Latest news with #Exynos2600
GSM Arena
13 hours ago
- GSM Arena
Samsung Galaxy S26 Ultra to ship with Snapdragon 8 Elite 2 and One UI 8.5
Leaked firmware files reveal that the Galaxy S26 Ultra will likely launch with the Snapdragon 8 Elite's successor next year and will ship with One UI 8.5 based on Android 16 out of the box. This appears to be in line with a recent report by Ice Universe revealing a shift in Samsung's software update strategy that gives the foldables the latest One UI iteration and polishing it for the Galaxy S series. The firmware file has been found on Samsung's server, which means the tech giant is already working on developing One UI 8.5 for its future S26 lineup. The firmware reads PMK8850 serial number, which likely refers to Qualcomm's next-generation flagship chipset. Given that the S25 Ultra ships with Snapdragon 8 Elite, also referred to as 8750 in its own firmware, it's probably safe to assume that the S26 Ultra will continue to use Qualcomm's chip. That doesn't mean all three Galaxy S phones will be powered by the Snapdragon, though. The S26+ and the vanilla S26 will likely feature the company's upcoming Exynos 2600 SoC, which promises solid CPU and GPU performance. Also, another recent report claims that Samsung has found a way to keep the Exynos 2600 cooler. Source 1 | Source 2
Android Authority
a day ago
- Android Authority
Galaxy S26 Ultra's chipset info spotted in One UI code, and it's not surprising
Joe Maring / Android Authority TL;DR A new report has confirmed that Samsung will continue to rely on Qualcomm for its next Ultra smartphone. The Galaxy S26 Ultra is confirmed to be powered by a Snapdragon 8 Elite 2, based on evidence found in the device's firmware. This does not rule out the existence of an S26 Ultra powered by an Exynos 2600 or a Samsung-made Snapdragon 8 Elite 2, despite lean chances of any of that happening. Phone brands these days don't do a very good job of containing confidential information about upcoming devices. Samsung isn't immune to this problem either, and many tidbits of its yet-to-release Galaxy S26 series are already public knowledge. Earlier today, we learned about internal codenames for the upcoming Galaxy S26 devices that indicate the likelihood of a lineup rejig. Now, a new leak has confirmed the chipset (or at least, one of the chipsets) that will power the Galaxy S26 Ultra. Folks at SamMobile claim to have gotten access to the One UI firmware that will come preinstalled on the Galaxy S26 Ultra. From the firmware file, the team has deciphered the presence of a Qualcomm Snapdragon chipset at the helm. This chipset is most likely a Snapdragon 8 Elite 2, as suggested by the mentions of 'qcom' and 'PMK8850' in the source code. The Snapdragon 8 Elite 2 has long been rumored to be associated with an identifier 'SM8850,' which is especially plausible since the Snapdragon 8 Elite is codenamed 'SM8750.' However, the use of 'PMK' in the codename could highlight the special 'For Galaxy' variant of the Snapdragon 8 Elite 2. While Samsung's choice of chipset was already expected, the evidence from One UI's code corroborates the assumption. However, it does not rule out the presence of an Exynos 2600-powered Galaxy S6 Ultra — even without ample historical evidence to support it. Notably, Samsung hasn't entirely relinquished the Exynos 2600, and its decision to equip the Galaxy Flip 7 with an Exynos 2500 globally backs the possibility of the newer Exynos powering more flagship devices next year. Another recent report spoke of Samsung's plans to address the longstanding problem of heating on Exynos chips by reconfiguring the design. Additionally, speculations from earlier this month have indicated that Samsung will use a variant of the Snapdragon 8 Elite 2 manufactured by TSMC for its Galaxy S26. However, it is also developing a cheaper variant of the Snapdragon 8 Elite 2 on a smaller 2nm fab, but could reserve its stocks for selling to other vendors like Xiaomi, OnePlus, and other Chinese manufacturers that aim for more competitive prices for their smartphones. Meanwhile, the Galaxy S26 Ultra is shaping up to be Samsung's most upgraded phone in recent years, which is every bit new compared to the Galaxy S25 Ultra, except in terms of its battery capacity. Follow
GSM Arena
a day ago
- GSM Arena
Samsung may have developed a way to keep the Exynos 2600 cooler
This week we've seen the Exynos 2600 post impressive results on Geekbench and 3DMark. Reports from Korea claim that Samsung has developed a cool new trick for this chip – a Heat Pass Block (HPB) that promises to cool the application processor (AP) better than previous approaches. A 'chipset' is just that – several chips, usually arranged in a package-on-package structure, which places the RAM on top of the application processor (this is the silicon die that holds the CPU, GPU, NPU and other components). The Heat Pass Block adds another layer to that stack – a copper heat sink. This is similar to the heat spreaders that are typical in modern designs. Heat spreaders, however, are added after the package-on-package structure has been assembled. The advantage of the HPB is that it is much closer to the source of the heat, which should allow it to pull heat away more efficiently. An example of package-on-package stacking, without an HPB The Exynos 2600 will be fabbed on Samsung's 2nm Gate-All-Around (GAA) process and is expected to ship with the Galaxy S26 series. We wouldn't be surprised to see a Snapdragon chip in some or all Galaxy S26 Ultras. However, whether the other S26 models get the Z Flip7 treatment (Exynos in all markets) or whether chip selection varies by market remains to be seen. Samsung is expected to complete quality testing of the Exynos 2600 and should officially unveil the chip around the same time. The Galaxy S26 series should be out in late January or early February. Source (in Korean)
Android Authority
a day ago
- Android Authority
Exynos-powered Galaxy S26 phones might not be a hot mess thanks to this addition
C. Scott Brown / Android Authority TL;DR Samsung will reportedly add a 'heat pass block' to the Exynos 2600 processor. This component should act as a heat sink and reduce the chip's temperature. This comes amid speculation and rumors about the Galaxy S26's chip choice. The Galaxy S25 series is exclusively powered by Snapdragon silicon. However, Samsung really wants the Exynos 2600 processor in some Galaxy S26 series phones. A new report has now revealed how Samsung could address a potential shortcoming with this new chipset. ET News reports that Samsung plans to add a 'heat pass block' (HPB) to the Exynos 2600. The outlet reports that this part acts as a heat sink to reduce chip temperatures more effectively. The outlet adds that Samsung previously placed DRAM on top of its Exynos chip. This time, the DRAM and heat pass block will sit side by side, and both will be placed on top of the Exynos chip. Check out the machine-translated screenshot below, courtesy of ET News. This addition suggests that Samsung anticipates the need for additional cooling in the Exynos 2600. It's also possible that Samsung is taking a proactive measure to offer a cooler chip but doesn't anticipate major heating concerns in the first place. Then again, a component like this does add to production costs, so it stands to reason that the company wouldn't add this part if it didn't think it was needed. This news also comes as Qualcomm and MediaTek offer ever-increasing CPU clock speeds. The Snapdragon 8 Elite for Galaxy tops out at 4.47GHz while the Dimensity 9400 Plus CPU has a peak speed of 3.73GHz. So Samsung would likely need additional cooling to reliably reach similar heights. Excess heat can result in poor stability under sustained workloads (e.g., long gaming sessions), a physically hot device, and additional strain on the battery. Therefore, we are crossing our fingers that this heat pass block does the job if Samsung uses the Exynos 2600 in some Galaxy S26 models. Got a tip? Talk to us! Email our staff at Email our staff at news@ . You can stay anonymous or get credit for the info, it's your choice. Follow
Phone Arena
a day ago
- Phone Arena
Exynos 2600 could fix Samsung's biggest chip problem
Power efficiency and heat management are super important (if not, the most important) aspects of chip design. Samsung's own Exynos processors are unfortunately known for their poor efficiency and heat management when compared with Qualcomm's. However, a new report from South Korea indicates that Samsung is trying new technologies to work on its upcoming in-house chips and to improve heat management. The Exynos 2600 processor, which is expected to be used in some Galaxy S26 versions, reportedly sports a newer thermal management tech. Samsung is said to use a new chip packaging technology, which should improve the performance of the Exynos 2600 chip. The company may reportedly use Heat Pass Block (otherwise known as HPB), a way of inserting heat-dissipating materials inside the semiconductor chip package. The Exynos 2600 is said to be a 2nm chip designed by Samsung and fabricated using Samsung Foundry. It would be the first chip by the company to use HPB. HPB is a copper-based heat sink that is placed on top of the application processor and DRAM component. Image Credit - Samsung This heat sink is intended to absorb the heat that is generated by the CPU, GPU, RAM, and other components found in smartphone SoCs. Samsung is expected to finish testing the Exynos 2600 by October of this year. If it gets favorable results, the mass production of the processor will soon follow, with the intention of it to power some of the Galaxy S26 phones, expected for an early 2026 launch. The Galaxy S26 Ultra may be the only phone sporting exclusively the Snapdragon 8 Elite Gen 2, which is a processor made by Qualcomm. In the past few years, Samsung has been trying new chip packaging methods for Exynos chips, looking for a way to improve their performance and have them more on par with Qualcomm's counterparts. For example, the Exynos 2400 used the Fan-Out Wafer Level Packaging (FOWLP) technology, which had both the input and output terminals outside the semiconductor chip, which offered better heat dissipation. The Exynos 2600 is also said to use FOWLP. I personally think this is a smart move by Samsung. If they can really improve heat management and efficiency, that could make Exynos chips much more competitive. A cooler phone means better performance and longer battery life – things everyone wants. It's good to see Samsung learning from past mistakes and trying new tech like HPB and FOWLP. If testing goes well, the Galaxy S26 with the Exynos 2600 might surprise us in a good way.
