
India approves four new semiconductor projects worth Rs 4,600 crore under ISM
The Union Cabinet, chaired by Prime Minister Narendra Modi, has approved four new semiconductor manufacturing projects under the India Semiconductor Mission (ISM), with a total investment of around Rs 4,600 crore. These projects, to be set up in Odisha, Punjab, and Andhra Pradesh, are expected to generate employment for over 2,000 skilled professionals and create numerous indirect jobs, further strengthening the country's electronics manufacturing ecosystem.
With these approvals, the total number of sanctioned projects under ISM rises to 10, representing cumulative investments of approximately Rs 1.60 lakh crore across six states.
In Odisha's Info Valley, Bhubaneswar, SiCSem Pvt Ltd—in collaboration with Clas-SiC Wafer Fab Ltd, UK—will establish India's first commercial compound semiconductor fabrication unit, focusing on Silicon Carbide (SiC) devices with an annual capacity of 60,000 wafers and 96 million packaged units. Nearby, 3D Glass Solutions Inc. will set up an advanced semiconductor packaging and embedded glass substrate unit, bringing cutting-edge glass interposers, silicon bridges, and 3D heterogeneous integration modules to India.
In Andhra Pradesh, Advanced System in Package Technologies (ASIP), in partnership with APACT Co. Ltd, South Korea, will develop a semiconductor manufacturing unit with an annual output capacity of 96 million units for applications in mobile devices, automotive electronics, and consumer products.
In Punjab's Mohali, Continental Device India Pvt Ltd (CDIL) will expand its discrete semiconductor manufacturing facility, producing high-power devices such as MOSFETs, IGBTs, and Schottky diodes, both in silicon and silicon carbide, with an annual capacity of 158.38 million units.
These projects, featuring India's first compound fab and a highly advanced glass-based substrate packaging unit, are seen as pivotal to the nation's ambition of becoming self-reliant in semiconductor manufacturing and complementing its growing chip design capabilities.
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Aditya Bhagchandani serves as the Senior Editor and Writer at Business Upturn, where he leads coverage across the Business, Finance, Corporate, and Stock Market segments. With a keen eye for detail and a commitment to journalistic integrity, he not only contributes insightful articles but also oversees editorial direction for the reporting team.
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