Union Cabinet approves 2 semiconductor projects worth Rs 4,009cr for Odisha
The two manufacturing units will be built by SiCSem and 3D Glass. Given the growing demand for semiconductors in telecom, automotive, data centres, consumer electronics and industrial electronics, the newly approved projects will significantly contribute to creating an '
Atmanirbhar Bharat
', official sources said.
Thanking Prime Minister Narendra Modi for the Cabinet's approval, chief minister Mohan Majhi said in an X post, "The recent amendment of the Odisha Semiconductor Manufacturing and Fabless Policy, aimed at enhancing investment viability, competitiveness, and sustainability, together with this significant Cabinet approval, marks a major milestone in the state's industrial and technological advancement.
I look forward to continued partnership between the state and central govts to further this strategic initiative for the comprehensive development of Odisha and the nation."
SiCSem Pvt Ltd, in collaboration with UK-based Clas-SiC Wafer Fab Ltd, will set up India's first commercial compound semiconductor fabrication facility here. The plant will manufacture silicon carbide (SiC) devices, known for their efficiency in high-power applications, with an annual capacity of 60,000 wafers and 96 million packaged units.
The SiC devices will have applications across critical sectors, including missiles, defence equipment, electric vehicles (EVs), railway, fast chargers, data centre racks, consumer appliances and solar power inverters.
The facility is expected to give India a strategic edge in producing next-generation power electronics domestically.
The second project, by US-headquartered 3D Glass Solutions Inc (3DGS), will introduce the world's most advanced semiconductor packaging technology.
The unit will manufacture glass interposers, silicon bridges and 3D heterogeneous integration (3DHI) modules. The component are crucial for miniaturisation, high performance and energy efficiency in electronics. With a planned capacity of about 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules annually, the facility will cater to applications in defence, high-performance computing, artificial intelligence, RF and automotive electronics, photonics and co-packaged optics.
Officials said the two projects will not only bring cutting-edge technology to Odisha but also create a ripple effect in the state's electronics ecosystem, encouraging ancillary industries and boosting technical skill development.
Apart from two Odisha projects, the Cabinet also approved one project each for Punjab and Andhra Pradesh under the India Semiconductor Mission (ISM).
Union education minister Dharmendra Pradhan hailed the Cabinet's decision to set up the two units in Odisha. He said the decision is a pivotal moment for the state, emphasising its potential to create jobs and generate substantial revenue. Pradhan expressed his gratitude to the PM and highlighted that this move marks a new chapter in the 'Purvodaya' mission.
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