Latest news with #IntegratedCircuit
Yahoo
01-07-2025
- Business
- Yahoo
Broadcom Outpaced Major Indexes In 2025
In a period marked by investor caution in the U.S. tech sector, Broadcom Inc. (NASDAQ:AVGO) stands out with a 63% stock rally in just three months. Let's unpack the compelling narrative behind Broadcom's exceptional outperformance, delving into its strong second-quarter 2025 results, positive analyst sentiment, and future outlook. Broadcom, a dominant force in the Application-Specific Integrated Circuit (ASIC) market, focuses on high-performance computing, networking, and storage applications. The company designs and manufactures custom silicon chips for specific tasks, offering high-speed computing, networking, and data center infrastructure advantages. Broadcom's stock increased by 63% in the last three months, while the PHLX Semiconductor Sector Index (SOX), which includes Broadcom, gained 30% during the same performance comes even as the U.S. tech sector navigates investor apprehension regarding the sustainability of substantial AI investments by tech giants and the implications of the Trump administration's tariff policies. Currently, AVGO trades near its 52-week high of approximately $276. Analysts generally hold a positive outlook on Broadcom, with a consensus price forecast of $387.68 based on ratings from 29 analysts. The highest target is $1950, issued by Bernstein on June 13, 2024. The three most recent analyst ratings were released by Citigroup, Barclays, and Susquehanna in June 2025. Broadcom's second-quarter 2025 revenue reached $15 billion, a 20% increase year-over-year, driven by its AI semiconductor solutions and VMware. This revenue figure slightly exceeded analyst estimates of $14.99 billion. The company's quarterly AI revenue grew 46% to over $4.4 billion, attributed to demand for AI networking. Broadcom generated approximately $6.56 billion in cash from operations and $6.41 billion in free cash flow during the quarter. Adjusted earnings for the second quarter were $1.58 per share, surpassing analyst estimates of $1.56. For the third quarter, Broadcom expects revenue of approximately $15.8 billion, aligning with estimates of $15.79 billion. It anticipates AI semiconductor revenue to reach $5.1 billion in the third quarter. These results prompted analysts to adjust price targets for the stock, citing growth in AI-related revenue and demand for networking solutions. JP Morgan's Harlan Sur noted Broadcom's potential for long-term AI revenue growth, supported by increased capital expenditures from major cloud firms and the adoption of its custom ASIC silicon. Rosenblatt's Kevin Cassidy highlighted Broadcom's visibility into AI growth through key XPU customers and the company's Ethernet scale-up adoption for LLM training and inference. Cantor Fitzgerald's Matthew Prisco projects AI semiconductor revenue to exceed $20 billion in 2025 and $30 billion in 2026. Broadcom's stock has dramatically outpaced its peers, with a 68% surge over the last 12 months compared to the PHLX Semiconductor's modest 1.3%. In the first half of 2025, Broadcom gained 19% outpacing the S&P 500 gain of 6% and Nasdaq's 15.5%. The year 2024 was particularly significant, as Broadcom joined the exclusive 'trillion-dollar valuation club,' alongside Nvidia Corp. (NASDAQ:NVDA), fueled by the intensifying AI frenzy. In fiscal year 2024, Broadcom's revenue reached an impressive $51.6 billion, marking a 44% increase. Semiconductor revenue contributed $30.1 billion, with AI revenue alone soaring 220% to $12.2 billion, driven by its AI XPUs and Ethernet networking portfolio. The integration of VMware significantly boosted infrastructure software revenue to $21.5 billion. The company also notably doubled its AI XPU shipments to hyperscale customers. Despite a significant reliance on Taiwan Semiconductor Manufacturing Company Ltd. (NYSE:TSM) for nearly 95% of its wafers in fiscal 2024, Broadcom maintained a substantial 64% gross margin, showcasing its strong pricing power and market position. Broadcom CEO Hock Tan expressed strong confidence in December last year, stating that the company could generate tens of billions in annual AI chip revenue by 2027, driven by increasing demand from prominent AI developers like OpenAI and xAI. Analysts echo this optimism. JP Morgan's Harlan Sur noted that Broadcom has secured multi-year AI ASIC deals with OpenAI and a fifth major client, estimating a $150 billion AI semiconductor opportunity through 2029. BofA Securities' Vivek Arya believes ASICs could capture 10-15% of the AI accelerator market, supporting Broadcom's growth even as Nvidia retains a significant market share. Price Action: AVGO stock is trading lower by 0.25% to $274.94 premarket at last check Tuesday. Photo by Ken Wolter via Shutterstock UNLOCKED: 5 NEW TRADES EVERY WEEK. Click now to get top trade ideas daily, plus unlimited access to cutting-edge tools and strategies to gain an edge in the markets. Get the latest stock analysis from Benzinga? BROADCOM (AVGO): Free Stock Analysis Report This article Broadcom Outpaced Major Indexes In 2025 - What Went Down originally appeared on © 2025 Benzinga does not provide investment advice. All rights reserved. Error in retrieving data Sign in to access your portfolio Error in retrieving data Error in retrieving data Error in retrieving data Error in retrieving data
Time of India
26-06-2025
- Business
- Time of India
Ericsson to add 150+ R&D roles in Bengaluru to boost chip design for 5G networks
Swedish network equipment maker Ericsson is expanding its research and development (R&D) team in Bengaluru by more than 150 positions to enhance its capabilities in Application-Specific Integrated Circuit (ASIC) development. The R&D expansion in India will serve to enhance Ericsson's portfolio of high-performing programmable networks. The team will work on developing Ericsson Silicon's range of System on Chips (SoC) for use in network technologies to fully leverage 5G and address both current and future needs, the company said in a statement Thursday. 'Expanding our ASIC R&D in India will enable us to leverage the local technology competence in the country towards enhancing our capabilities in semiconductor design. This unit will also contribute towards strengthening the semiconductor ecosystem in the country," said Nitin Bansal, managing director, Ericsson India. The company has multiple R&D sites in India, including in Chennai, Bengaluru, and Gurugram that work across telecom domains spanning Transport, Packet Core, OSS, BSS, Cloud and advanced AI technologies. Ericsson invests $5 billion in R&D annually, it added. It though didn't specify the investments to be made for the latest expansion in India. Live Events "By increasing our focus on ASIC development , we are reinforcing our technological prowess. Our investments in the Ericsson Silicon platform , in particular, will accelerate the launch of new products and innovative features to the market.' said Anna Dicander, Vice President, Radio and Transport Engineering, Ericsson Business Area Networks.
The Star
19-06-2025
- Business
- The Star
HR Ministry to collaborate with Penang govt to develop Penang Chip Design Academy
GEORGE TOWN: Discussions are being finalised for the Human Resources Ministry to work with the Penang state government to develop the upcoming Penang Chip Design Academy. Its minister, Steven Sim said that as the institution intended to develop skilled manpower in the semiconductor and high-tech sectors in Penang, he hoped that the collaboration would add value and upgrade the skill training programmes. "It is a state government project and we are in discussion to finalise the collaboration between the ministry and the academy. "As it specialises in developing the semiconductor and high tech sector in Penang, we wish to add value and collaborate to enhance the skill training programmes," Sim told reporters on Thursday (June 19). Located at the Penang Skills Development Centre (PSDC) building in Bayan Lepas, the academy would support the state's plan for the development of an Integrated Circuit (IC) Design and Digital Park. It is a key component of the Penang STEM Talent Blueprint and would be led by PSDC in collaboration with key industry players, Electronic Design Automation (EDA) tool providers, academia, and InvestPenang. Sim had earlier officiated the northern region National Training Week (NTW) 2025 Learning Tour in Raia Inn in Bayan Lepas here. At the event, Sim said the Human Resource Development (HRD) Corporation and Northern Corridor Implementation Authority (NCIA) have formed a strategic collaboration under the Advanced Technology Meister Programme (ATMP) to introduce the Matching Grant for skills development aimed at helping local industries upskill their workforce in advanced technology sectors. He added that some 420 families of fishermen impacted by the Silicon Island development project would receive training and skills development programmes in fields to expand their career opportunities. The NTW programme themed "Learning Beyond Borders", organised by HRD Corp, had brought together over 600 participants from various segments of the community, including school students, civil servants, community members, persons with disabilities (PWDs), cooperatives, and senior citizens, with the aim of empowering them with practical skills aligned with future workforce demands. To date, it has recorded over 3.2 million enrolments, exceeding its initial target of one million enrolments, with about 167,000 enrolments with almost 800 courses recorded across Penang, Kedah and Perlis in the northern region. NTW 2025 will conclude on Saturday (June 21) with the closing ceremony in Ipoh, Perak.
Business Upturn
12-06-2025
- Business
- Business Upturn
Cyient Semiconductors and MIPS partner to develop RISC-V based custom silicon solutions
By Aman Shukla Published on June 12, 2025, 13:56 IST Cyient Semiconductors Private Limited, a Hyderabad-based custom silicon company, has announced a strategic collaboration with MIPS, a global leader in RISC-V processor IP. This partnership aims to develop domain-optimized ASIC (Application-Specific Integrated Circuit) and ASSP (Application-Specific Standard Product) solutions using the MIPS Atlas portfolio of high-performance, power-efficient processor IP. The collaboration focuses on real-time, safety-critical systems with specific emphasis on motor control and data center power delivery. These platforms will combine Cyient's analog mixed-signal design expertise with MIPS' open RISC-V architecture, enabling custom silicon solutions tailored for automotive, industrial automation, and data center markets. Rising demand for software-defined vehicles, intelligent power systems, and scalable data center infrastructure is accelerating the need for programmable and efficient silicon. The Cyient-MIPS partnership empowers OEMs and system integrators to build differentiated, future-ready products that are cost-optimized and free from proprietary lock-ins. Target applications include motor drive control, intelligent power management, and other safety-critical functions. Offered as both ASICs and ASSPs, the solutions promise faster time-to-market and enhanced design flexibility. By combining MIPS' RISC-V CPU IP with Cyient's custom silicon capabilities, this collaboration is set to deliver innovative, efficient, and scalable semiconductor platforms for next-gen embedded applications. Aman Shukla is a post-graduate in mass communication . A media enthusiast who has a strong hold on communication ,content writing and copy writing. Aman is currently working as journalist at
Time of India
26-05-2025
- Business
- Time of India
Culture, compassion, compute: Satya Nadella on what makes a generational company in the AI age
From April 20 to May 2, the world's most seasoned executives, founders, venture capitalists (VCs), innovators, and technologists converged at the Santa Clara Convention Centre in California for TiEcon 2025. The theme for this year's edition, AiVerse, explored the vast potential of applied artificial intelligence (AI) across 11 tracks ranging from AI in mobility and entertainment to AI in manufacturing, retail and supply chains. The highlight of day two of the annual extravaganza was the grand keynote by Satya Nadella, who expounded on the importance of cultural capital and empathy in times of revolutionary change. The Microsoft honcho was also presented with the Lifetime Achievement Award by TiE Silicon Valley (TiE SV) chairperson Anita Manwani and deemed 'CEO of the decade' by Naveen Chaddha, Managing Partner, Mayfield Fund. Here are some takeaways from Mr Nadella's keynote: On what accounts for institutional strength 'If you're an established company or founding a company, you have to come up with an idea whose time has come. In order to build that new concept, you also need to have a new capability. And in order to build that new capability before it's conventional wisdom, you need culture. Live Events Whether you're a VC, entrepreneur, executive, or an engineer, it's all the same thing. You have a cultural posture that allows you to either skill yourself up or get associated with other people with complementary skills that are needed to build something new that is needed in the world. That framework is how I evaluate where we are as a company, and where we need to go. And it's a harsh thing, because you kind of have to be in this continuous journey of renewal.' Discover the stories of your interest Blockchain 5 Stories Cyber-safety 7 Stories Fintech 9 Stories E-comm 9 Stories ML 8 Stories Edtech 6 Stories On empathy as a critical workplace skill 'If you want to learn it all and not [just] know it all, that is the foundation of a growth mindset. This means you have to have empathy more than anything else, to be able to see through other people's eyes. We think of it as a soft skill for life, but it's also a critical soft skill for innovation. Because, after all, what is innovation if not meeting the unmet, unarticulated needs of customers? You can call this a design mindset or design thinking; but really, it's empathy. It does ultimately come down to us having the ability at scale [after] seeing the world through other people's eyes.' On AI computing being distinct from other technological breakthroughs 'When I came to the Valley in early 1990, it felt like a golden age of systems. We're back at that again. You're adding system software, whether it is what's happening at the ASIC [Application-Specific Integrated Circuit] or chip level, system level, or with model architectures. Who would've thought two years ago that soon enough, it'd be about test times and compute? OpenAI set the pace by their innovation, and we were obviously thrilled to partner with them. But it's also great to see what's happening in open source. You're seeing reasoning models that weren't there even just a year ago. Now they're in all models, weight, and sizes. Just yesterday, we launched five new models with reasoning. I look at my capex budget and say, 'Whoa, what happened there?' Nevertheless, the cooling in data centres is one of the biggest challenges we have. And the point is, it's differential cooling. There's an AI accelerator rack, then there's the rest.' On AI applications in the physical sciences 'There are three broad domains for AI application. One is cognitive and knowledge work. That's our bread and butter. The other is physical: robotics, the autonomous domain, drones, and what have you. The third is science. The way we have been able to deal with this domain is by doing simulations. High performance computing (HPC) was fundamentally born underneath scientific simulation. But it turns out that to simulate nature right on a Von Neumann architecture, you just have approximations. There's no such thing as a perfect simulation. That's why we are very excited about even quantum because ultimately, the quantum computer is the real breakthrough at utility scale when you really think about simulating nature. If you want to discover a new material, AI can help speed up the HPC by coming up with candidates. So we essentially have these models that are derivatives of transformers. You don't have to start without any knowledge. There's a variety of models you can get to on foundry for different domains, biology being the hardest of them all. The rapid progress right now is in computational chemistry and material sciences.'
