&w=3840&q=100)
MSI unveils AMD Ryzen-powered Claw A8 gaming handheld at Computex 2025
The AMD-powered Claw A8 BZ2EM marks MSI's entry into offering dual chipset options for its gaming handheld line-up. While the Intel version is already on the market, the AMD edition expands the line-up to give consumers more hardware flexibility. MSI has not yet disclosed pricing details or the expected launch date for the AMD version of the Claw A8.
MSI Claw A8 BZ2EM: Details
The MSI Claw A8 BZ2EM is a handheld gaming device equipped with some powerful hardware under the hood. According to a report by The Verge, MSI Claw A8 BZ2EM's core is the AMD Ryzen Z2 Extreme processor, paired with an AMD Radeon 890M GPU. The system reportedly supports up to 24GB of RAM.
The device is likely to feature an 8-inch full HD (1080p) display with a 120Hz refresh rate and Variable Refresh Rate (VRR) support. Storage options will reportedly include a single M.2 2280 PCIe 4.0 x4 slot along with a microSD card reader, providing flexibility for expanding game libraries and media.
According to the report, MSI Claw A8 BZ2EM will be shipped with a 80Wh battery and will run on Windows 11 Home, giving users access to a full desktop operating environment. Despite its performance capabilities, the device will reportedly be relatively compact and portable, measuring 299.5 x 126.2 x 24mm and weighing in at 765 grams.
MSI Claw A8 BZ2EM: Expected specifications
Display: 8-inch, 1080p, 120Hz, VRR
Processor: AMD Ryzen Z2 Extreme
GPU: AMD Radeon 890M
RAM: Up to 24GB
Storage: 1x M.2 2280 (PCIe 4.0 x4) and 1x microSD card reader
Battery: 80Wh
Operating System: Windows 11 Home
Dimensions: 299.5 x 126.2 x 24mm
Weight: 765g
Try Our AI Features
Explore what Daily8 AI can do for you:
Comments
No comments yet...
Related Articles
Hans India
3 hours ago
- Hans India
Centre approves 2 semiconductor units for Odisha
Bhubaneswar: Chief Minister Mohan Charan Majhi on Tuesday said the Union Cabinet's approval for the establishment of two semiconductor units in Odisha will accelerate the State's growth in the sector. The Chief Minister expressed his gratitude to Prime Minister Narendra Modi and Union minister Ashwini Vaishnaw for the Centre's approval of the two semiconductor units in Odisha. Earlier in the day, the Union Cabinet, chaired by the Prime Minister, approved four more semiconductor projects under India Semiconductor Mission (ISM), two of which will come to Odisha and one each for Punjab and Andhra Pradesh. After the Union Cabinet meeting, Vaishnaw said a silicon carbide semiconductor plant will be set up in Bhubaneswar with an investment of Rs 2,066 crore by SiCsem Pvt Ltd. 'Silicon carbide is a very robust material and can sustain at high temperatures. Silicon carbide is used in our missiles, satellites, telecom towers, rockets, railway engines, etc,' Vaishnaw said. The minister said the plant will have a capacity to produce 9.6 crore chips per year. The Cabinet also approved US chip major Intel-backed 3D Glass semiconductor manufacturing unit in Odisha with an investment of Rs 1,943 crore. The plant will be set up by Heterogenous Integration Packaging Solutions Private Limited with an annual production capacity of 5 crore units. 'I sincerely express my gratitude to Hon'ble Prime Minister Shri @narendramodi ji and Hon'ble Union Minister Shri @AshwiniVaishnaw ji for the Central Cabinet's approval of the establishment of two semiconductor manufacturing units in Odisha,' Majhi said in a post on X. The Chief Minister said the recent amendment of the Odisha Semiconductor Manufacturing and Fabless Policy, aimed at enhancing investment viability, competitiveness and sustainability, together with this significant Cabinet approval, marks a major milestone in the State's industrial and technological advancement. 'This collaborative effort will accelerate innovation, generate employment and strengthen Odisha's position as a vital contributor towards the vision of #AtmanirbharBharat. I look forward to continued partnership between the State and the Central governments to further this strategic initiative for the comprehensive development of Odisha and the nation. #doubleengine,' Majhi said. SicSem Private Limited is collaborating with Clas-SiC Wafer Fab Ltd, UK, to establish an integrated facility of Silicon Carbide (SiC) based Compound Semiconductors in Info Valley, Bhubaneswar. This project proposes to manufacture Silicon Carbide devices. This compound semiconductor fab will have an annual capacity of 60,000 wafers and packaging capacity of 96 million units. The proposed products will have applications in missiles, defence equipment, electric vehicles (EVs), railway, fast chargers, data centre racks, consumer appliances, and solar power inverters, an official statement said. 3D Glass Solutions Inc (3DGS) will be setting up a vertically integrated advanced packaging and embedded glass substrate unit in Info Valley, Bhubaneswar. This unit will bring the world's most advanced packaging technology to India. Advanced packaging brings the next generation of efficiency to semiconductor industry.
Time of India
7 hours ago
- Time of India
Four chip plants entailing Rs 4.6k crore investment in AP, Odisha, Punjab get govt nod
NEW DELHI: Strengthening India's efforts in attaining self-sufficiency in the critical semiconductor segment, the Union Cabinet on Tuesday approved four semiconductor projects, entailing a total investment of Rs 4,594 crore, with one of them being backed by US chipmaker Intel as well as defence and aerospace manufacturer Lockheed Martin. The projects will come up in Odisha, Punjab and Andhra Pradesh, IT & electronics minister Ashwini Vaishnaw said. The proposals were approved under the India Semiconductor Mission, which initially started the country's semiconductor manufacturing push with an outlay of Rs 76,000 crore to provide support for those setting up chip manufacturing facilities. "This is a new industry that we have started in India, and we were able to make a breakthrough after trying for decades previously. We will build upon this," Vaishnaw said. The Cabinet also approved US chip major Intel-backed 3D Glass semiconductor manufacturing unit in Odisha with an investment of Rs 1,943 crore. The plant will be set up by Heterogenous Integration Packaging Solutions with an annual production capacity of five crore units. Vaishnaw said the project will be backed by US firm Lockheed Martin as well.
Economic Times
11 hours ago
- Economic Times
Ex-Intel boss pushes shocking $40 billion rescue plan involving Apple, Nvidia - calls for sacking Lip-Bu Tan
Intel $40 billion rescue plan: Former Intel CEO Craig Barrett suggests a $40 billion plan. It aims to rescue Intel and America's chipmaking dominance. He urges Intel's major clients like Apple and Google to invest. Each should contribute $5 billion. This will ensure domestic chip supply. It will also provide pricing power against Asian rivals. He criticizes Intel's current CEO and investment strategies. Tired of too many ads? Remove Ads Craig Barrett warns of existential threat to Intel and US chipmaking $40 billion proposal targets Intel's biggest customers Tired of too many ads? Remove Ads Intel CEO Lip-Bu Tan under scrutiny amid massive losses Tariffs on advanced chip imports could boost US manufacturing Donald Trump calls for Intel CEO's resignation FAQs Tired of too many ads? Remove Ads Ex-Intel CEO and chairman Craig Barrett has made an urgent call to action, laying out a striking $40 billion plan to save Intel and with it, America's leadership in advanced chipmaking, as per a a piece written for Fortune, Barrett warned that without immediate funding, Intel could fall permanently behind rivals like Taiwan's TSMC and South Korea's Samsung, a shift he believes would be disastrous for national security and the US tech industry, as per a Tom's Hardware believes Intel remains the only American company capable of competing with TSMC at the leading edge of semiconductor manufacturing, according to the report. But he says the company lacks the capital to scale its operations and invest in next-generation technologies, as per the report. According to him, federal funding through the CHIPS Act won't be enough to close the gap, as per a Tom's Hardware reportALSO READ: See you in court! Trump targets Fed Chair Jerome Powell with massive lawsuit threat Instead, he's proposing that Intel's eight largest customers, including companies like Apple, Google, and Nvidia, should each contribute $5 billion, adding up to a collective $40 billion investment, according to the report. In return, these companies would gain guaranteed domestic chip supply and pricing leverage against Asian competitors, as reported by Tom's also pointed out that neither TSMC nor Samsung has plans to bring their most advanced manufacturing capabilities to the US, which he sees as a long-term threat to American companies dependent on foreign chips, according to the wrote that 'The only place the cash can come from is the customers,' adding that leadership in manufacturing requires proactive investment years ahead of market demand, as per the READ: AI upstart Perplexity shocks tech world with $34.5 billion bid to snatch Google Chrome He also criticized Intel's current leadership under CEO Lip-Bu Tan, who was appointed in March 2025, according to the Tom's Hardware report. The company has been struggling with massive financial losses, $18.8 billion in 2024 alone, and another $2.9 billion in the second quarter of 2025, and has also laid off tens of thousands of workers, while canceling major projects, as per the former chairman specifically called out Intel's hesitation to invest in its upcoming 14A manufacturing process without pre-existing customer contracts, calling the approach 'a joke' and warning it risks falling permanently behind, as reported by Tom's plan hinges on two things that include immediate investment in critical technologies like High-NA EUV and backside power delivery, and potential US tariffs on imported advanced chips to stimulate domestic demand, as reported by Tom's Hardware. Barrett even rejected calls to split Intel into separate design and manufacturing entities, pointing out that the core problem is capital, not structure, according to the remark comes after US president Donald Trump had publicly called for Tan's resignation over alleged ties to China, as per the report. Barrett highlighted that his proposal was important for both national security and supply chain stability, warning that the US cannot afford to let Intel's manufacturing leadership slip away, as reported by Tom's wants Intel's biggest customers to each invest $5 billion to help the company modernize its tech players like Apple, Google, and Nvidia.
