Latest news with #SiliconPhotonics
Time of India
03-05-2025
- Business
- Time of India
IIT Madras launches 2 indigenously developed silicon photonics products
New Delhi: The Indian Institute of Technology (IIT) Madras on Saturday launched two indigenously developed silicon photonics products, a first for India. The products designed and developed indigenously at CoE-CPPICS at the IIT Madras can be quickly adopted by the market. "Indigenously developed field deployable silicon photonic-based quantum random number generator (QRNG) module is a pride for India. The product has been delivered to DRDO to help in advanced quantum cryptography," said S. Krishnan, IAS, Secretary, MeitY , while congratulating CoE-CPPICS. The two products launched during the occasion include the Fibre-Array Unit (FAU) attachment tool for Photonic Chip Packaging and the silicon photonic QRNG (Quantum Random Number Generator). The QRNG module will be available commercially for potential customers through the CPPICS spin-off start-up " LightOnChip ". The key applications of QRNG are IT security for military and defence, Cryptographic algorithms, Quantum key distribution (QKD), Scientific Modelling and Simulations, Financial transactions/ Blockchain/ OTP, Gaming Applications, the Insititute said "Silicon Photonics is an emerging technology that will certainly help design much more efficient and complex hardware for the future. I am very happy that the Silicon Photonics CoE-CPPICS Centre at IIT Madras has now come out with demonstrable products that can be quickly adopted by the market. We hope that multiple such products will continue to come in the future," said Prof. V. Kamakoti, Director, IIT Madras. Photonic packaging and assembly are a complex and multi-disciplinary design and manufacturing process. To make a Photonic Integrated Circuits (PIC)-enabled module perform according to specification, sub-micron precision alignment and bonding process are required. At the same time, precise thermal management is required to maintain the thermo-optic stability of the signals. CoE-CPPICS aims to provide better solutions for microwave and quantum photonics applications such as advanced photonic processors to be used in high-performance RF transceivers, scalable linear optical quantum computing processors for the next-generation qubit computation, and chip-level quantum key generation and distribution circuits, etc. CPPICS is actively developing indigenous PIC design rules and hardware infrastructure for precision packaging for system-level applications.
Hans India
03-05-2025
- Business
- Hans India
IIT Madras launches 2 indigenously developed silicon photonics products
New Delhi: The Indian Institute of Technology (IIT) Madras on Saturday launched two indigenously developed silicon photonics products, a first for India. The products designed and developed indigenously at CoE-CPPICS at the IIT Madras can be quickly adopted by the market. 'Indigenously developed field deployable silicon photonic-based quantum random number generator (QRNG) module is a pride for India. The product has been delivered to DRDO to help in advanced quantum cryptography,' said S. Krishnan, IAS, Secretary, MeitY, while congratulating CoE-CPPICS. The two products launched during the occasion include the Fibre-Array Unit (FAU) attachment tool for Photonic Chip Packaging and the silicon photonic QRNG (Quantum Random Number Generator). The QRNG module will be available commercially for potential customers through the CPPICS spin-off start-up 'LightOnChip'. The key applications of QRNG are IT security for military and defence, Cryptographic algorithms, Quantum key distribution (QKD), Scientific Modelling and Simulations, Financial transactions/ Blockchain/ OTP, Gaming Applications, the Insititute said 'Silicon Photonics is an emerging technology that will certainly help design much more efficient and complex hardware for the future. I am very happy that the Silicon Photonics CoE-CPPICS Centre at IIT Madras has now come out with demonstrable products that can be quickly adopted by the market. We hope that multiple such products will continue to come in the future,' said Prof. V. Kamakoti, Director, IIT Madras. Photonic packaging and assembly are a complex and multi-disciplinary design and manufacturing process. To make a Photonic Integrated Circuits (PIC)-enabled module perform according to specification, sub-micron precision alignment and bonding process are required. At the same time, precise thermal management is required to maintain the thermo-optic stability of the signals. CoE-CPPICS aims to provide better solutions for microwave and quantum photonics applications such as advanced photonic processors to be used in high-performance RF transceivers, scalable linear optical quantum computing processors for the next-generation qubit computation, and chip-level quantum key generation and distribution circuits, etc. CPPICS is actively developing indigenous PIC design rules and hardware infrastructure for precision packaging for system-level applications.
Globe and Mail
01-04-2025
- Business
- Globe and Mail
CIG Showcasing the Latest End-to-End Connectivity Solutions at OFC 2025
Cambridge Industries Group (CIG), a global leader in optical communication and networking solutions, is excited to showcase its latest end-to-end connectivity technologies at the Optical Fiber Communication Conference and Exhibition (OFC) 2025, taking place March 30 – April 3 in San Francisco, California. Attendees are invited to visit CIG booth #2518 to explore cutting-edge innovations designed to optimize network efficiency, scalability, and performance. Next-Generation High-Speed Optical Transceivers CIG will unveil its latest high-speed optical transceiver solutions, including: A new 200G/Lambda portfolio, powered by the latest 3nm DSP technology, achieving 20% power reduction. The lineup includes Retimed 1.6T 2×DR4/DR8, 1.6T 2×FR4, and Gearbox 800G DR4 modules, offered in both Silicon Photonics and EML-based designs. Comprehensive 100G/Lambda 800G and 400G portfolio, featuring advanced 5nm DSP-based 800G modules such as 2×DR4/DR8, 2×FR4, and 2×LR4 (10km), in OSFP IHS / OSFP RHS / QSFP-DD form factors, as well as 400G QSFP112 DR4 modules, all available in Silicon Photonics and EML designs. Additional features, including 800G and 400G InfiniBand modules, 800G LPO (Linear Pluggable Optics) and 800G LRO (Linear Receive Optics) modules, further expanding CIG's support for next-generation data center and high-performance computing environments. Next-Gen Access and Edge Connectivity CIG will also feature its carrier-grade 25G PON units and the latest Wi-Fi 7-powered home routers, delivering seamless, high-capacity data transmission across both telecom and hyperscale networks. These solutions are designed to meet the increasing demand for ultra-fast, reliable connectivity, and support evolving infrastructure needs in AI-driven networking, cloud computing, broadband access, and 5G deployment. Live Demos & Industry Engagement CIG will host live demonstrations of its latest technologies, including: 1.6T and 800G 200G/Lambda transceivers 800G and 400G InfiniBand NDR 800G LPO and LRO modules All 800G modules interoperability over MTP CMIS 5.3 compliant features with VDM (Versatile Diagnostic Monitoring) 25G PON ONTs (joint demo with a 25G PON OLT vendor) These will be complemented by expert-led discussions on industry trends and CIG's technology roadmap. Company specialists will be available to engage in technical conversations and explore how CIG's innovations address the challenges of today's rapidly evolving digital landscape. Executive Quote 'We're excited to participate in OFC 2025 and introduce our latest breakthroughs in optical networking technology,' said Mr. Gerald Wong, CEO of CIG. 'Our end-to-end connectivity solutions empower businesses to optimize network performance while maintaining cost-efficiency and scalability. We look forward to engaging with industry leaders, partners, and customers as we continue driving innovation forward.' Learn More To schedule a meeting with CIG at OFC 2025 or for more information, visit or contact press@ About CIG Founded in 2005, Cambridge Industries Group (CIG) is a global technology leader with affiliates in the United States, China, Japan, Malaysia, and Europe. With a unique combination of industry-leading R&D and advanced manufacturing, CIG delivers millions of high-performance devices annually and provides exceptional customer service worldwide. CIG's broad portfolio includes high-speed optical transceivers, wireless and broadband access, carrier Ethernet, and edge computing—enabling next-generation telecom and data center networks.
