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New Indian Express
2 days ago
- Business
- New Indian Express
Odisha bags lion's share with big-ticket projects of Rs 4K crore
BHUBANESWAR: Odisha's drive to transform into a hub for semiconductor manufacturing got a major push on Tuesday with the Centre approving two high-value projects worth over Rs 4,009 crore for the state. As cleared by the Central cabinet chaired by Prime Minister Narendra Modi, Chennai-based SiCSem Pvt Ltd will set up a silicon carbidebased compound semiconductors manufacturing unit with an investment of Rs 2,066 crore while US-headquartered 3D Glass Solutions (3DGS) Inc will establish an integrated advanced packaging and embedded glass substrate unit with an investment of Rs 1,943 crore. The two projects to come up at electronic system design and manufacturing (ESDM) park at Info Valley-II on the city outskirts were among four projects that got the cabinet nod. Two others - Continental Device India Private Limited (CDIL) and Advanced System in Package (ASIP) Technologies will be located in Punjab and Andhra Pradesh.
Business Upturn
3 days ago
- Business
- Business Upturn
India approves four new semiconductor projects worth Rs 4,600 crore under ISM
By Aditya Bhagchandani Published on August 12, 2025, 16:22 IST The Union Cabinet, chaired by Prime Minister Narendra Modi, has approved four new semiconductor manufacturing projects under the India Semiconductor Mission (ISM), with a total investment of around Rs 4,600 crore. These projects, to be set up in Odisha, Punjab, and Andhra Pradesh, are expected to generate employment for over 2,000 skilled professionals and create numerous indirect jobs, further strengthening the country's electronics manufacturing ecosystem. With these approvals, the total number of sanctioned projects under ISM rises to 10, representing cumulative investments of approximately Rs 1.60 lakh crore across six states. In Odisha's Info Valley, Bhubaneswar, SiCSem Pvt Ltd—in collaboration with Clas-SiC Wafer Fab Ltd, UK—will establish India's first commercial compound semiconductor fabrication unit, focusing on Silicon Carbide (SiC) devices with an annual capacity of 60,000 wafers and 96 million packaged units. Nearby, 3D Glass Solutions Inc. will set up an advanced semiconductor packaging and embedded glass substrate unit, bringing cutting-edge glass interposers, silicon bridges, and 3D heterogeneous integration modules to India. In Andhra Pradesh, Advanced System in Package Technologies (ASIP), in partnership with APACT Co. Ltd, South Korea, will develop a semiconductor manufacturing unit with an annual output capacity of 96 million units for applications in mobile devices, automotive electronics, and consumer products. In Punjab's Mohali, Continental Device India Pvt Ltd (CDIL) will expand its discrete semiconductor manufacturing facility, producing high-power devices such as MOSFETs, IGBTs, and Schottky diodes, both in silicon and silicon carbide, with an annual capacity of 158.38 million units. These projects, featuring India's first compound fab and a highly advanced glass-based substrate packaging unit, are seen as pivotal to the nation's ambition of becoming self-reliant in semiconductor manufacturing and complementing its growing chip design capabilities. Ahmedabad Plane Crash Aditya Bhagchandani serves as the Senior Editor and Writer at Business Upturn, where he leads coverage across the Business, Finance, Corporate, and Stock Market segments. With a keen eye for detail and a commitment to journalistic integrity, he not only contributes insightful articles but also oversees editorial direction for the reporting team.
Indian Express
3 days ago
- Business
- Indian Express
Cabinet clears four new chip plants for Rs 4,600 crore in Odisha, Punjab and Andhra Pradesh
The Union Cabinet on Tuesday cleared four new semiconductor assembly and testing plants under its India Semiconductor Mission, which have a total financial outlay of Rs 4,594 crore. Two of these plants will come up in Odisha, and one each in Punjab and Andhra Pradesh. With these, the government is now offering financial incentives for the construction of a total of 10 chip-related factories, ranging from a fabrication plant to assembly and testing operations. The two plants in Odisha include a Rs 2,066 crore assembly and testing (ATMP) facility being set up by SiCSem Pvt Ltd, which will produce silicon carbide based diodes and MOSFETs, and another ATMP plant by 3D Glass Solutions Inc. worth Rs 1,943 crore. Union IT Minister Ashwini Vaishnaw said the second plant has investments from Intel, Lockheed Martin, and other VC and PE funds. The first plant will have an ATMP capacity of 96 million chips per year, and the second has a capacity of producing 50 million chips a year. Both these plants will be constructed in Bhubaneswar. Advanced System in Package Technologies (ASIP) will set up a semiconductor manufacturing unit in Andhra Pradesh, under a technology tie-up with APACT Co. Ltd, South Korea, with an annual capacity of 96 million units. The manufactured products will find applications in mobile phones, set-top boxes, automobile applications, and other electronic products. Continental Device (CDIL) will expand its discrete semiconductor manufacturing facility at Mohali, Punjab. The proposed facility will manufacture high-power discrete semiconductor devices such as MOSFETs, IGBTs, Schottky Bypass Diodes, and transistors, both in Silicon and Silicon Carbide. The annual capacity of this brownfield expansion will be to the tune of 158.38 million units. The devices manufactured by these proposed units will have applications in automotive electronics including EVs and its charging infrastructure, renewable energy systems, power conversion applications, industrial applications and communication infrastructure. The new locations for the chip plants mark a break from a majority of the facilities which have been approved for construction in Gujarat. Of the 10 plants now approved, four are in Gujarat. Before these, the government has managed to attract six chip plants under its Rs 76,000 crore India Semiconductor Mission. This includes the Tata-PSMC fab, being built at a cost of roughly $11 billion, along with assembly and testing plants by US-based Micron Technology, the Tatas, Murugappa Group's CG Power in partnership with Japan's Renesas, Kaynes Semicon, and HCL-Foxconn. Some of these facilities are in an advanced stage of construction, with the first made-in-India chip expected to roll out later this year. In August 2024, The Indian Express had reported that the Centre had created a fresh $15 billion blueprint for the second phase of the India Semiconductor Mission. Under the renewed scheme, the government was planning to offer capital support for raw materials and gases used in chip manufacturing, this paper had reported.
