers differentiated solutions to win in the market and builds high-performance cultures to achieve success. "Like many across the industry, I have worked closely with Lip-Bu in the past and have seen firsthand how his relentless attention to customers drives innovation and success," Yeary continued. "We are delighted to have Lip-Bu as our CEO as we work to accelerate our turnaround and capitalize on the significant growth opportunities ahead." On his appointment, Tan said, "I am honored to join Intel as CEO. I have tremendous respect and admiration for this iconic company, and I see significant opportunities to remake our business in ways that serve our customers better and create value for our shareholders. "Intel has a powerful and differentiated computing platform, a vast customer installed base and a robust manufacturing footprint that is getting stronger by the day as we rebuild our process technology roadmap," Tan continued. "I am eager to join the company and build upon the work the entire Intel team has been doing to position our business for the future." Yeary added, "On behalf of the board, I would like to thank Dave and Michelle for their steadfast leadership as interim co-CEOs. Their discipline and focus have been a source of stability as we continue the work needed to deliver better execution, rebuild product leadership, advance our foundry strategy and begin to regain investor confidence." Tan is a longtime technology investor and widely respected executive with more than 20 years of semiconductor and software experiences as well as deep relationships across Intel's ecosystem. He formerly served as CEO of Cadence Design Systems from 2009 to 2021, where he led a reinvention of the company and drove a cultural transformation centered on customer-centric innovation. During his time as CEO, Cadence more than doubled its revenue, expanded operating margins and delivered a stock price appreciation of more than 3,200%. Tan served as a member of the Cadence board of directors for 19 years, from his appointment in 2004 through his service as executive chairman from 2021 to 2023 following his tenure as CEO. He is also a founding managing partner of Walden Catalyst Ventures and chairman of Walden International. He has significant public company board experience, currently serving on the boards of Credo Technology Group and Schneider Electric. Tan holds a Bachelor of Science in physics from Nanyang Technological University in Singapore, a Master of Science in nuclear engineering from the Massachusetts Institute of Technology and an MBA from the University of San Francisco. In 2022, he received the Robert N. Noyce Award, the Semiconductor Industry Association's highest honor. Forward-Looking Statements This press release includes forward-looking statements, including with respect to our expectations and the potential implications of Mr. Tan joining Intel, the strength of Intel's computing footprint, installed customer base and manufacturing footprint, the progress in rebuilding Intel's process technology roadmap, and opportunities for the business and future shareholder value. These statements involve risks and uncertainties that could cause actual results to differ materially from those expressed or implied, including the risks and uncertainties described in Intel's 2024 Form 10-K and other filings with the SEC. All information in this statement reflects management's intentions and expectations as of the date of this statement, unless an earlier date is specified. We do not undertake, and expressly disclaim any duty, to update such statements, whether as a result of new information, new developments, or otherwise, except to the extent that disclosure may be required by law. About Intel Intel (Nasdaq: INTC) is an industry leader, creating world-changing technology that enables global progress and enriches lives. Inspired by Moore's Law, we continuously work to advance the design and manufacturing of semiconductors to help address our customers' greatest challenges. By embedding intelligence in the cloud, network, edge and every kind of computing device, we unleash the potential of data to transform business and society for the better. To learn more about Intel's innovations, go to and © Intel Corporation. Intel, the Intel logo and other Intel marks are trademarks of Intel Corporation or its subsidiaries. Other names and brands may be claimed as the property of others. View source version on Contacts Joseph GreenInvestor Sophie Won MetzgerMedia Sign in to access your portfolio
