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Business Standard
12-08-2025
- Business
- Business Standard
Cabinet approves 4 new semiconductor projects with ₹4,600 crore investment
The Union Cabinet on Tuesday approved four additional semiconductor manufacturing projects under the India Semiconductor Mission (ISM). Two of these factories will be built in Odisha, while Andhra Pradesh and Punjab will get one each. With these approvals, a total of 10 semiconductor projects worth around ₹1.60 trillion are now set to be developed across six states. These projects aim to boost domestic chip production, strengthen India's electronics manufacturing ecosystem, and create thousands of jobs. The newly approved projects come from SiCSem, Continental Device India Pvt. Ltd (CDIL), 3D Glass Solutions Inc., and Advanced System in Package (ASIP) Technologies. Together, they will involve an investment of about ₹4,600 crore and create direct employment for 2,034 skilled professionals, along with many indirect jobs. Project locations • Odisha will host two projects — SiCSem and 3D Glass Solutions • Punjab will see CDIL's facility expansion • Andhra Pradesh will house ASIP's manufacturing unit SiCSem in Odisha: First compound fab in India SiCSem, in collaboration with Clas-SiC Wafer Fab Ltd, UK, will set up the country's first commercial compound semiconductor fab in Bhubaneswar's Info Valley. This facility will produce Silicon Carbide (SiC) devices used in missiles, defence systems, electric vehicles, railways, fast chargers, solar inverters, and more. It will have an annual capacity of 60,000 wafers and 96 million packaged units. 3D Glass Solutions Inc. will set up a high-tech facility in Odisha for advanced semiconductor packaging and embedded glass substrates. This will bring world-leading packaging technology to India, with an annual capacity of 69,600 glass panel substrates, 50 million assembled units, and 13,200 advanced modules. The products will be used in defence, AI, high-performance computing, automotive, photonics, and communication systems. ASIP in Andhra Pradesh ASIP Technologies, partnering with APACT Co. Ltd, South Korea, will build a plant with an annual output of 96 million units for applications in mobile phones, set-top boxes, and automobiles. CDIL in Punjab CDIL will expand its Mohali facility to produce high-power semiconductor devices like MOSFETs, IGBTs, Schottky diodes, and transistors. The expansion will have a capacity of 158.38 million units annually, supporting EVs, renewable energy, industrial systems, and telecom infrastructure. Cabinet approves Lucknow Metro Phase-1B The Cabinet also cleared Phase-1B of the Lucknow Metro Rail Project, an 11.165 km corridor with 12 stations (seven underground and five elevated). Once complete, Lucknow will have a 34 km metro network. Phase-1B will link key areas like Aminabad, Chowk, King George's Medical University, and major heritage sites. It aims to cut traffic congestion, reduce pollution, and boost tourism and local business. The project is expected to: • Reduce road congestion in densely populated areas • Lower carbon emissions • Improve travel times to airports, railway stations, and bus depots • Provide better access to jobs, healthcare, and education
News18
12-08-2025
- Business
- News18
Cabinet Approves Four New Semiconductor Projects Worth Rs 4,600 Crore, 2,034 New Jobs Expected
Last Updated: The Union Cabinet, led by PM Modi, approved four semiconductor projects worth Rs 4,600 crore, creating 2,034 jobs. The Union Cabinet, chaired by Prime Minister Narendra Modi, has approved four new semiconductor projects under the India Semiconductor Mission (ISM), marking another milestone in India's bid to build a robust chip-making ecosystem. The fresh approvals, worth a cumulative Rs 4,600 crore, are expected to create 2,034 skilled jobs directly and many more indirectly. With this, the total number of projects approved under ISM rises to 10, with total planned investments of about Rs 1.60 lakh crore spread across six states. The newly approved proposals are from SiCSem, 3D Glass Solutions Inc., Continental Device India Private Limited (CDIL), and Advanced System in Package (ASIP) Technologies. SiCSem and 3D Glass will set up facilities in Odisha, CDIL will expand in Punjab, and ASIP will set up operations in Andhra Pradesh. SiCSem, in collaboration with UK's Clas-SiC Wafer Fab Ltd., will establish India's first commercial compound semiconductor fab in Bhubaneshwar with a capacity of 60,000 wafers and 96 million packaged units annually. The devices will cater to sectors such as defence, EVs, railways, data centres, and renewable energy. ASIP Technologies, in tie-up with South Korea's APACT Co. Ltd., will set up a semiconductor packaging facility in Andhra Pradesh with an annual capacity of 96 million units for use in mobile devices, automobiles, and consumer electronics. CDIL will expand its Mohali plant to manufacture high-power devices such as MOSFETs, IGBTs, and Schottky diodes, with an annual capacity of over 158 million units. With the approval of these projects, semiconductor ecosystem in country would get significant boost as these projects include country's first commercial compound fab as well as highly advanced glass-based substrate semiconductor packaging unit. These would complement the growing world class chip design capabilities coming up in the country which are propelled by design infrastructure support provided by Government to 278 academic institutions and 72 start-ups. view comments First Published: Disclaimer: Comments reflect users' views, not News18's. Please keep discussions respectful and constructive. Abusive, defamatory, or illegal comments will be removed. News18 may disable any comment at its discretion. By posting, you agree to our Terms of Use and Privacy Policy.
