Centre approves SiCSem, CDIL, 3DGS, ASIP Technologies' semicon proposals worth ₹4,600 crore
SiCSem
, Continental Device India Limited (
CDIL
),
3D Glass Solutions
(3DGS), and Advanced System in Package (ASIP) Technologies, worth ₹4,600 crore.
The Ministry of Electronics and IT (MeitY), in an official statement, said that the four facilities are expected to generate a cumulative employment of 2,034 skilled professionals, which would catalyse the electronic manufacturing ecosystem, resulting in the creation of many indirect jobs.
With these four approvals today, the total approved projects under the
India Semiconductor Mission
(ISM) have reached 10 with cumulative investments of around ₹1.60 lakh crore in six states.
SiCSem and 3D Glass will set up facilities in Odisha, while CDIL will expand its existing facility in Mohali, Punjab, and ASIP will establish its unit in Andhra Pradesh.
SicSem is collaborating with British firm Clas-SiC Wafer Fab to establish integrated facility of Silicon Carbide (SiC) based
Compound Semiconductors
in Info Valley, Bhubaneshwar, Odisha. This will be the first commercial compound fab in the country. The project proposes to manufacture Silicon Carbide devices. This compound semiconductor fab will have an annual capacity of 60,000 wafers and packaging capacity of 96 million units.
3D Glass Solutions will be setting up a vertically integrated advanced packaging and embedded glass substrate unit in Info Valley, Bhubaneshwar, Odisha. This unit will bring the world's most advanced packaging technology to India. The planned capacity of this unit will be approximately 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules per annum.
ASIP will set up a
semiconductor manufacturing
unit in Andhra Pradesh, under a technology tie-up with South Korean APACT with an annual capacity of 96 million units.
CDIL, meanwhile, will expand its discrete semiconductor manufacturing facility at Mohali, Punjab. The proposed facility will manufacture high-power discrete semiconductor devices such as MOSFETs, IGBTs, Schottky Bypass Diodes, and transistors, both in Silicon and Silicon Carbide. The annual capacity of this brownfield expansion will be about 158.38 million units.
CDIL, which has adopted an asset-light business model in recent years by outsourcing foundry, was aiming to boost its capacity by 100 million units to 600 million units annually by adding new lines with the incentive received under the SPECS scheme,
ETTelecom reported in June 2024
.
'We were one of the first companies to apply in the SPECS scheme and we are one of the first companies to get the refund which has been sanctioned. It has been put and the line was inaugurated,' Prithvideep Singh, GM of CDIL, had told ETTelecom, adding that the company had a utilisation rate of over 90% then.
Given the growing demand for semiconductors in telecom, automotive, data centres, consumer electronics and industrial electronics, these four new approved semiconductor projects would significantly contribute to making
"Atmanirbhar Bharat"
(self-reliant India), the IT ministry said.
'With the approval of these projects, semiconductor ecosystem in country would get significant boost as these projects include country's first commercial compound fab as well as highly advanced glass-based substrate semiconductor packaging unit,' MeitY said.
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